• Title/Summary/Keyword: contact barrier

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A Study on the Selectively Block Barrier for Prevent the Spread of TPH and Phenol in the Ground (지중 내 TPH, Phenol의 확산방지를 위한 선택적 차수재 제조에 관한 연구)

  • HoJin Lim;WooRi Cho;SeungJin Oh;SuHee Kim;JaiYoung Lee
    • Journal of the Korean Geosynthetics Society
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    • v.23 no.1
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    • pp.1-7
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    • 2024
  • In this study, a selecvively block barrier was developed to prevent the spread of contaminants (TPH, Phenol) in the ground only when contamination occurs. The materials were used Jumunjin sand, bentonite, polyolefin elastomer and spill hound marine. First, the properties and environmental hazards characteristics of materials were analyzed for evaluated their usability. Then, the possibility of use as a barrier material was confirmed by analyzing the water permeability characteristics that change after 24 hours of contact with contaminants. As a result of the analysis, the pH of each component was similar to the general groundwater pH range. In addition, the toxicity characteristics and the possibility of dissolution of hazardous substances, it was determined that there was no environmental hazard as the content was below the regulation value. Lastly, when comparing the permeability coefficient before and after contact with the contaminant, the permeability coefficient of approximately α × 10-3cm/sec before contact was reduced to α × 10-6cm/sec after contact with the contaminant.

Characterization of Reverse Leakage Current Mechanism of Shallow Junction and Extraction of Silicidation Induced Schottky Contact Area for 0.15 ${\mu}{\textrm}{m}$ CMOS Technology Utilizing Cobalt Silicide (코발트 실리사이드 접합을 사용하는 0.15${\mu}{\textrm}{m}$ CMOS Technology에서 얕은 접합에서의 누설 전류 특성 분석과 실리사이드에 의해 발생된 Schottky Contact 면적의 유도)

  • 강근구;장명준;이원창;이희덕
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.39 no.10
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    • pp.25-34
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    • 2002
  • In this paper, silicidation induced Schottky contact area was obtained using the current voltage(I-V) characteristics of shallow cobalt silicided p+-n and n+-p junctions. In reverse bias region, Poole-Frenkel barrier lowering influenced predominantly the reverse leakage current, masking thereby the effect of Schottky contact formation. However, Schottky contact was conclusively shown to be the root cause of the modified I-V behavior of n+-p junction in the forward bias region. The increase of leakage current in silicided n+-p diodes is consistent with the formation of Schottky contact via cobalt slicide penetrating into the p-substrate or near to the junction area and generating trap sites. The increase of reverse leakage current is proven to be attributed to the penetration of silicide into depletion region in case of the perimeter intensive n+-p junction. In case of the area intensive n+-p junction, the silicide penetrated near to the depletion region. There is no formation of Schottky contact in case of the p+-n junction where no increase in the leakage current is monitored. The Schottky contact amounting to less than 0.01% of the total junction was extracted by simultaneous characterization of forward and reverse characteristics of silicided n+-p diode.

Analysis on Metal Contact Resistance and Grain Boundary Barrier Height of Ceramic PTC Thermistor (Ceramic PTC thermistor의 금속접촉저항과 입계전위장벽)

  • Jeon, Yong-Woo;Lim, Byung-Jae;Hong, Sang-Jin;Soh, Dea-Wha
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.235-236
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    • 2006
  • The contact resistance and grain boundary potential barrier of ceramic $BaTiO_3$ PTCR were investigated. The electroless plated Ni, evaporated Al, and Ag paste were chosen as electrode materials of PTCR device for comparison analysis before and after heat treatment. The contact resistance of electrode were measured by electrometer (dc), digital multimeter (dc), and LCR meter (ac). In the case of Al electroded samples, the heat treatment and protective oxide layer had high resistance and effect on the stability of PTCR effect against contact resistance degradation, but the Ag-paste had comparably high contact resistance before heat treatment and decreased after heat treatment with safe. On the other hand, the samples with electroless plated Ni electrode had good properties of contact resistance against aging.

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Fabrication and Characterization of ZnO Schottky Diode Using Sol-Gel Process (Sol-Gel 공정을 이용한 ZnO 쇼트키 다이오드의 제작 및 특성평가)

  • Lee, Deuk-Hee;Kim, Kyoung-Won;Park, Ki-Ho;Kim, Sang-Sig;Lee, Sang-Yeol
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.390-390
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    • 2010
  • We fabricate Schottky diodes with the contact between a sol-gel derived ZnO layer and Au that guarantees the expected Schottky contact due to the high work function. The formed single metal Schottky barrier shows characteristics comparable to the barrier formed by alloys. Au is deposited by thermal evaporation on a ZnO thin film that is optimally formed under sol-gel process conditions of a 1-mol zinc acetate concentration and a 3000-rpm coating speed. Possible defects. which can provide deleterious current paths. are minimized by patterning the deposited Au. The I-V curve verifies the formation of a Schottky contact. Measurements showed that the Schottky barrier height and leakage current at -5 V were 0.6 eV and $1{\times}10^{-12}A$. respectively.

