• 한국세라믹학회지
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• 제56권2호
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• pp.173-177
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• 2019

Thermal properties of a SiO₂-B₂O₃-BaO ternary glass system depending on compositional change of BaO have been examined to find a proper sealing material for reversible oxide cells. Glass transition temperature and thermal expansion coefficients increased simultaneously up to 55 mol% of BaO content. The structural role of BaO with regard to the thermal properties has been discussed on the basis of Raman spectroscopy results. Flowability of the glass at sealing temperature has been examined with packed glass powders of 12 mm diameter along with a high temperature optical microscope. The practical sealing property of the glass was also examined with YSZ coated with NiO-yittria stabilized zirconia (NiO-YSZ) and it showed good adhesion without noticeable reaction with NiO-YSZ layer.

• Structural Engineering and Mechanics
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• 제44권1호
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• pp.109-125
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• 2012

Post-buckling behavior of Timoshenko beams subjected to uniform temperature rising with temperature dependent physical properties are studied in this paper by using the total Lagrangian Timoshenko beam element approximation. The beam is clamped at both ends. In the case of beams with immovable ends, temperature rise causes compressible forces end therefore buckling and post-buckling phenomena occurs. It is known that post-buckling problems are geometrically nonlinear problems. Also, the material properties (Young's modulus, coefficient of thermal expansion, yield stress) are temperature dependent: That is the coefficients of the governing equations are not constant in this study. This situation suggests the physical nonlinearity of the problem. Hence, the considered problem is both geometrically and physically nonlinear. The considered highly non-linear problem is solved considering full geometric non-linearity by using incremental displacement-based finite element method in conjunction with Newton-Raphson iteration method. The beams considered in numerical examples are made of Austenitic Stainless Steel (316). The convergence studies are made. In this study, the difference between temperature dependent and independent physical properties are investigated in detail in post-buckling case. The relationships between deflections, thermal post-buckling configuration, critical buckling temperature, maximum stresses of the beams and temperature rising are illustrated in detail in post-buckling case.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 대한화학회지
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• 제40권1호
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• pp.81-86
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• 1996

반도체를 보호하기 위하여 사용하는 반도체 성형 재료로, 현재 주로 사용되고 있는 Epoxy Molding Compound(EMI)의 주성분인 올소 크레졸 노볼락 에폭시 수지의 특성과 성형 재료의 관계를 조사하기 위하여 올소 크레졸 노볼락 에폭시 수지의 분자량과 깊은 관련이 있는 수지의 연화점 변화에 따른 EMC의 물성변화를 살펴보았다. 사용된 epoxy 수지의 연화점은 각각 65.1$^{\circ}C$, 72.2$^{\circ}C$, 83.0$^{\circ}C$ 인 3종을 사용하였으며 연화점 변화에 따른 EMC의 물성변화를 살펴보기 위하여 기계적 물성으로 굴곡 강도와 굴곡탄성율을, 열적 특성 변화를 관찰하기 위하여 열팽창 계수와 열전도도 그리고 유리 전이온도를 각각 측정하였다. 그리고 성형 특성과의 관계를 살펴보기 위하여 스피랄 플로우(Spiral Flow)를 측정하였다, 연화점이 증가함에 따라 굴곡 탄성율과 유리상에서의 열팽창 계수(${\alpha}_1$), 그리고 열전도도는 거의 변화가 없었으나 유리전이온도는 연화점 증가에 따라 증가함을, 스피랄 플로우는 연화점 증가에 따라 감소함을 보여주었다. 이는 에폭시 수지의 분자량이 증가함에 따라 가교밀도가 증가하는 현상에 기인한다고 판단된다. 고무상에서의 여팽창 계수(${\alpha}_2$)와 굴곡강도의 경우는 전이점을 보여주고 있는데, 이는 수지점도 증가에 따른 충전제의 분산성에 기인한 것으로 판단된다.

