• Title/Summary/Keyword: characteristic time

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A Study on the Reversal Flow Time due to Blackout (펌프장 정전시 역류발생시간에 관한 연구)

  • Park, Jong-Ho;Park, Han-Yung
    • The KSFM Journal of Fluid Machinery
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    • v.14 no.6
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    • pp.26-34
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    • 2011
  • Waterhammer and slamming phenomena can occur when power is cut off due to reversal flow in pipeline and sudden close of check valve. Therefore analysis of reversal flow time, which means the time of reversal flow in pipeline due to pumping station blackout, is needed to protect facilities from waterhammer economically and efficiently. However systematic study on reversal flow time has not been done yet. So theory of reversal flow time analysis is proposed and verified with experiment using several parameters like pump specific speed, motor pole number, and characteristic curve of pipeline in this study.

The Computation Reduction Algorithm Independent of the Language for CELP Vocoders (각국 언어 특성에 독립적인 CELP 계열 보코더에서의 계산량 단축 알고리즘)

  • Ju, Sang-Gyu
    • Proceedings of the KAIS Fall Conference
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    • 2010.05a
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    • pp.257-260
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    • 2010
  • In this paper, we propose the computation reduction methods of LSP(Line spectrum pairs) transformation that is mainly used in CELP vocoders. In order to decrease the computational time in real root method the characteristic of four proposed algorithms is as the following. First, scheme to reduce the LSP transformation time uses mel scale. Developed the second scheme is the control of searching order by the distribution characteristic of LSP parameters. Third, scheme to reduce the LSP transformation time uses voice characteristics. Developed the fourth scheme is the control of searching interval and order by the distribution characteristic of LSP parameters. As a result of searching time, computational amount, transformed LSP parameters, SNR, MOS test, waveform of synthesized speech, spectrogram analysis, searching time is reduced about 37.5%, 46.21%, 46.3%, 51.29% in average, computational amount is reduced about 44.76%, 49.44%, 47.03%, 57.40%. But the transformed LSP parameters of the proposed methods were the same as those of real root method.

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The Characteristic Analysis of SRM Dirven by Single-pulse Mode Considering the Voltage Ripple of DC Linke (SRM의 DC linke 전압리플을 고려한 단일 펄스 구동 방식의 특성 해석)

  • Lee, Sung-Gu;Jung, Dae-Sung;Lee, Ju
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.57 no.11
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    • pp.1976-1980
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    • 2008
  • This paper deals the characteristic analysis of Switched Reluctance Motor(SRM) driven by single-pulse mode considering dc link voltage ripple. Two dimensional time-stepped Finite Element Method(FEM) is used to analyze the characteristic of SRM driven by single-pulse mode with dc link voltage ripple. The analysis results is verified by experimental test.

Design and Characteristic Analysis of Moving Magnet Type Linear Oscillatory Actuator with Spring Damper (스프링 댐퍼를 이용한 가동 자석형 리니어 진동 엑추에이터의 설계 및 특성해석)

  • 조성호;김덕현;김규탁
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.52 no.1
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    • pp.9-15
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    • 2003
  • This Paper deals with the design of Moving Magnet type Linear Oscillatory Actuator(MM-LOA) using spring damper based on the design procedure and the characteristic analysis. MM-LOA is applied to variable load such as vaccum pump and compressor, The structure of piston type is selected to reduce a noise. MM-LOA has over-displacement in starting state because of the low inertia of mover To improve the starting characteristic, spring damper is used. The optimum spring constant of spring damper is detected and in consideration of spring damper, MM-LOA redesigned. The parameter is calculated by Finite Element Method(FEM). For the dynamic characteristic analysis, time differential method composed of voltage and kinetic equation is used. The propriety of the improved model is verified through the experimental results.

Evaluation System for the Correlation Coefficient of the Assemblability and Assembly Cost of Products in Bolting (볼트를 사용한 제품에서의 조립용이성과 조립비용의 상관관계 평가시스템)

  • 목학수;문광섭;김형주
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.5
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    • pp.72-84
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    • 1998
  • This paper studies the relationship between assemblability and assembly time. After analyzing characteristic factors of bolts and parts, seven different kinds of assemblability parameters were determined according to assembly process, and assemblability was also evaluated. MTM (Method-Time Measurement) and Work factor methods were used for an estimation of assembly time. It shows the relationship can be found on the basis of characteristic factors of parts and bolts by relational graphs and numerical formulas.

