• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.649-650
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• 2011

• Advanced Composite Materials
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• 제17권3호
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• pp.259-275
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• 2008

This study aims to optimize the mechanical and electrical properties of electrically conductive polymer composites (CPCs) for use as a material of bipolar plates for PEM fuel cells. The thin CPCs consisting of conductive fillers and polymer resin were fabricated by a preform molding technique. Expanded graphite (EG), flake-type graphite (FG) and carbon fiber (CF) were used as conductive fillers. This study tested two types of CPCs, EG/FG filled CPCs and EG/CF filled CPCs, to optimize the material properties. First, the characteristics of EG/FG filled CPCs were investigated according to the FG ratio for 7 and $100{\mu}m$ sized FG. CPCs using $100{\mu}m$ FG showed optimal material properties at 60 wt% FG ratio, which were an electrical conductivity of 390 S/cm and flexural strength of 51 MPa. The particle size was an important parameter to change the mechanical and electrical behaviors. The flexural strength was sensitive to the particle size due to the different levels of densification. The electrical conductivity also showed size-dependent behavior because of the different contributions to the conductive network. Meanwhile, the material properties of EG/CF filled CPCs was also optimized according to the CF ratio, and the optimized electrical conductivity and flexural strength were 290 S/cm and 58 MPa, respectively. The electrical conductivity of this case decreased similarly to the EG/FG filled case. On the other hand, the behavior of the flexural strength was more complicated than the EG/FG filled case, and the reason was attributed to the interaction between the strengthening effect of CF and the deterioration of voids.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.232-233
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• 2005

The Surface of semi-conductive silicone rubber was treated by oxygen plasma to improve adhesion and electric performance in joints between insulating and semi-conductive silicone materials. Surface characterizations were assessed using contact angle measurement and Fourier transform infrared spectroscope (FTIR). Adhesion level was understood from T-peel tests between plasma treated semi-conductive and insulating material. Electrical breakdown strength was measured to understand the charge of electrical performance. From the results, the oxygen plasma treatment produces a significant increase in function group of containing oxygen which can be mainly ascribed to the creation of carbonyl groups on the silicone surface from the strength were improved. Therefore it is concluded then plasma treatment leads to decrease voids originating form poor adhesive, and the improve the adhesion in silicone interface. So we could obtain higher electrical design level of silicone material used for electrical apparatus using oxygen plasma treatment.

• ETRI Journal
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• 제41권6호
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.77-77
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• 2007

The development of next generation displays such as flexible display is a major challenge. Most materials and processes in current flat panel display industry cannot be transferred to flexible substrates. Typically, indium tin oxide (ITO) thin films are brittle and need to be deposited at high temperature to achieve an optimal opto-electrical property, therefore ITO films cannot be used as a flexible electrode. Up to date, many alternative materials to ITO have been proposed such as conductive polymers, nanometals, solution deposited transparent conductive oxide(TCO) and carbon nanotubes(CNTs). CNT based transparent conductive films are fabricated on glass and polymer substrates. CNT thin films exhibit a sheet resistance ($R_s$) of nearby $10^3\;{\Omega}/sq$ with a transmittance of around 80% on the visible light range, which is attributed by excellent dispersion and interaction among CNTs, solvents and polymeric binders. This talk will present the current studies, opto-electrical properties, design criteria and its applications for CNT-based transparent conductive films.

• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Carbon letters
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• 제15권2호
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• pp.117-124
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• 2014

Conductive polymer composites (CPCs) consist of a polymeric matrix and a conductive filler, for example, carbon black, carbon fibers, graphite or carbon nanotubes (CNTs). The critical amount of the electrically conductive filler necessary to build up a continuous conductive network, and accordingly, to make the material conductive; is referred to as the percolation threshold. From technical and economical viewpoints, it is desirable to decrease the conductive-filler percolation-threshold as much as possible. In this study, we investigated the effect of polymer/conductive-filler interactions, as well as the processing and morphological development of low-percolation-threshold (${\Phi}c$) conductive-polymer composites. The aim of the study was to produce conductive composites containing less multi-walled CNTs (MWCNTs) than required for pure polypropylene (PP) through two approaches: one using various mixing methods and the other using immiscible polymer blends. Variants of the conductive PP composite filled with MWCNT was prepared by dry mixing, melt mixing, mechanofusion, and compression molding. The percolation threshold (${\Phi}c$) of the MWCNT-PP composites was most successfully lowered using the mechanofusion process than with any other mixing method (2-5 wt%). The mechanofusion process was found to enhance formation of a percolation network structure, and to ensure a more uniform state of dispersion in the CPCs. The immiscible-polymer blends were prepared by melt mixing (internal mixer) poly(vinylidene fluoride) (PVDF, PP/PVDF, volume ratio 1:1) filled with MWCNT.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.603-608
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• 2023

Carbon black with high purity and excellent conductivity is used as a conductive filler in the semiconductive compound for EHV (Extra High Voltage) power cables of 345 kV or higher. When carbon black and CNT (carbon nanotube) are applied together as a conductive filler of a semiconductive compound, stable electrical properties of the semiconductive compound can be maintained even though the amount of conductive filler is significantly reduced. In EHV power cables, since the semi-conductive layer is close to the conductor, stable electrical characteristics are required even under high-temperature conditions caused by heat generated from the conductor. In this study, the theoretical principle that a semiconductive compound applied with carbon black and CNT can maintain excellent electrical properties even under high-temperature conditions was studied. Basically, the conductive fillers dispersed in the matrix form an electrical network. The base polymer and the matrix of the composite, expands by heat under high temperature conditions. Because of this, the electrical network connected by the conductive fillers is weakened. In particular, since the conductive filler has high thermal conductivity, the semiconductive compound causes more thermal expansion. Therefore, the effect of CNT as a conductive filler on the thermal conductivity, thermal expansion coefficient, and volume resistivity of the semiconductive compound was studied. From this result, thermal expansion and composition of the electrical network under high temperature conditions are explained.

• 조명전기설비학회논문지
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• 제22권2호
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• pp.155-161
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• 2008

접지시스템은 고장전류나 상시 전류를 낮은 저항의 대지로 흘러 보낸다. 접지전극 주변에 접지저감재를 매설하면 접촉 면적을 증가시켜 낮은 접지저항을 얻을 수 있다. 접지전극의 접촉면적을 확대시키면 접지저항값이 낮아진다는 특성을 이용하여 접지 시공시 팽창 특성을 가진 도전성 팽창 접지저감재를 개발하였다. 본 논문에서는 실험을 통하여 도전성 팽창 접지저감재가 일반 접지저감재보다 접지저항 저감 효과가 뛰어남을 검증하였다.