• Title/Summary/Keyword: cause of stress

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Stress Concentration Analysis of Grain Refinement in Rheology Casting Process

  • Z., Yang;P. K., Seo;J.H., Ko;Y. S., Jung;C. G., Kang
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.668-671
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    • 2004
  • The mechanics of the dendrite fragmentation is a very important aspect of grain refinement in rheocasting. In this work, the stress field of the dendrite stirred in the semisolid slurry was simulated by Metlab 6.0 software. The result shows that stress concentration at the root of the dendrite arms is great enough to cause plastic deformation though the agitation is moderate. Accordingly, dendrite fragmentation was suggested to be caused by fractured after fatigue erosion.

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Over-expression of Cu/ZnSOD Increases Cadmium Tolerance in Arabidopsis thaliana

  • Cho, Un-Haing
    • Journal of Ecology and Environment
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    • v.30 no.3
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    • pp.257-264
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    • 2007
  • Over-expression of a copper/zinc superoxide dismutase (Cu/ZnSOD) resulted in substantially increased tolerance to cadmium exposure in Arabidopsis thaliana. Lower lipid peroxidation and $H_2O_2$ accumulation and the higher activities of $H_2O_2$ scavenging enzymes, including catalase (CAT) and ascorbate peroxidase (APX) in transformants (CuZnSOD-tr) compared to untransformed controls (wt) indicated that oxidative stress was the key factor in cadmium tolerance. Although progressive reductions in the dark-adapted photochemical efficiency (Fv/Fm) and quantum efficiency yield were observed with increasing cadmium levels, the chlorophyll fluorescence parameters were less marked in CuZnSOD-tr than in wi. These observations indicate that oxidative stress in the photosynthetic apparatus is a principal cause of Cd-induced phytotoxicity, and that Cu/ZnSOD plays a critical role in protection against Cd-induced oxidative stress.

A Study on Affecting Stress Factors of EMT Students (일부 대학의 응급구조과 학생의 스트레스에 관한 고찰)

  • Jo, Jeanman;Kim, Hak-Soo;Kim, jin-Hue
    • The Korean Journal of Emergency Medical Services
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    • v.4 no.1
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    • pp.73-81
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    • 2000
  • This is a study to evaluate the effects of the stress and figure out the cause of them, I surveyed 400 students (male 257 and female 143) of health sciences colleges from 15th October to 23th October 1999. The major instruments of this study were Korean Style Self-Analysis Stress Opinionnaire. This Questionnaire contains 5 items which measure stress and health opinions or attitudes. The data were analyzed by the path analysis - with SPSS and AMOS package program. The result are as follows : 1. In the comparison of stress by sex, a potential group is highest for both of male and female (male 35.7%, female 64.3%). In high risk group, male is 10.6% and female 13.0%. In potential risk group, male is 4.1% and female 7.6%. 2. It have suggested that students' stress factors much affected with physical health and psychological health in school life(Y(Stress) = $0.813{\times}1$(Health) - $0.381{\times}2$(Mind Health) + $0.118{\times}3$(School Social) + $0.100{\times}4$(Confidence) - $0.061{\times}5$(Happiness Social)+E).

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Thermal Stress Evaluation by Elastic-Creep Analysis during Start-up of Boiler Header (보일러 헤더 기동시의 탄성 크리프 해석에 의한 열응력 평가)

  • Shin, Kyu-In;Yoon, Kee-Bong
    • Journal of the Korean Society of Safety
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    • v.24 no.2
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    • pp.17-22
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    • 2009
  • Thermal stress and elastic creeping stress analysis was conducted by finite element method to simulate start-up process of a boiler header of 500MW standard fossil power plant. Start-up temperature and operating pressure history were simplified from the real field data and they were used for the thermal stress analysis. Two kinds of thermal stress analysis were considered. In the first case only temperature increase was considered and in the second case both of temperature and operating pressure histories were considered. In the first analysis peak stress was occurred during the temperature increase from the room temperature. Hence cracking or fracture may occur at the temperature far below the operating maximum temperature. In the results of the second analysis von Mises stress appeared to be higher after the second temperature increase. This is due to internal pressure increase not due to the thermal stress. When the stress components of radial(r), hoop($\theta$) and longitudinal(z) stress were investigated, compression hoop stress was occurred at inner surface of the stub tube when the temperature increased from room temperature to elevated temperature. Then it was changed to tension hoop stress and increased because of the operating pressure. It was expected that frequent start-up and shut-down operations could cause thermal fatigue damage and cracking at the stub tube hole in the header. Elastic-creeping analysis was also carried out to investigate the stress relaxation due to creep and stabilized stress after considerable elapsed time. The results could be used for assessing the creep damage and the residual life of the boiler header during the long-tenn service.

Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

AJM을 이용한 HDM에 의한 잔류응력 계측에 관한 연구 1

  • 이택순
    • Journal of Welding and Joining
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    • v.6 no.3
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    • pp.37-42
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    • 1988
  • The Hole Drilling Method(HDM) is widely used to measure residual stresses in the welded structures. The purpose of this study is to evaluate the accuracy fo measuring residual stresses when drilling the hole by Air-abrasive Jet machine(AJM). Simulated residual stresses wre introduced by applying known stresses to steel bars. These known streses were then compared with measured stresses relaxed from hole drilling. the obtained results are summarized as follows; 1) It was possible to obtain well defined holes with the nozzle designed for this study. 2) If the hole shape is not cylindrical, critical may occur. 3) In the uniaxial strain field, the measurement error of the maximum principal stress was within .+-.10 percent. The orientation angle of the maximum principal stress was within 8.deg. from the given directioin. 4) meausrements were made varying hole depths. Little or no change of stresses occurs since holse were drilled more than the depth of the 0.6 times diameter. 5) The air-abrasive jet machining for drilling holse does not cause appreciable apparent stresses which si critical to measure residual stresses.

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Effects of Torsional Stress on the Corrosion Characteristics in the Rotor Assembly of Marine Diesel Engine Supercharger (선박용 디젤엔진 과급기 로터 접합체의 부식특성에 미치는 비틀림응력의 영향)

  • Jo, S.K.;Kong, Y.S.;Kim, Y.D.
    • Journal of Power System Engineering
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    • v.9 no.1
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    • pp.50-56
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    • 2005
  • The corrosion experiment was performed for 120 hours on the specimens in the natural seawater tank with four steps of the loaded torsional stress. The surface corrosion pattern of SCM440 area was showed global corrosion and narrow pitting, that was cause by galvanic corrosion between friction welded IN713LC and SCM440. But corrosion does not proceeded from IN713LC area. Initially, the average relative electrode potential and corrosion current were decreased suddenly, by and large, it was stabilized gradually tend to decreasing with the elapse of the immersion time. The corrosion rate was decreased by increasing the load stress, but 200 MPa specimen was showed most large value.

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Effect of Taper Tension Profiles on Radial Stress of a Wound Roll in Roll-to-roll Winding Process (롤투롤 와인딩 시스템에서 테이퍼 장력과 감김롤 응력분포에 관한 연구)

  • Lee, Changwoo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.2
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    • pp.125-131
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    • 2014
  • Winding is an integral operation in almost every roll-to-roll continuous process and center-winding is suitable and general scheme in the winding system. However, the internal stresses within center-wound rolls can cause damage such as buckling, spoking, cinching, etc. It is therefore necessary to analyze the relationship between taper tension in winding section and internal stress distribution within center-wound roll to prevent the winding failure. In this study, an optimal taper tension control method with parabolic taper tension profile for producing high quality wound roll was developed. The new logic was designed from analyzing the winding mechanism by using the stress model in center-wound rolls. The performance of the proposed taper tension profile was verified experimentally.

On Kitchen Workers' Job Stress Caused by Kitchen Facilities (주방 설비가 조리 종사원의 직무 스트레스에 미치는 영향에 관한 연구)

  • Jung, Jin-Woo
    • Culinary science and hospitality research
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    • v.13 no.3
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    • pp.263-277
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    • 2007
  • In order for a cook to cook, there should be a space called a kitchen; moreover, to prepare good food, there should be good kitchen facilities in the kitchen. With good facilities, the cook can save time and have higher productivity. On the other hand, with poor facilities, equipment and utensils, the cook can get demotivated, have poor capability, suffer from high stress and possibly can cause some diseases. Therefore, better facilities are essential for cooking environment. The purpose of this study is to find out how significant the job stress is according to the demographic characteristics. Also, how kitchen facilities and moving line influence the job stress. In order to answer above questions, 278 copies of questionnaire were made and given to cooks at hotels with five star or similar ranks. Using SPSS Win 12.0 the statistics package, frequency, factor and reliability analysis were conducted. Then, regression analysis was carried out. As a result of the test, difference analysis on statistic characteristics was partly found. In addition, facilities and moving line affected job stress. Also, working area in the kitchen inversely influenced the job stress.

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A Study on the Effects of Tele-marketer Job stress on Organizational effectiveness in Airline (항공사 텔레마케터의 직무스트레스가 조직유효성에 미치는 영향에 관한 연구)

  • Yoon, Sun-Young
    • Journal of Advanced Navigation Technology
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    • v.15 no.1
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    • pp.1-10
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    • 2011
  • The purpose of this study was to investigate relations between tele-marketer's job stress on organizational effectiveness in airline. Research finding were firstly, job stress significant negative impacted on job satisfaction and turnover intention. but the job stress didn't effect to tele-marketer's organizational commitment. Secondly, job satisfaction significantly influenced organizational commitment. Finally, job satisfaction and organizational commitment significant negative impacted on turnover intention. Based on the research findings, airline's call center tele-marketer's manager have to examine cause variables of job stress and to suggest effective methods and practice that could manage organization effectively to lessen job stress as much as possible.