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Study of SI Characteristic of Multilayer PCB with a Through-Hole Via (관통형 비아가 있는 다층 PCB의 SI 성능 연구)

  • Kim, Li-Jin;Lee, Jae-Hyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.2
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    • pp.188-193
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    • 2010
  • In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

The Study on the Wafer Surface and Pad Characteristic for Optimal Condition in Wafer Final Polishing (최적조건 선정을 위한 Pad 특성과 Wafer Final Polishing의 가공표면에 관한 연구)

  • Won, Jong-Koo;Lee, Eun-Sang;Lee, Sang-Gyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.1
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    • pp.26-32
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    • 2012
  • Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

A Study on the Electrical Properties of Ethylene Propylene Rubber by Thermal Treatment and Irradiation (방사선 및 열처리에 의한 에틸렌프로필렌 고무의 전기적 특성에 관한 연구)

  • 이성일
    • Journal of the Korea Safety Management & Science
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    • v.4 no.4
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    • pp.137-146
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    • 2002
  • In order to investigate the effect of irradiation by $^{60}Co-\gamma$rays as well as the e thermal treatment on the dielectric deterioration in ethylene propylene rubber, insulating material for electric cables used in atomic power plants, charging discharging current, residual built- up voltage and dielectric properties are measu discussed in this study. Variance in the characteristic of relative dielectric constant as a function of tem was observed in relatively high dose of irradiation. Since glass transition tem appeared at tens of degree Celsius below zero, the characteristic is attributed orientation polarization. Dielectric loss is generally increased, with increasing d irradiation in the characteristic of dielectric loss as a function of temperature, No d loss by thermal treatment was observed. Dielectric resistance decreases with increa of irradiation in the characteristic of charging current as a function of temperature be considered that dielectric resistance seems to be recovered by thermal treatm characteristic of discharging current as a function of time in the specimen less ir become similar to that of the unirradiated, when thermal treated. A peak is shown residual built- up voltage as a function of time, and the corresponding time of the shorten as increasing dose of irradiation. It is also observed that the corresponding the peak is lengthened by thermal treatment.

A Study on the Manabe Standard Form Using the Evolutionary Strategy (진화전략을 이용한 Manabe 표준형에 관한 연구)

  • 강환일;정요원
    • The Transactions of the Korean Institute of Electrical Engineers D
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    • v.50 no.2
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    • pp.65-71
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    • 2001
  • The step response of the Manabe standard form[2] has little overshoot and show almost same waveforms regardless of the order of the characteristic polynomials. In some situations it is difficult to control the rise time and settling time simultaneously of the step response of the Manabe standard form To control its rise time and settling time efficiently, We develop the Manabe standard form: We try to find out the SRFS(Slow Rise time & Fast Setting time) form which has the slower rise time and faster settling time than those fo the Manabe standard form. We also consider the other three forms: FRSS(Fast Rise time & Slow Settling time), SRFS(Slow Rise time & Fast Settling time) and SRSS(Slow Rise time & Slow Settling time) forms. In this paper, by using the evolutionary strategy, we obtain all the coefficient of the four forms we mention above. Finally, we design a controller for a given plant so that the overall system has the performance that the rise time is faster, the settling time is faster than those of the Manabe standard form.

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A jitter characteristic improved two negative feedback loop PLL (두 개의 부궤환 루프로 지터 특성을 개선한 위상고정루프)

  • Ko, Gi-Yeong;Choi, Hyuk-Hwan;Choi, Young-Shig
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2017.05a
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    • pp.197-199
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    • 2017
  • This paper presents a jitter characteristic improved phase locked loop (PLL) with an RC time constant circuit. In the RC time constant circuit, LPF's voltage is inputted to a comparator through small and large RC time constant circuits. The negative feedback loop reduces the variation of loop filter output voltage resulting in jitter characteristic improvement.

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