• Nuclear Engineering and Technology
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• v.48 no.5
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• pp.1273-1279
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• 2016

Production of iodine-131 by neutron activation of tellurium in tellurium dioxide ($TeO_2$) material requires a target that meets the safety requirements. In a radiopharmaceutical production unit, a new lid for a can was designed, which permits tight sealing of the target by using tungsten inert gaswelding. The leakage rate of all prepared targets was assessed using a helium mass spectrometer. The accepted leakage rate is ${\leq}10^{-4}mbr.L/s$, according to the approved safety report related to iodine-131 production in the TRIGA Mark II research reactor (TRIGA: Training, Research, Isotopes, General Atomics). To confirm the resistance of the new design to the irradiation conditions in the TRIGA Mark II research reactor's central thimble, a study of heat effect on the sealed targets for 7 hours in an oven was conducted and the leakage rates were evaluated. The results show that the tightness of the targets is ensured up to $600^{\circ}C$ with the appearance of deformations on lids beyond $450^{\circ}C$. The study of heat transfer through the target was conducted by adopting a one-dimensional approximation, under consideration of the three transfer modes-convection, conduction, and radiation. The quantities of heat generated by gamma and neutron heating were calculated by a validated computational model for the neutronic simulation of the TRIGA Mark II research reactor using the Monte Carlo N-Particle transport code. Using the heat transfer equations according to the three modes of heat transfer, the thermal study of I-131 production by irradiation of the target in the central thimble showed that the temperatures of materials do not exceed the corresponding melting points. To validate this new design, several targets have been irradiated in the central thimble according to a preplanned irradiation program, going from4 hours of irradiation at a power level of 0.5MWup to 35 hours (7 h/d for 5 days a week) at 1.5MW. The results showthat the irradiated targets are tight because no iodine-131 was released in the atmosphere of the reactor building and in the reactor cooling water of the primary circuit.

• Restorative Dentistry and Endodontics
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• v.13 no.2
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• pp.221-235
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• 1988

The purpose of this study was to observe characteristic properties through the polarization curves and EMPA images from 4 different types of amalgam obtained by using the potentiostats (EG & G PARC) & EPMA (Jeol JSM-35), to investigate the degree of corrosion of each phase of amalgam on the oxidation peak, and to identify corrosion products from the corroded amalgam by use of X-ray diffractometer(Rigaku). After each amlgam alloy and Hg were triturated as the direction of the manufacturer by means of the mechanical amalgamator(Shofu), the triturated mass was inserted into the cylindrical metal mold which was 12mm in diameter and 10mm in height and was condensed by means of routine manner. The specimen was removed from the mold and stored at room temperature for about 7 days. The standard surface preparation was routinely carried out. Anodic polarization measurement was employed to compare the corrosion behaviours of the amalgams in 0.9% saline solution(pH6.8~7.0) and artificial saliva (pH6.8~7.0) at $37^{\circ}C$. The open circuit potential was determined after 30 minutes' immersion of specimen in electrolyte and the potential scan was begun at the potential of 100mV cathodic from the corrosion potential. The scan rate was 1mV/sec and the surface area of amalgam exposed to the solution was 0.64$cm^2$ for each specimen. All the potentials reported are with respect to a saturated calomel electrode (SCE). EPMA images on the determined oxidation peaks of each amalgam in artificial saliva were observed. X-ray diffraction patterns of each sample were recorded before and after polarization in artificial saliva (Aristaloy, Caulk Spherical, Dispersalloy and Tytin: at +770mV, +585mV, +8.10m V and +680m V respectively) by use of a recording diffractometer. Nickel filtered Cu $K_{{\alpha}_1}$ radiation was used and sample was scanned at $4^{\circ}(2{\theta})/min.$ from $25^{\circ}$ to $80^{\circ}$. The following results were obtained. 1. Oxidation peak potential in artificial saliva shifted to more anodic direction than that in saline solution. 2. The corrosion potential of high copper amalgam was more anodic than the potential of low copper amalgam. 3. The current density was lower in artificial saliva than in saline solution. 4. One of the corrosion products, AgCl was identified by X-ray diffraction analysis. 5. ${\gamma}_2$ phase was the most susceptible to corrosion and e phase was stable in low copper amalgam and ${\eta}$' phase and Ag-Cu eutectic were susceptible to corrosion in high copper amalgam.

