• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1240-1247
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• 2003

Water jet nozzle for LCD has been used as a wet cleaning process in many industries. It is necessary for the nozzle to consider cleaning effect and flux. In this paper, we applied the bubble dynamic theory(Rayleight-Plesset equation) to improve the cleaning efficiency. Generally, Rayleigh-Plesset equations for cavitation bubbles are used in analyzing computer simulation for caviting flows. Burst of bubbles causes potential energies and we can use these energies to remove organic and inorganic compounds on the LCD. Therefore, it is necessary to analyze the bubble generations and axiomatic design by computational fluid dynamics(CFD). By comparing the weight matrix of neural networks to the design matrix of axiomatic design, we propose methods to verify designs objectively. The optimal solution could be deduced by the regression analysis using the design parameters.

• Textile Coloration and Finishing
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• v.25 no.3
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• pp.215-222
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• 2013

The purpose of this study is to minimize fading fabrics of surgical gown by repeated severe laundering and sterilization condition. The study showed that the best conditions were reduction cleaning using sulphinic acid derivatives or glucose organic chemicals at $98^{\circ}C$ alkaline solutions. In these conditions, color difference values(dE) were below 1.0 that means unrecognizable color change by repeated laundering and sterilization. If it treated with only laundering, reduction cleaning conditions may adjust over $80^{\circ}C$ alkaline solution. In conclusion, it is needed to select the high-washing fastness dye and reduction cleaning using sulphinic acid derivatives or glucose organic chemicals at $98^{\circ}C$ alkaline solutions for removal unfixed dyes.

• The Journal of Advanced Prosthodontics
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• v.8 no.3
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• pp.172-180
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• 2016

PURPOSE. The purpose of this study was to analyze the antimicrobial, antioxidant activity and cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract for assessing whether Dendropanax morbifera $L{\acute{e}}veille$ can be used for the development of natural mouthwash and denture cleaning solution. MATERIALS AND METHODS. The extract was obtained from branches of Dendropanax morbifera $L{\acute{e}}veille$. The solvent fractions were acquired by fractionating Dendropanax morbifera $L{\acute{e}}veille$ extract using n-hexane, ethyl acetate, chloroform and butanol solvent. Paper disc test was used to evaluate the antimicrobial and antifungal activity of Dendropanax morbifera $L{\acute{e}}veille$ extract and solvent fractions against Streptococcus mutans and Candida albicans. The analysis of antioxidant activity was carried out through DPPH radical scavenging assay. The cytotoxicity of Dendropanax morbifera $L{\acute{e}}veille$ extract was analyzed through MTT assay using normal human oral keratinocytes. RESULTS. Dendropanax morbifera $L{\acute{e}}veille$ extract showed antimicrobial activity against Streptococcus mutans and especially Candida albicans. The solvent fractions of Dendropanax morbifera $L{\acute{e}}veille$ showed strong antimicrobial activity against Streptococcus mutans and Candida albicans in n-hexane and butanol solvent fraction, respectively. Dendropanax morbifera $L{\acute{e}}veille$ extract also showed outstanding antioxidant activity. Butanol, ethyl acetate, and chloroform solvent fraction of Dendropanax morbifera $L{\acute{e}}veille$ tended to have increased antioxidant activity as the concentration increased. Dendropanax morbifera $L{\acute{e}}veille$ extract showed high cell survival rate in cytotoxicity test. CONCLUSION. Dendropanax morbifera $L{\acute{e}}veille$ extract turned out to have antimicrobial, antioxidant activity and cytophilicity. Based on these results, it is expected that Dendropanax morbifera $L{\acute{e}}veille$ is applicable as an ingredient for natural mouthwash and denture cleanser.

• Journal of the Korean Applied Science and Technology
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• v.16 no.1
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• pp.33-40
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• 1999

We used Cu as a representative of metals to be directly adsorbed on the bare Si surface and studied its removal DHF, DHF-$H_2O_2$ and BHF solution. It has been found that Cu ion in DHF adheres on every Si wafer surface that we used in our study (n, p, n+, p+) especially on the n+-Si surface. The DHF-$H_2O_2$ solution is found to be effective in removing metals featuring high electronegativity such as Cu from the p-Si and n-Si wafers. Even when the DHF-$H_2O_2$ solution has Cu ions at the concentration of 1ppm, the solution is found effective in cleaning the wafer. In the case the n+-Si and p+-Si wafers, however, their surfaces get contaminated with Cu When Cu ion of 10ppb remains in the DHF-$H_2O_2$ solution. When BHF is used, Cu in BHF is more likely to contaminate the n+-Si wafer. It is also revealed that the surfactant added to BHF improve wettability onto p-Si, n-Si and p+-Si wafer surface. This effect of the surfactant, however, is not observed on the n+-Si wafer and is increased when it is immersed in the DHF-$H_2O_2$ solution for 10min. The rate of the metallic contamination on the n+-Si wafer is found to be much higher than on the other Si wafers. In order to suppress the metallic contamination on every type of Si surface below 1010atoms/cm2, the metallic concentration in ultra pure water and high-purity DHF which is employed at the final stage of the cleaning process must be lowered below the part per trillion level. The DHF-$H_2O_2$ solution, however, degrades surface roughness on the substrate with the n+ and p+ surfaces. In order to remove metallic impurities on these surfaces, there is no choice at present but to use the $NH_4OH-H_2O_2-H_2O$ and $HCl-H_2O_2-H_2O$ cleaning.

