• Title/Summary/Keyword: compound Poisson

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Approximate Analysis of a CONWIP System with a Lot Production (로트 단위로 가공되는 CONWIP 시스템의 근사적 분석)

  • Lee, Hyo-Seong;Lee, Jeong-Eun
    • IE interfaces
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    • v.11 no.3
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    • pp.55-63
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    • 1998
  • In this study we consider a CONWIP system in which the processing times at each station follow an exponential distribution and the demands for the finished products arrive according to a compound Poisson process. The demands that are not satisfied instantaneously are assumed to be lost. We assume that the lot size at each station is greater than one. For this system we develop an approximation method to obtain the performance measures such as steady state probabilities of the number of parts at each station, average number of parts at each station and the proportion of lost demands. For the analysis of the proposed CONWIP system, we model the CONWIP system as a closed queueing network with a synchronization station and analyze the closed queueing network using a product form approximation method. A recursive technique is used to solve the subnetwork in the application of the product-form approximation method. To test the accuracy of the approximation method, the results obtained from the approximation method were compared with those obtained by simulation. Comparisons with simulation have shown that the accuracy of the approximate method is acceptable.

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Static response of 2-D functionally graded circular plate with gradient thickness and elastic foundations to compound loads

  • Behravan Rad, A.
    • Structural Engineering and Mechanics
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    • v.44 no.2
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    • pp.139-161
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    • 2012
  • In this paper, the static behavior of bi-directional functionally graded (FG) non-uniform thickness circular plate resting on quadratically gradient elastic foundations (Winkler-Pasternak type) subjected to axisymmetric transverse and in-plane shear loads is carried out by using state-space and differential quadrature methods. The governing state equations are derived based on 3D theory of elasticity, and assuming the material properties of the plate except the Poisson's ratio varies continuously throughout the thickness and radius directions in accordance with the exponential and power law distributions. The stresses and displacements distribution are obtained by solving state equations. The effects of foundation stiffnesses, material heterogeneity indices, geometric parameters and loads ratio on the deformation and stress distributions of the FG circular plate are investigated in numerical examples. The results are reported for the first time and the new results can be used as a benchmark solution for future researches.

Quantum Simulation Study on Performance Optimization of GaSb/InAs nanowire Tunneling FET

  • Hur, Ji-Hyun;Jeon, Sanghun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.5
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    • pp.630-634
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    • 2016
  • We report the computer aided design results for a GaSb/InAs broken-gap gate all around nanowire tunneling FET (TFET). In designing, the semi-empirical tight-binding (TB) method using $sp3d5s^*$ is used as band structure model to produce the bulk properties. The calculated band structure is cooperated with open boundary conditions (OBCs) and a three-dimensional $Schr{\ddot{o}}dinger$-Poisson solver to execute quantum transport simulators. We find an device configuration for the operation voltage of 0.3 V which exhibit desired low sub-threshold swing (< 60 mV/dec) by adopting receded gate configuration while maintaining the high current characteristic ($I_{ON}$ > $100 {\mu}A/{\mu}m$) that broken-gap TFETs normally have.

An analysis of the $M^{X}/G/1$ system with various vacations and set-up time (준비기간을 포함한 다양한 휴가형태에서의 $M^{X}/G/1$ 시스템 분석)

  • Hur, Sun;Yoon, Young-Ho;Ahn, Sun-Eung
    • Journal of the Korean Operations Research and Management Science Society
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    • v.27 no.2
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    • pp.111-121
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    • 2002
  • In this paper, we analyze an M$^{x}$ /G/1 with three types of vacation periods including setup time. Three types of vacations are : N-policy, single vacation, and multiple vacation. We consider compound poisson arrival process and general service time, where the server starts his service when a setup is completed. We find the PGF of the number of customers in system and LST of waiting time, with welch we obtain their means. A decomposition property for the system sloe and waiting time is described also.