• Geophysics and Geophysical Exploration
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• v.17 no.4
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• pp.247-252
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• 2014

Gagok Mine, which is skarn deposits, includes sulfide minerals such as sphalerite, galena, chalcopyrite, and pyrrhotite. To explore these minerals, spectral induced polarization (SIP) is relatively effective compared to other geophysical exploration methods because there is a strong IP effect caused by electrode polarization. In the SIP, the chargeability related to sulfide mineral contents and the time constant related to the grain size of the minerals are obtained. For this reason, we aim to compare difference in the mineralized characteristics between two orebodies in the Gagok Mine by using the chargeability and the time constant. For this study, we sampled ores from the south of Wolgok orebody and the north of Sungok orebody. In order to recognize the mineralization characteristics, the metal content of the samples was measured by a potable XRF and the SIP data of the samples were acquired by using a laboratory SIP measurement system. As a result, the metals in the samples such as Pb, Zn, Cu, and Fe were detected by the portable XRF measurement. In particular, the Fe and Zn contents were far higher than the other metals. The Fe and the Zn were caused by the sphalerite and the pyrrhotite through microscopy. The Wolgok orebody had higher sulfide mineral contents than the Sungok orebody and the result corresponded with the chargeability result. However, we considered that the Sungok orebody had a larger sulfide mineral grain size than the Wolgok orebody because the time constant of the Sungok orebody was larger.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.39-45
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• 2012

Three-dimensional integrated circuit(3D IC) technology has become increasingly important due to the demand for high system performance and functionality. In this work, BOE and HF wet etching of Cu line surfaces after CMP were conducted for Cu-Cu pattern direct bonding. Step height of Cu and $SiO_2$ as well as Cu dishing after Cu CMP were analyzed by the 3D-Profiler. Step height increased and Cu dishing decreased with increasing BOE and HF wet etching times. XPS analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE and HF wet etching treatment. BOE treatment showed not only the effective $SiO_2$ etching but also reduced dishing and Cu surface oxide rather than HF treatment, which can be used as an meaningful process data for reliable Cu-Cu pattern bonding characteristics.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.5
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• pp.61-66
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• 2013

In this paper, temperature dependence of matching characteristics of $Si_3N_4$ MIM capacitor was analyzed in depth. The matching characteristics becomes worse as the temperature increases. That is, the matching coefficient of $Si_3N_4$ MIM capacitor at $25^{\circ}C$, $75^{\circ}C$, and $125^{\circ}C$ was 0.5870, 0.6151, and $0.7861%{\mu}m$, respectively. This phenomena is believed to be due to the reduction of the carrier mobility and the increase of the charge concentration of the inner capacitor at greater temperature. Therefore, the analysis of the matching characteristics of $Si_3N_4$ MIM capacitors at high temperatures is essential for application to analog and SoC (System on Chip) circuit.

• Journal of the Korean Home Economics Association
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• v.40 no.12
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• pp.85-108
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• 2002