• 한국세라믹학회지
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• 제39권8호
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• pp.795-800
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• 2002

융액인상법으로 질소분위기 하에서 $Yb^{3+}$ 이온이 20at% 고용된 $Yb:YCa_4O(BO_3)_3$ (Yb:YCOB) 단결정을 이리듐 도가니를 사용하여 성장시켰다. 양질의 단결정을 성장시키기 위한 인상속도와 회전속도는 각각 1.5∼2 mm/h와 10∼20 rpm이었다. 분광물성 측정 결과, 흡수단이 236 nm에 있었으며, 전형적인 $Yb^{3+}$ 이온의 흡수 스펙트럼이 관찰되었다. Yb:YCOB의 열팽창계수는 320∼650 K의 측정범위에서 결정학적 축 a, b 그리고 c에 대해 12.1×$10^{-6}$ /K, 5.9${\times}10^{-6}$/K, 12.9${\times}10^{-6}$이었다. 비열은 330 K에서 0.162 $cal/g{\cdot}K$이었다.

• 한국세라믹학회지
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• 제32권12호
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• pp.1424-1432
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• 1995

Chalcogenide glasses having IR (8~12${\mu}{\textrm}{m}$) transmittance were prepared and their densities, thermal and mechanical properties, IR-transmittances and chemical durabilities were determined. Glass transition temperatures (Tg) of Ge-As-Se, Ge-As-Se-Te and Ge-SE-Te system glasses were in the range of 280~3$65^{\circ}C$, 210~236$^{\circ}C$ and 210~26$0^{\circ}C$, respectively. Crystallization temperature (Tc) of Ge-Se-Te system glass was in the range of 305~40$0^{\circ}C$. Their thermal expansion coefficients($\alpha$) were in the range of 11.7~15.2$\times$10-6/K, 15.4~16.0$\times$10-6/K and 17.4~27.8$\times$10-6/K, respectively. Their MOR, hardness and fracture toughness were in the range of 15.2~18.6MPa, 36.1~58.2Kg/$\textrm{mm}^2$, 1.0~1.3 MPa.mm1/2, 18.9~24.9 MPa, 40.9~65.1Kg/$\textrm{mm}^2$, 1.3~1.5 MPa.mm1/2, and 24.1~30.8 MPa, 40.9~86.0Kg/$\textrm{mm}^2$, 1.4~1.8 MPa.mm1/2, respectively. IR transmittance of Ge-Se-Te system glass was about 60%. Ge-O extrinsic absorption peaks at 8, 12 ${\mu}{\textrm}{m}$ were significantly eliminated by the addition of Mg. Chemical durabilities in deionizied water of Ge-Se-Te system glass were good and IR-transmittances decreased with leaching time and temperature.

• 비파괴검사학회지
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• 제17권2호
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• pp.89-99
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• 1997

단섬유강화금속복합재료는 최근 항공기, 자동차산업에 있어서 관심의 대상이 되고 있는 재료중의 하나이나 재료의 제조 및 성형중에 재료내의 기지재 및 강화재의 열팽창계수의 차이로 인해 재료 내부에 발생되는 열적잔류응력으로 인한 재료 특성의 변화로 실제적인 재료 적용상에 많은 문제점들이 보고되고 있다. 이와 같은 금속복합재료의 잔류응력의 평가에는 몇가지 비파괴적 방법이 적용되고 있으나 그 측정에 많은 어려움이 보고되고 있다. 따라서 금속복합재료의 보다 실제적인 응용을 위하여는 이와 같은 열적잔류응력을 평가하기 위한 이론적모델의 확립이 요구된다. 본 연구에 있어서는 비방향성을 가진 강화재가 2차원 평면 상태로 기지재내에 존재하는 단섬유강화금속복합재료에 있어서 재료에 균일한 온도 변화가 주어질 때 기지재와 강화재의 열팽창계수의 차로 인해 재료 내부에 발생하는 열적잔류응력을 평가, 예측하기 위한 이론적 탄성 모델을 확립하고자 한다. 본 연구에서 해석하고자 하는 이론 모델은 Eshelby의 등가 개재물 방법을 토대로 하고 있으며 과거 제안되고 있는 이론모델을 포함하는 보다 일반성을 가지는 해석 모델로서, 이 해석 모델을 이용하여 열적잔류응력에 미치는 강화재의 체적률, 종횡비, 분포 상태, 분포 cut-off 각도들에 대한 각 인자의 영향을 검토하였다. 그 결과 강화재의 체적률, 종횡비, cut-off 각도들이 강화재의 분포 상태보다도 금속복합재료의 열적잔류응력에 미치는 영향이 현저함을 알 수 있었다.

