• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.1
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• pp.53-61
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• 2014

In this paper, we present the design, fabrication and measurement of high efficiency GaN HEMT power amplifier using harmonic matching technique. In order to achieve high efficiency, harmonic load-pull simulation is performed, that is, the optimum load impedances are determined at $2^{nd}$ and $3^{rd}$ harmonic frequencies as well as at the fundamental. Then, the output matching circuit is designed based on harmonic load-pull simulation. The measurement of the fabricated power amplifier shows the linear gain of 20 dB and $P_{1dB}$(1 dB gain compression point) of 33.7 dBm at 1.85 GHz. The maximum power added efficiency(PAE) of 80.9 % is achieved at the output power of 38.6 dBm, which belongs to best efficiency performance among the reported high efficiency power amplifiers. For W-CDMA input signal, the power amplifier shows a PAE of 27.8 % at the average output power of 28.4 dBm, where an ACLR (Adjacent Channel Leakage Ratio) is measured to be -38.8 dBc. Digital predistortion using polynomial fitting was implemented to linearize the power amplifiers, which allowed about 6.2 dB improvement of an ACLR performance.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.1
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• pp.59-67
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• 2016

A novel instrumentation amplifier (IA) using fully-differential linear operational transconductance amplifier (FLOTA) for electronic measurement systems with low cost, wideband, and gain control with wide range is designed. The IA consists of a FLOTA, two resistor, and an operational amplifier(op-amp). The principal of the operating is that the difference of two input voltages applied into FLOTA converts into two same difference currents, and then these current drive resistor of (+) terminal and feedback resistor of op-amp to obtain output voltage. To verify operating principal of the IA, we designed the FLOTA and realized the IA used commercial op-amp LF356. Simulation results show that the FLOTA has linearity error of 0.1% and offset current of 2.1uA at input dynamic range ${\pm}3.0V$. The IA had wide gain range from -20dB to 60dB by variation of only one resistor and -3dB frequency for the 60dB was 10MHz. The proposed IA also has merits without matching of external resistor and controllable offset voltage using the other resistor. The power dissipation of the IA is 105mW at supply voltage of ${\pm}5V$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.18-24
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• 2012

This paper reports the test results of a 50MHz/s 10 bits DAC developed with $0.18{\mu}m$ CMOS process for the wireless sensor network application. The 10bits DAC, not likely a typical segmented type, has been designed as a current driving type with double step thermometer decoding architecture in which 10bits are divided into 6bits of MSB and 4bits of LSB. MSB 6bits are converted into 3 bits row thermal codes and 3 bits column thermal codes to control high current cells, and LSB 4 bits are also converted into thermal codes to control the lower current cells. The high and the lower current cells use the same cell size while a bias circuit has been designed to make the amount of lower unit current become 1/16 of high unit current. All thermal codes are synchronized with output latches to prevent glitches on the output signals. The test results show that the DAC consumes 4.3mA DC current with 3.3V DC supply for 2.2Vpp output at 50MHz clock. The linearity characteristics of DAC are the maximum SFDR of 62.02dB, maximum DNL of 0.37 LSB, and maximum INL of 0.67 LSB.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.1
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• pp.13-21
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• 1997

In this paper, the oscillator type active antenna used as an element of active phased array antenna is designed and fabricated using slot coupling. The radiating element and active circuit are fabricated on each layer respectively and coupled electromagnetically through slot on the ground plane. This structure can solve the problems such as narrow bandwidth of microstrip antenna, spurious radiation by active circuits, and spaces for integration of the feeding circuits which are caused by integrating antennas with oscillator circuits in the same layer. The active antenna in this paper, the oscillation frequency can be tuned linearly by controlling the drain bias voltage of FET. The frequency tuning range is between 12.37 GHz to 12.65 GHz when bias voltage is varied from 3V to 9V, thus frequency tuning bandwidth is 280 MHz (2.24%). The output power of antenna is uniform within 5dB over frequency tuning range. Therefore this active antenna can be used as an element of linear or planar active phased array antennas.

• 대한공업교육학회지
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• v.41 no.2
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• pp.89-118
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• 2016

In this study, the model of Turtle Ship, which is evaluated as one of the world's first ironclad ship in battle as well as the traditional scientific and technological heritage in Korea, was combined with the Physical Computing Platform(Arduino and App Inventor) that enables students to learn the basic concepts of IT in an easy and fun way. Thus, this study contrived the Physical Computing Platform-based Turtle Ship model which will make the students of Industrial Specialized High School develop the technological literacy and humanities-based knowledge through flexible education out of stereotype and single subject as well as enhance the potential of creative convergence education. The following is a summary of the main results obtained through this study: First, Arduino-based Main-controller design and making is helpful to learn of the hardware and software knowledge about EEC(Electron Electronics Control) and to confirm the basic characteristics and performance of interaction of Arduino and actuators. Second, The fundamental Instructional environments of abilities such as implementing EEC systems, thinking logically, and problem-solving skills were provided by designing of pattern diagram, designing an actuator circuit and making, the creation of sketches as technical programming and developing of mobile app. Thirdly, This is physical computing platform based Turtle ship model that will enable students to bring up their technological literacy and interest in the cultural heritage.