The Cluster Damage in a $extsc{k}th-Order$ Stationary Markov Chain

  • Yun, Seokhoon
    • Journal of the Korean Statistical Society
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    • v.28 no.2
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    • pp.235-251
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    • 1999
  • In this paper we examine extremal behavior of a $textsc{k}$th-order stationary Markov chain {X\ulcorner} by considering excesses over a high level which typically appear in clusters. Excesses over a high level within a cluster define a cluster damage, i.e., a normalized sum of all excesses within a cluster, and all excesses define a damage point process. Under some distributional assumptions for {X\ulcorner}, we prove convergence in distribution of the cluster damage and obtain a representation for the limiting cluster damage distribution which is well suited for simulation. We also derive formulas for the mean and the variance of the limiting cluster damage distribution. These results guarantee a compound Poisson limit for the damage point process, provided that it is strongly mixing.

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Balking Phenomenon in the $M^{[x]}/G/1$ Vacation Queue

  • Madan, Kailash C.
    • Journal of the Korean Statistical Society
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    • v.31 no.4
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    • pp.491-507
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    • 2002
  • We analyze a single server bulk input queue with optional server vacations under a single vacation policy and balking phenomenon. The service times of the customers as well as the vacation times of the server have been assumed to be arbitrary (general). We further assume that not all arriving batches join the system during server's vacation periods. The supplementary variable technique is employed to obtain time-dependent probability generating functions of the queue size as well as the system size in terms of their Laplace transforms. For the steady state, we obtain probability generating functions of the queue size as well as the system size, the expected number of customers and the expected waiting time of the customers in the queue as well as the system, all in explicit and closed forms. Some special cases are discussed and some known results have been derived.

ON THE EXISTENCE OF THE TWEEDIE POWER PARAMETER IMPLICIT ESTIMATOR

  • Ghribi, Abdelaziz;Hassin, Aymen;Masmoudi, Afif
    • Bulletin of the Korean Mathematical Society
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    • v.59 no.4
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    • pp.979-991
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    • 2022
  • A special class of exponential dispersion models is the class of Tweedie distributions. This class is very significant in statistical modeling as it includes a number of familiar distributions such as Gaussian, Gamma and compound Poisson. A Tweedie distribution has a power parameter p, a mean m and a dispersion parameter 𝜙. The value of the power parameter lies in identifying the corresponding distribution of the Tweedie family. The basic objective of this research work resides in investigating the existence of the implicit estimator of the power parameter of the Tweedie distribution. A necessary and sufficient condition on the mean parameter m, suggesting that the implicit estimator of the power parameter p exists, was established and we provided some asymptotic properties of this estimator.

A Study of Warpage Analysis According to Influence Factors in FOWLP Structure (FOWLP 구조의 영향 인자에 따른 휨 현상 해석 연구)

  • Jung, Cheong-Ha;Seo, Won;Kim, Gu-Sung
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.4
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    • pp.42-45
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    • 2018
  • As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

Ruin Probability on Insurance Risk Models (보험위험 확률모형에서의 파산확률)

  • Park, Hyun-Suk;Choi, Jeong-Kyu
    • The Korean Journal of Applied Statistics
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    • v.24 no.4
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    • pp.575-586
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    • 2011
  • In this paper, we study an asymptotic behavior of the finite-time ruin probability of the compound Poisson model in the case that the initial surplus is large. To compare an exact ruin probability with an approximate one, we place the focus on the exact calculation for the ruin probability when the claim size distribution is regularly varying tailed (i.e. exponential claims and inverse Gaussian claims). We estimate an adjustment coefficient in these examples and show the relationship between the adjustment coefficient and the safety premium. The illustration study shows that as the safety premium increases so does the adjustment coefficient. Larger safety premium means lower "long-term risk", which only stands to reason since higher safety premium means a faster rate of safety premium income to offset claims.

The Ruin Probability in a Risk Model with Injections (재충전이 있는 연속시간 리스크 모형에서 파산확률 연구)

  • Go, Han-Na;Choi, Seung-Kyoung;Lee, Eui-Yong
    • The Korean Journal of Applied Statistics
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    • v.25 no.1
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    • pp.81-87
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    • 2012
  • A continuous time risk model is considered, where the premium rate is constant and the claims form a compound Poisson process. We assume that an injection is made, which is an immediate increase of the surplus up to level u > 0 (initial level), when the level of the surplus goes below ${\tau}$(0 < ${\tau}$ < u). We derive the formula of the ruin probability of the surplus by establishing an integro-differential equation and show that an explicit formula for the ruin probability can be obtained when the amounts of claims independently follow an exponential distribution.