• 한국재료학회지
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• 제22권12호
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• pp.711-716
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• 2012

Tungsten bronze structure $Sr_{1-x}Ba_xNb_2O_6$ (SBN) single crystals were grown primarily using the Czochralski method, in which several difficulties were encountered: striation formation and diameter control. Striation formation occurred mainly because of crystal rotation in an asymmetric thermal field and unsteady melt convection driven by thermal buoyancy forces. To optimize the growth conditions, bulk SBN crystals were grown in a furnace with resistance heating elements. The zone of $O_2$ atmosphere for crystal growth is 9.0 cm and the difference of temperature between the melt and the top is $70^{\circ}C$. According to the growth conditions of the rotation rate, grown SBN became either polycrystalline or composed of single crystals. In the case of as-grown $Sr_{1-x}Ba_xNb_2O_6$ (x = 0.4; 60SBN) single crystals, the color of the crystals was transparent yellowish and the growth axis was the c-axis. The facets of the crystals were of various shapes. The length and diameter of the single crystals was 50~70 mm and 5~10 mm, respectively. Tungsten bronze SBN growth is affected by the temperature profile and the atmosphere of the growing zone. The thermal expansion coefficients on heating and on cooling of the grown SBN single crystals were not matched. These coefficients were thought to influence the phase transition phenomena of SBN.

• 방사성폐기물학회지
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• 제21권1호
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• pp.23-41
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• 2023

Coupled thermo-hydraulic-mechanical (THM) processes are essential for the long-term performance of deep geological disposal of high-level radioactive waste. In this study, a numerical sensitivity analysis was performed to analyze the effect of rock properties on THM responses after the execution of the heater test at the Kamaishi mine in Japan. The TOUGH-FLAC simulator was applied for the numerical simulation assuming a continuum model for coupled THM analysis. The rock properties included in the sensitivity study were the Young's modulus, permeability, thermal conductivity, and thermal expansion coefficients of crystalline rock, rock salt, and clay. The responses, i.e., temperature, water content, displacement, and stress, were measured at monitoring points in the buffer and near-field rock mass during the simulations. The thermal conductivity had an overarching impact on THM responses. The influence of Young's modulus was evident in the mechanical behavior, whereas that of permeability was noticed through the change in the temperature and water content. The difference in the THM responses of the three rock type models implies the importance of the appropriate characterization of rock mass properties with regard to the performance assessment of the deep geological disposal of high-level radioactive waste.

• Steel and Composite Structures
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• 제19권6호
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• pp.1501-1510
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• 2015

The frequency selective surface (FSS) embedded hybrid composite materials have been developed to provide excellent mechanical and specific electromagnetic properties. Radar absorbing structures (RASs) are an example material that provides both radar absorbing properties and structural characteristics. The absorbing efficiency of an RAS can be improved using selected materials having special absorptive properties and structural characteristics and can be in the form of multi-layers or have a certain stacking sequence. However, residual stresses occur in FSS embedded composite structures after co-curing due to a mismatch between the coefficients of thermal expansion of the FSS and the composite material. In this study, to develop an RAS, the thermal residual stresses of FSS embedded composite structures were analyzed using finite element analysis, considering the effect of stacking sequence of composite laminates with square loop (SL) and double square loop (DSL) FSS patterns. The FSS radar absorbing efficiency was measured in the K-band frequency range of 21.6 GHz. Residual stress leads to a change in the deformation of the FSS pattern. Using these results, the effect of transmission characteristics with respect to the deformation on FSS pattern was analyzed using an FSS Simulator.