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Diffusion Currents in the Amorphous Structure of Zinc Tin Oxide and Crystallinity-Dependent Electrical Characteristics

  • Oh, Teresa
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.4
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    • pp.225-228
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    • 2017
  • In this study, zinc tin oxide (ZTO) films were prepared on indium tin oxide (ITO) glasses and annealed at different temperatures under vacuum to investigate the correlation between the Ohmic/Schottky contacts, electrical properties, and bonding structures with respect to the annealing temperatures. The ZTO film annealed at $150^{\circ}C$ exhibited an amorphous structure because of the electron-hole recombination effect, and the current of the ZTO film annealed at $150^{\circ}C$ was less than that of the other films because of the potential barrier effect at the Schottky contact. The drift current as charge carriers was similar to the leakage current in a transparent thin-film device, but the diffusion current related to the Schottky barrier leads to the decrease in the leakage current. The direction of the diffusion current was opposite to that of the drift current resulting in a two-fold enhancement of the cut-off effect of leakage drift current due to the diffusion current, and improved performance of the device with the Schottky barrier. Hence, the thin film with an amorphous structure easily becomes a Schottky contact.

Analysis of Electrical Properties of Ti/Pt/Au Schottky Contacts on (n)GaAs Formed by Electron Beam Deposition and RF Sputtering

  • Sehgal, B-K;Balakrishnan, V-R;R Gulati;Tewari, S-P
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.1
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    • pp.1-12
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    • 2003
  • This paper describes a study on the abnormal behavior of the electrical characteristics of the (n)GaAs/Ti/Pt/Au Schottky contacts prepared by the two techniques of electron beam deposition and rf sputtering and after an annealing treatment. The samples were characterized by I-V and C-V measurements carried out over the temperature range of 150 - 350 K both in the as prepared state and after a 300 C, 30 min. anneal step. The variation of ideality factor with forward bias, the variation of ideality factor and barrier height with temperature and the difference between the capacitance barrier and current barrier show the presence of a thin interfacial oxide layer along with barrier height inhomogenieties at the metal/semiconductor interface. This barrier height inhomogeneity model also explains the lower barrier height for the sputtered samples to be due to the presence of low barrier height patches produced because of high plasma energy. After the annealing step the contacts prepared by electron beam have the highest typical current barrier height of 0.85 eV and capacitance barrier height of 0.86 eV whereas those prepared by sputtering (at the highest power studied) have the lowest typical current barrier height of 0.67 eV and capacitance barrier height of 0.78 eV.

Errects of $SiH_4/WF_6$Ratio on the Electrical Properties of LPCVD W Films for Contact Metal (Contact Barrier metal용 LPCVD W막의 전기적 특성에 대한 $SiH_4/WF_6$비의 효과)

  • Lee, Jong-Mu;Park, Won-Gu;Im, Yeong-Jin;Son, Jae-Hyeon;Kim, Hyeong-Jun
    • Korean Journal of Materials Research
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    • v.3 no.6
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    • pp.661-667
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    • 1993
  • Effects of $SiH_4//WF_6$(=R) ratio on the electrical properties of W films such as resistvity, contact resistance, junction leakage current in the selective W CVD technology for contact barrier metal were investigated with the emphasis on the role of $\alpha$-W Resistivity of W increases with increasing R, which is primarily due to the phase transformation from $\alpha$-W to , $\alpha$-W. $\alpha$-W found in the SiH4 reduced CVD W film is stabilized by Si incorporated into the W film rather than by oxygen. $\alpha$-W is found in the W film deposited on the Si substrate for high R, while $\alpha$-W is not found in the W film deposited on the TiN substrate even for high R. Also junction leakages increase with increasing R, which is caused not only by the vertical Si consumption but also the lateral Si consumption.

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고효율 저가형 결정질 실리콘 태양전지에 적용될 Ni/Cu 전극 및 Ni silicide 형성에 대한 연구

  • Kim, Min-Jeong;Lee, Su-Hong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.260-260
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    • 2009
  • In high-efficiency crystalline silicon solar cell, If high-efficiency solar cells are to be commercialized, It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper are applied widely in various electronic manufactures as easily formation is available by plating. Ni is shown to be a suitable barrier to Cu diffusin as well as desirable contact metal to silicon. Nickel monosilicide has been suggested as a suitable silicide due to its lower resistivitym lower sintering temperature and lower layer stress than $TiSi_2$. In this paper, Nickel as a seed layer and diffusion barrier is plated by electroless plating to make nickel monosilicide.

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Effect of Insamyangyoung-tang on the Skin Barrier Function of Hairless Mice

  • Nam, Hae-Jeong;Kim, Yoon-Bum
    • The Journal of Korean Medicine
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    • v.28 no.4
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    • pp.18-26
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    • 2007
  • Objective : To study the effect of the Insamyangyoung-tang(ISYT) extract on the skin barrier function, the skin pH, skin humidity and transepidermal water loss(TEWL) were measured and histological changes were observed in DNCB(2,4-dinitrochloro-benzen)-induced contact dermatitis(CD) hairless mice. Methods : The male hairless mice were divided into three groups. Each group consisted of 15 mice. The normal group which had acetone- olive oil applied. The control group which had intentionally induced CD by DNCB and it was fed normal saline orally. The ISYT group which had intentionally induced CD by DNCB and it was fed ISYT extract orally for 7 days. The three groups were checked 24h, 48h and 72h later after inducing CD, and the skin pH, skin humidity and TEWL were observed. Tissue samples were taken, and damage to the epithelial cell was observed. Statistical analysis was performed by using one way-ANOVA: significance was set at p values less than 5% (p<0.05). Results : ISYTextract efficiently maintained the pH balance, it kept the skin humidity at a normal level, and it inhibited TEWL of the DNCB-induced CD hairless mouse. The damage to the epithelium was decreased and the regeneration power of the skin was increased in the ISYT group. Conclusion : Insamyangyoung-tang has a good effect on the skin barrier function of DNCB induced contact dermatitis hairless mice.

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