• The KIPS Transactions:PartA
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• v.11A no.2
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• pp.115-122
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• 2004

In this paper, the multiple-valued adders and multipliers are implemented by current-mode CMOS. First, we implement the 3-valued T-gate and the 4-valued T-gate using current-mode CMOS which have an effective availability of integrated circuit design. Second we implement the circuits to be realized 2-variable 3-valued addition table and multiplication table over finite fields $GF(3^2)$, and 2-variable 4-valued addition table and multiplication table over finite fields $GF(4^2)$ with the multiple-valued T-gates. Finally, these operation circuits are simulated under $1.5\mutextrm{m}$ CMOS standard technology, $15\mutextrm{A}$ unit current, and 3.3V VDD voltage Spice. The simulation results have shown the satisfying current characteristics. The 3-valued adder and multiplier, and the 4-valued adder and multiplier implemented by current-mode CMOS is simple and regular for wire routing and possesses the property of modularity with cell array. Also, since it is expansible for the addition and multiplication of two polynomials in the finite field with very large m, it is suitable for VLSI implementation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.13-22
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• 2001

This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9％ reduction in volume and 4.8cm, 28.4％ in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.2
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• pp.7-13
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• 2011

This paper presents a Time-to-Digital Converter which is a key block of an All-Digital Phase Locked Loop. In this work, a Vernier Delay Line is added in a conventional Gated Ring Oscillator, so it could get multi-phases and a high resolution. The Gated Ring Oscillator uses 7 unit delay cell, the Vernier Delay Line is used each delay cell. So proposed Time-to-Digital Converter uses total 21 phases. This Time-to-Digital Converter circuit is designed and laid out in $0.13{\mu}m$ 1P-6M CMOS technology. The proposed Time-to-Digital Converter achieves 26ps resolution, maximum input signal frequency is 100MHz and the digital output of proposed Time-to-Digital Converter are 8-bits. The proposed TDC detect 5ns phase difference between Start and Stop signal. A power consumption is 8.4~12.7mW depending on Enable signal width.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.9
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• pp.10-17
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• 2007

It opens a new horizon on spintronics for the potential application of MTJ as a universal logic element, to employ the magneto-logic in substitution for the transistor-based logic device. The magneto-logic based on the MTJ element shows many potential advantages, such as high density, and nonvolatility. Moreover, the MTJ element has programmability and can therefore realize the full logic functions just by changing the input signals. This magneto-logic using MTJ elements can embody the reconfigurable circuit to overcome the rigid architecture. The established magneto-logic element has been designed and fabricated on a triple-layer MTJ. We present a novel magneto-logic structure that consists of a single layer MTJ and a current driver, which requires less processing steps with enhanced functional flexibility and uniformity. A 4-bit gray counter is designed to verify the magneto-logic functionality of the proposed single-layer MTJ and the simulation results are presented with the HSPICE macro-model of MTJ that we have developed.

• Journal of IKEEE
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• v.7 no.2 s.13
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• pp.236-244
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• 2003

In this paper, RF and IF circuits for mobile terminals which have usually been implemented using expensive BiCMOS processes are designed using CMOS circuits, and a Tx CMOS RF/IF single chip for PCS applications is designed. The designed circuit consists of an IF block including an IF PLL frequency synthesizer, an IF mixer, and a VGA and an RF block including a SSB RF mixer and a driver amplifier, and performs all transmit signal processing functions required between digital baseband and the power amplifier. The phase noise level of the designed IF PLL frequency synthesizer is -114dBc/Hz@100kHz and the lock time is less than $300{\mu}s$. It consumes 5.3mA from a 3V power supply. The conversion gain and OIP3 of the IF mixer block are 3.6dB and -11.3dBm. It consumes 5.3mA. The 3dB frequencies of the VGA are greater than 250MHz for all gain settings. The designed VGA consumes 10mA. The designed RF block exhibits a gain of 14.93dB and an OIP3 of 6.97dBm. The image and carrier suppressions are 35dBc and 31dBc, respectively. It consumes 63.4mA. The designed circuits are under fabrication using a $0.35{\mu}m$ CMOS process. The designed entire chip consumes 84mA from a 3V supply, and its area is $1.6㎜{\times}3.5㎜$.