The objectives of this study were to investigate the trend of the attitude and the behavior about consumer's internet premium advertisement and its application and the factors which influence on the attitude and the behavior about consumer's premium advertisement and its application; the demographic variables, internet communication-environment variables and variables in relation to consumer's premium advertisement application. For these purpose, the data collected two way: internet survey and questionnaire survey. The data used in this study included people who have looked an internet Premium Advertisement more than once during internet use. Major findings were as following: (1) The attitude of internet premium advertisement and its application could be described as the mean 34.16 md 24.61 separately(3.11 and 2.73 point on 5.00 points scale). The behavior of application about internet premium advertisement was measured as a behavior of application whether or not; application 18.7% and unapplication 81.3%. (2) The attitude of application about internet premium advertisement was significantly different according to age, joining frequency on internet, past experience of winning a premium, purchasing information search, interesting connection on the internet, the risk about the money loss and negative evaluation of other persons, the economical values of premiums, winning possibility, and preferable premiums. The behavior of application about internet premium advertisement, the behavior of application whether or not was significantly different according to sex, age, school career, a circuit speed, a period of using, joining frequency and a using place, past experience of winning a premium, purchasing information search, interesting connection on the internet, the risk about the negative evaluation of other persons, the economical values of premiums, winning possibility, and preferable premiums. (3) When looking at the influence of variables about the attitude of application about internet premium advertisement, the most influence variables was the past experience of winning a premium, and next was winning possibility, sex, the interest about the premiums which made the consumer want to apply, the economical values of premiums, the purpose of purchase information search and the using time. The explanation of those variables were 22.6%. As the result of the Logistic analysis, it was found that the frequency of the internet connection, the past experience of winning premiums, the risk about the outflow of credit information, interesting premiums, and premium advertisement were the most important variables to affect the possibility of the behavior of application about internet premium advertisement critically.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.20 no.10
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• pp.1927-1934
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• 2016

In this paper, we proposed a I-gate n-MOSFET (n-type Metal Oxide Semiconductors Field Effect Transistor) structure in order to mitigate a radiation-induced leakage current path in an isolation oxide interface of a silicon-based standard n-MOSFET. The proposed I-gate n-MOSFET structure was designed by using a layout modification technology in the standard 0.18um CMOS (Complementary Metal Oxide Semiconductor) process, this structure supplements the structural drawbacks of conventional radiation-tolerant electronic device using layout modification technology such as an ELT (Enclosed Layout Transistor) and a DGA (Dummy Gate-Assisted) n-MOSFET. Thus, in comparison with the conventional structures, it can ensure expandability of a circuit design in a semiconductor-chip fabrication. Also for verification of a radiation-tolerant characteristic, we carried out M&S (Modeling and Simulation) using TCAD 3D (Technology Computer Aided Design 3-dimension) tool. As a results, we had confirmed the radiation-tolerant characteristic of the I-gate n-MOSFET structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.7
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• pp.230-238
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• 2014

In this paper, we propose the possible way of accurate analysis and examination of ITO sensor to discriminate whether mutual capacitance ITO sensor is defective by using mutual capacitance of data in each node which consists of electrodes inside of ITO sensor. We have analyzed the structure characteristic of mutual capacitance ITO sensor which is used as an input device for not only small size electronics like mobile phone and tablets but also big size electronics and designed the circuit to inspect ITO sensor using touch screen panel IC. Set a variable related with mutual capacitance of charge and discharge and Implement to find and analyze accurate position when defect is made through the data from each node of ITO sensor. First, we can set a yield effective range through the first experiment data of mutual capacitance ITO sensor and by using the data of each node of ITO sensor which is the result from the second experiment, we can verify accuracy and effectiveness of effective range from the first experiment as a sample which is used in this experiment.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.518-522
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• 2008

The miniaturization of device size and multilevel interlayers have been developed by ULSI circuit devices. These submicron processes cause serious problems in conventional metallization due to the solubility of silicon and metal at the interface, such as an increasing contact resistance in the contact hole and interdiffusion between metal and silicon. Therefore it is necessary to implement a barrier layer between Si and metal. Thus, the size of multilevel interconnection of ULSI devices is critical metallization schemes, and it is necessary reduce the RC time delay for device speed performance. So it is tendency to study the Cu metallization for interconnect of semiconductor processes. However, at the submicron process the interaction between Si and Cu is so strong and detrimental to the electrical performance of Si even at temperatures below $200^{\circ}C$. Thus, we suggest the tungsten-carbon-nitrogen (W-C-N) thin film for Cu diffusion barrier characterized by nano scale indentation system. Nano-indentation system was proposed as an in-situ and nanometer-order local stress analysis technique.