• Title/Summary/Keyword: chip-in-substrate

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A Study on Fluxless Solder Flip Chip Bonding Using Plasma & Ultrasonic Wave (플라즈마와 초음파를 이용한 무플럭스 솔데 플립칩 접합에 관한 연구)

  • 홍순민;강춘식;정재필
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.11a
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    • pp.138-140
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    • 2001
  • Fluxless flip chip bonding using plasma & ultrasonic wave was investigated in order to evaluate the effect of plasma & ultrasonic treatment on the bondability of the Sn-3.5wt%Ag solder bumped die to TSM-coated glass substrate. The $Ar+10%H_2plasma$ was effective in removing tin oxide on solder surface. The die shear strength of the plasma-treated Si-chip is higher than that of non-treated specimen but lower than that of specimen bonded with flux. The die shear strength with the bonding load at 25W ultrasonic power increased to 0.8N/bump for all bonding temperature but decreased above 1.0N/bump.

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Fabrication of Solder Bump Pattern Using Thin Mold (박판 몰드를 이용한 솔더 범프 패턴의 형성 공정)

  • Nam, Dong-Jin;Lee, Jae-Hak;Yoo, Choong-Don
    • Journal of Welding and Joining
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    • v.25 no.2
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    • pp.76-81
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    • 2007
  • Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

Effects of Ionic Strength in the Medium on Sample Preconcentration Utilizing Nano-interstices between Self-Assembled Monolayers of Gold Nanoparticles

  • Nguyen, Ngoc-Viet;Wu, Jian-Sheng;Jen, Chun-Ping
    • BioChip Journal
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    • v.12 no.4
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    • pp.317-325
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    • 2018
  • This paper investigated the effects of ionic strength in the medium on a preconcentrator for a protein sample with low concentration. The preconcentration chip was designed and fabricated using a polydimethylsiloxane replica through standard lithophotography. A glass substrate is silanized prior to functionalizing the nanoparticles for self-assembly at a designed region. Due to the overlap of electrical double layers in a nanofluidic channel, a concentration polarization effect can be achieved using an electric field. A nonlinear electrokinetic flow is induced, resulting in the fast accumulation of proteins in front of the induced ionic depletion zone, so called exclusion-enrichment effect. Thus, the protein sample can be driven by electroosmotic flow and accumulated at a specific location. The chip is used to collect fluorescein isothiocyanate-labeled bovine serum albumin (FITC-BSA) diluted in phosphate-buffered saline (PBS) buffer solution. Different concentrations of the buffer media were studied herein. Fluorescence intensity images show that the buffer concentration of 4 mM is more appropriate than all the other ones. The sample of FITC-BSA with an initial concentration of $10{\mu}M$ in the 4 mM PBS solution increases its concentration at the desired region by up to 50 times within 30 min, demonstrating the results in this investigation.

RF High Power Amplifier Module using AlN Substrate (AlN 기판을 이용한 RF 고전력 증폭기 모듈)

  • Kim, Seung-Yong;Nam, Choong-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.10
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    • pp.826-831
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    • 2009
  • In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

DNAchip as a Tool for Clinical Diagnostics (진단의학 도구로서의 DNA칩)

  • 김철민;박희경
    • Proceedings of the Korean Institute of Intelligent Systems Conference
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    • 2004.04a
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    • pp.97-100
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    • 2004
  • The identification of the DNA structure as a double-stranded helix consting of two nucleotide chain molecules was a milestone in modern molecular biology. The DNA chip technology is based on reverse hybridization that follows the principle of complementary binding of double-stranded DNA. DNA chip can be described as the deposition of defined nucleic acid sequences, probes, on a solid substrate to form a regular array of elements that are available for hybridization to complementary nucleic acids, targets. DNA chips based on cDNA clons, oligonucleotides and genomic clons have been developed for gene expression studies, genetic variation analysis and genomic changes associated with disease including cancers and genetic diseases. DNA chips for gene expression profiling can be used for functional analysis in human eel Is and animal models, disease-related gene studies, assessment of gene therapy, assessment of genetically modified food, and research for drug discovery. DNA chips for genetic variation detection can be used for the detection of mutations or chromosomal abnormalities in cnacers, drug resistances in cancer cells or pathogenic microbes, histocompatibility analysis for transplantation, individual identification for forensic medicine, and detection and discrimination of pathogenic microbes. The DNA chip will be generalized as a useful tool in clinical diagnostics in near future. Lab-on-a chip and informatics will facilitate the development of a variety of DNA chips for diagnostic purpose.