• The Korean Journal of Nuclear Medicine Technology
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• v.13 no.3
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• pp.181-184
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• 2009

Purpose: Automated system that immunoassay examination are used widely. However, sample to sample carryover can cause that the next patient sample is false positive. Materials and Methods: We test HBs Ag, HBs Ab, HBc Ab(IgG) with Automated pipetting system (Tecan). It was placed with very high concentrations followed by saline solution. During this experiment, The fixed tip of Automated system wash With 0.25 moL/L NaOH. The Measurement results of saline solution confirm the occurrence of carryover. Results: Results of saline solution with 0.25 moL/L NaOH cleaning process was measured 100% negative, And results of patient serum with 0.25 moL/L NaOH cleaning process is similar reported results. Conclusion: As Results, 0.25 moL/L NaOH cleaning process was avoid carryover in experiment, And we know results of the hepatitis test did not affected by this solution we recommend 0.25 moL/L NaOH cleaning process as the Prevention of carryover in the automated system with fixed Tips.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.4
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• pp.390-396
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• 2013

Due to the development of technology, there is a considerable increase in the number of skyscrapers in the world. Accordingly, there are rapid growing requests about maintenances such as cleaning, painting, and inspection. However, it is extremely dangerous working the walls of buildings, and crashes from buildings have accounted for large proportion of constructional accidents. Especially, as the number of buildings with irregular shapes increases, the accident rate during the maintenance work increases each year, and most of the accidents lead to death. An alternative solution must be developed with the commercialization of automatic systems. In this research, a fundamental research has been conducted for drafting and commercializing an automation tool that is carried in the built-in guide system, which can perform cleaning.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.575-582
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• 2011

A cleaning blade is an attachment installed in the toner cartridge of a laser printer for removing the residual toner from an organic photo-conductive drum. There have been many studies on the performance and life of the rubber blade. We focus on optimally designing the blade shape parameters to minimize the maximum stress of the blade while satisfying design constraints on the cleaning performance and part interference. The blade is optimally designed using a design of experiments, meta-models and an optimization algorithm implemented in PIAnO (process integration, automation, and optimization), a commercial PIDO (process integration and design optimization) tool. We integrate the CAE tools necessary for the structural analysis of the cleaning blade, automate the analysis procedure, and optimize the solution using PIAnO. We decreased the maximum stress by 32.6% in comparison with that of the initial design.

• Journal of Korean Society of Water and Wastewater
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• v.31 no.3
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• pp.229-236
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• 2017

In this study, a direct contact membrane module was manufactured to be used in a pilot scale membrane distillation process to treat $3m^3/day$ of the digestate produced from anaerobic digestion of livestock manure. In order to investigate the performance of the membrane module, permeate flux was measured with and without spacer inside the module under various condition of temperature difference and cross flow velocity (CFV) through the membrane surfaces. Flux recovery rate after chemical cleaning was also investigated by applying three different cleaning methods. Additionally, thermal energy consumption was theoretically simulated based on actual pilot plant operation conditions. As results, we observed flux of the module with spacer was almost similar to the theoretically predicted value because the installation of spacer reduced the channeling effect inside the module. Under the same operating condition, the permeate flux also increased with increasing temperature difference and CFV. As a result of chemical in-line cleaning using NaOCl and citric acid for the fouled membranes, the recovery rate was 83.7% compared to the initial flux when NaOCl was used alone, and 87% recovery rate was observed when only citric acid was used. However, in the case of using only citric acid, the permeate flux was decreased at a rapid rate. It seemed that a cleaning by NaOCl was more effective to recover the flux of membrane contaminated by the organic matter as compared to a cleaning by citric acid. The total heat energy consumption increased with increasing CFV and temperature difference across the membrane. Thus, further studies should be intensively conducted to obtain a high permeate flux while keeping the energy consumption to a minimum for a practical application of membrane distillation process to treat wastewater.