• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.96-102
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• 2000

The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

• Journal of Institute of Convergence Technology
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• v.6 no.2
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• pp.1-7
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• 2016

The rotating electrodynamic wheels can produce three-axial forces on the conductive target. The forces are linked strongly each other, and their magnitudes depend on the rotating speed of the wheel. However, the wheels can be used effectively as an actuating principle for transfer system of conductive material. The conductive material is a pipe with a constant cross-section or a conductive plate. In this paper, a few applications using the electrodynamic wheels as transferring means are introduced including the full description of the real hardware implementation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.813-820
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• 2015

We have studied commercialization and process optimization of protective film on transparent conductive coated substrate, nano silver on flexible PET (poly ethylene terephthalate), by means of roll-to-roll micro-gravure coater. Nanosilver on flexible PET substrate is potential materials to replace ITO (indium tin oxide). Protective film is most important to maintain unique silver pattern on top of transparent PET. PSA pressure sensitive adhesives) was developed solely for nano silver on PET and protective film was successfully laminated. We have optimized all process conditions such as coating thickness, line speed and aging time & temperature via experimental design. Transparent conductive film and its protective film developed in this research are commercially available at this moment.

• Journal of IKEEE
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• v.22 no.1
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• pp.193-196
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• 2018

In this study, we investigated the reliability of anisotropic conductive paste (ACP) and anisotropic conductive films (ACF), which are anisotropic conductive adhesives, applied to automotive touch panels. Adhesive material is also important as a key factor in assembling the touch panel. In order to measure the resistance change of the parts in two kinds of high temperature test, the reliability of the two types of anisotropic conductive adhesives was compared and evaluated through the results of the resistance change. For 615 hours of reliability testing, the anisotropic conductive film exhibited a higher stability in a high temperature environment than the anisotropic conductive paste.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.8 s.251
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• pp.949-956
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• 2006

The method of Greenwood and Williamson is extended to obtain a solution to the coupled non-linear problem of steady-state electrical and thermal conduction across a crack in a conductive layer, for which the electrical resistivity and thermal conductivity are functions of temperature. The problem can be decomposed into the solution of a pair of non-linear algebraic equations involving boundary values and material properties. The new mixed-boundary value problem given from the thermal and electrical boundary conditions for the crack in the conductive layer is reduced in order to solve a singular integral equation of the first kind, the solution of which can be expressed in terms of the product of a series of the Chebyshev polynomials and their weight function. The non-existence of the solution for an infinite conductor in electrical and thermal conduction is shown. Numerical results are given showing the temperature field around the crack.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1105-1107
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• 1999

The purpose of termination for high voltage tests of XLPE power cable is to prevent flashover during the breakdown test of specimen as well as to withstand the specified voltage between its conductor and screen without failure. For easier treatment and simpler construction of testing termination, resistivity grading method using semi-conductive material was employed. Based on the fundamental theory, its failure characteristics by changing the resistivity of semi-conductive material on the insulation surface was investigated. With two layers construction by difference resistivity on their surfaces, much improved result than that of one resistivity was obtained through the experiment for MV cable.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.417-417
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• 2009

Although a transparent conductive film (TCF) belongs to essential supporting materials for many device applications such as touch screens, flat panel displays, and sensors, a conventional transparent conductive material, indium-tin oxide (ITO), suffers from considerable drawback because the price of indium has soared since 2001. Despite a recent falloff, a demand of ITO is expected to increase sharply in the future due to the trend of flat panel display technologies toward flexible, paper-like features. There have been recently extensive studies to replace ITO with new materials, in particular, carbon nanotubes (CNTs) since CNTs possess excellent properties such as flexibility, electrical conductivity, optical transparency, mechanical strength, etc., which are prerequisite to TCFs. This study fabricated TCFs with single-walled carbon nanotubes (SWCNTs) produced by arc discharge. The SWCNTs were dispersed in water with a surfactant of sodium dodecyl benzene sulfonate (NaDDBS) under sonication. Carbon black and fullerene nanoparticles were added to the SWCNT-dispersed solution to enhance contact resistance between CNTs. TCFs were manufactured by a filtration and transfer method. TCFs added with carbon black and fullerene nanoparticles were characterized by scanning electron microscopy (SEM), UV-vis spectroscopy (optical transmittance), and four-point probe measurement (sheet resistance).

• Journal of the Korean GEO-environmental Society
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• v.24 no.1
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• pp.15-23
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• 2023

The grouting method is a method of construction for the purpose of waterproofing and reinforcing soft ground. When grout is injected into the ground, there are various types of penetration and diffusion of grout depending on the shape of the ground, the size of soil, the porosity, and the presence or absence of groundwater. the current situation. Therefore, in this study, to investigate the penetration performance of the grouting to conductive material, laboratory tests were performed on the addition of the conductive material. In the injection test, 0%, 3%, and 5% of the mixed water were added as conductive materials to the grout, and the original ground condition was composed of various types of ground composed of gravel and silica sand. Conductive grout is injected by pressure into the model ground using a dedicated injection device, and the injection time (t), pressure (p), flow rate (v) and injection amount (q) are measured, and the hardened body injected in the model ground is collected. Penetration performance was evaluated. In the results of the grout injection experiment, the amount of conductive material used and the grout injection rate showed an inverse relationship, and it was confirmed that the penetration pattern was changed according to the size of the soil particles in the model ground. The grout containing the conductive material has relatively good penetration into the ground and excellent strength and durability of the hardened body, so it was judged that it could be used as an additive for measuring the penetration range of the grout.

• Applied Chemistry for Engineering
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• v.21 no.2
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• pp.115-128
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• 2010

Recently the use heat sink material grows where the polymer filled with thermal conductive fillers effectively dissipates heat generated from electronic components. Therefore the management of heat is directly related to the lifetime of electronic devices. For the purpose of improving thermal conductivity of composites, fillers with excellent thermaly conductive behavior are commonly used. Polymer composites filled with thermally conductive particles have advantages due to their processibility, cheap price, and durability to the corrosion. This paper aims to review the thermal interface materials and their model equations for predicting the thermal conductivity of polymer composites, and to introduce the commercial thermal conductive fillers and their applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.