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Effects of Environmental Substrate Composition on the Growth and Yield of Hydroponically Grown Tomato (토마토 양액재배시 배지 환경조성이 생육 및 생산성에 미치는 영향)

  • Lee, Jaesu;Lee, Hyundong;Lee, Sanggyu;Kwak, Kangsu;Kim, Balgeum;Kim, Taehyun;Baek, Jeonghyun;Rho, Siyoung;Hong, Youngsin
    • Journal of Environmental Science International
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    • v.28 no.9
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    • pp.729-735
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    • 2019
  • The aim of this study was to determine the effects of different compositions of environmental substrates on hydroponic tomato cultivation. Three different substrates were used in coir chip:dust (v/v=50:50; CP1), coir chip:dust (v/v=80:20; CP2), and rock wool cube with CP2 (CPR). The amount of irrigation during the cultivation period was 190 mL/(plant time) in all substrates. The pH and EC were 5.8-6.2 and 2.6-2.9 dS/m, respectively. The drainage rate in CP1 was 31%, in CP2 was 36%, and in CPR was 29%. The growth of tomato plants in terms of height was higher in CP1 and CPR. The leaf area was greater in CP2. The fresh and dry weights were greater in CP2 and CPR treatments. The net photosynthesis in CP2 ($19.31{\mu}mol\;CO_2/m^2s$) and root activity in CP2 were higher among all three treatments. The soluble solid content of fruit was not significantly different among treatments. The yield per plant in CP2 and CPR treatments was 17% greater than the yield per plant in CP1. Therefore, the most suitable substrate for hydroponic tomato cultivation is the substrate mixed with coir chip:dust (v:v=80:20; CP2), i.e., CPR.

Flip Chip Process by Using the Cu-Sn-Cu Sandwich Joint Structure of the Cu Pillar Bumps (Cu pillar 범프의 Cu-Sn-Cu 샌드위치 접속구조를 이용한 플립칩 공정)

  • Choi, Jung-Yeol;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.9-15
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    • 2009
  • Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

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Detection of ${\alpha}-Cyclodextrin$ and E.coli Cell Using Polydiacetylene Supramolecules

  • Lee, Gil-Sun;Choi, Hyun;Lee, Chung-Wan;Ahn, Dong-June;Oh, Min-Kyu;Kim, Jong-Man
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.306-306
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    • 2006
  • We immobilized and patterned PDA vesicles on solid substrate using micro arrayer, which have moieties to react with chemical and biological materials. Immobilized vesicle system was developed since it possesses many advantages in multiple screening, durable stability, and higher sensitivity. We applied polydiacetylene supramolecules to chemical and biological sensors for detection of ${\alpha}-cyclodextrin$ and E.coli cell selectively. This detection method could be applied as DNA chip, protein chip, and cell chip for multiple screening as well as chemical sensor by modifying the functional groups of diacetylene monomer.

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GaN Etch Process System using Parallel Plasma Source for Micro LED Chip Fabrication (병렬 플라즈마 소스를 이용한 마이크로 LED 소자 제작용 GaN 식각 공정 시스템 개발)

  • Son, Boseong;Kong, Dae-Young;Lee, Young-Woong;Kim, Huijin;Park, Si-Hyun
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.32-38
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    • 2021
  • We developed an inductively coupled plasma (ICP) etcher for GaN etching using a parallel plasma electrode source with a multifunctional chuck matched to it in order for the low power consumption and low process cost in comparison with the conventional ICP system with a helical-type plasma electrode source. The optimization process condition using it for the micro light-emitting diode (µ-LED) chip fabrication was established, which is an ICP RF power of 300 W, a chuck power of 200 W, a BCl3/Cl2 gas ratio of 3:2. Under this condition, the mesa structure with the etch depth over 1 ㎛ and the etch angle over 75° and also with no etching residue was obtained for the µ-LED chip. The developed ICP showed the improved values on the process pressure, the etch selectivity, the etch depth uniformity, the etch angle profile and the substrate temperature uniformity in comparison with the commercial ICP. The µ-LED chip fabricated using the developed ICP showed the similar or improved characteristics in the L-I-V measurements compared with the one fabricated using the conventional ICP method

Growth and Yield Response of Perilla Plants Grown under Different Substrates in Hydroponic System (잎들깨 수경재배에서 배지 종류에 따른 식물 생육 및 수량의 반응)

  • Shin, Minju;Jeong, Ho Jeong;Roh, Mi Young;Kim, Jin Hyun;Song, Kwan Jeong
    • Journal of Bio-Environment Control
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    • v.31 no.4
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    • pp.292-299
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    • 2022
  • This study was conducted to analyze physical and chemical properties of horticultural substrates and response of hydroponically grown two cultivars of 'Namcheon' and 'Somirang' perilla by four different substrates: coir (chip:dust = 5:5), perlite, granular rockwool, and commercial mixed substrate (cocopeat:peatmoss:vermiculite:perlite: zeolite = 50:25:10:10:5). There were no significant differences in EC and pH according to substrates. Container capacity was the greatest in granular rockwool, and it showed appropriate levels in mixed substrate and coir. Air space was higher in coir and perlite than the other treatments. Bulky density reached a proper standard in all substrates excepting coir. The leaf length and width of 'Namcheon' indicated the most in mixed substrate, though the value of 'Somirang'was greatest in coir substrate. The leaf weight of both cultivars was highest in mixed substrate, and relatively low in coir and perlite. The total yield of leaves was separated by two groups: higher group, which are mixed substrate and granular rockwool, and lower group, which are coir and perlite. There was a large gap by 28% between these two groups. Therefore, this study suggests that substrates with high water holding capacity such as mixed substrate or granular rockwool are most suitable for the hydroponic cultivation of perilla, which require sufficient moisture supply to the root zone.