• 한국세라믹학회지
• /
• 제29권12호
• /
• pp.956-962
• /
• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• 한국결정성장학회:학술대회논문집
• /
• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 15TH KACG TECHNICAL MEETING-PACIFIC RIM 3 SATELLITE SYMPOSIUM SESSION 4, HOTEL HYUNDAI, KYONGJU, SEPTEMBER 20-23, 1998
• /
• pp.91-95
• /
• 1998

Selectivity of SiC deposition on a Si substrate partially covered with a masking material was investigated by introducing HCl gas into hexamethyldisilane/H2 gas system during the deposition. the schedule of the precursor and HCl gas flows was modified so that the selectivity of SiC deposition between a Si substrate and a mask material should be improved. It was confirmed that the selectivity of SiC deposition was improved by introducing HCl gas. Also, the pulse gas flow technique was effective to enhance the selectivity.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2020년도 가을 학술논문 발표대회
• /
• pp.153-154
• /
• 2020

This study aims to find out the reason that tile adhesive(type III) for ceramic tile does not harden under some conditions especially high humidity even though long curing time. Bonding strength of adhesive between substrate and ceramic tile is evaluated depending on bonding conditions such as substrate kind(concrete, board), bonding material (tile adhesive, tile cement) and curing condition(humidity 50, 70%). Based on the results, this study aimed to establish the quality of tile adhesion strength under the relevant conditions.

• 한국전기전자재료학회논문지
• /
• 제30권11호
• /
• pp.683-687
• /
• 2017

We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

• Journal of information and communication convergence engineering
• /
• 제11권1호
• /
• pp.45-49
• /
• 2013

A compact radio frequency (RF) bandpass filter (BPF) in low temperature co-fired ceramic (LTCC) is suggested for WiMAX applications. The center frequency ($f_0$) of the BPF is 5.5 GHz and its pass band or 3-dB bandwidth is 700 MHz to cover all the three major bands, low and middle unlicensed national information infrastructure (U-NII; 5.15-5.35 GHz), World Radiocommunication Conference (5.47-5.725 GHz), and upper U-NII/industrial, scientific, and medical (ISM) (5.725-5.85 GHz), for the WiMAX frequency band. A lumped circuit element design-the 5th order capacitively coupled Chebyshev BPF topology-is adopted. In order to design a compact RF BPF, a very thin ($43.18{\mu}m$) ceramic layer is used in LTCC substrate. An interdigital BPF is also designed in silicon substrate to compare the size and performance of the lumped circuit element BPF. Due to the high relative dielectric constant (${\varepsilon}_r$ = 11.9) of the silicon substrate, the quarter-wavelength resonator of the interdigital BPF can be reduced. In comparison to the 5th order interdigital BPF at $f_0$ = 5.5 GHz, the lumped element design is 24% smaller in volume and has 17 and 7 dB better attenuation characteristics at $f_0{\pm}0.75$ GHz.

• 한국세라믹학회:학술대회논문집
• /
• 한국세라믹학회 2003년도 추계총회 및 연구발표회 초록집
• /
• pp.173.1-173
• /
• 2003

• 한국정밀공학회지
• /
• 제28권7호
• /
• pp.783-788
• /
• 2011

The recent development of bio-ceramic material is being studied in various bio-material engineering field. There are lots of technical difficulties because manufacturing or bonding technique are required bio-friendliness, cleanliness and persistence. Zirconia ceramic powder is cladded on Ti-6AI-4V metallurgically by laser cladding processing. Laser cladding system with powder feeding delivery is designed and manufactured for optimum processing condition. Increasing of manufacturing speed and good quality of clad layer are achieved by application of preheating of substrate before laser cladding. The thin dilution and good clad layer on the substrate are obtained for applications of bio-materials such as the dental materials and the articulated joints of human body.

• Transactions on Electrical and Electronic Materials
• /
• 제9권1호
• /
• pp.33-37
• /
• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• 대한의용생체공학회:의공학회지
• /
• 제11권1호
• /
• pp.5-12
• /
• 1990

Calcium phosphate ceramics have been applied intensively to orthopaedic and dental implants by virtue of their osteoconductive nature. In an attempt to enhance the bone implant intergrity and Eta utility, these ceramics are deposited onto the porous surface of metallic implants. The coating procedure and the ensuing phase transformations of the ceramic alter the mechanical properties and surface chemistry of the ceramic layers as well as those of the substrate. These structural and compositional differences are directly related to the interaction mechanisms at the surface-active ceramicbone interface. Material and processing induced influences on dissolution, electrokinetic behavior, ceramic-metallic substrate interface and boRe growth enhancement are presented.

• 한국세라믹학회지
• /
• 제36권5호
• /
• pp.490-496
• /
• 1999

The sintering behavior of LTCC (low temperature cofired ceramics) chip couplers was investigated in relation with Ag diffusion at the interface of glass ceramic substrate-Ag electrode. Sintering temperature was in the range of 825$^{\circ}C$-975$^{\circ}C$. The commercial green sheet and silver electrode were used. Below 875$^{\circ}C$ the diffusion of the Ag ion into the substrate and the penetration of glassy phases into the electrode occurred due to an increase of fluidity. Thus the lectrode line was severely deformed and damaged. At 975$^{\circ}C$ the transformation of crystalline phases into glassy phases and the melting of the Ag electrode resulted in the diffusion of the considerable amount of Ag ions.