• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.265-270
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• 2017

4H-SiC has attracted attention for high-power and high-temperature metal-oxide-semiconductor field-effect transistors (MOSFETs) for industrial and automotive applications. The gate oxide in the 4H-SiC MOS system is important for switching operations. Above $1000^{\circ}C$, thermal oxidation initiates $SiO_2$ layer formation on SiC; this is one advantage of 4H-SiC compared with other wide band-gap materials. However, if post-deposition annealing is not applied, thermally grown $SiO_2$ on 4H-SiC is limited by high oxide charges due to carbon clusters at the $SiC/SiO_2$ interface and near-interface states in $SiO_2$; this can be resolved via low-temperature deposition. In this study, low-temperature $SiO_2$ deposition on a Si substrate was optimized for $SiO_2/4H-SiC$ MOS capacitor fabrication; oxide formation proceeded without the need for post-deposition annealing. The $SiO_2/4H-SiC$ MOS capacitor samples demonstrated stable capacitance-voltage (C-V) characteristics, low voltage hysteresis, and a high breakdown field. Optimization of the treatment process is expected to further decrease the effective oxide charge density.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.273-276
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• 2008

In this study, microstructure and distribution of alloy elements were investigated in thermo-mechanically processed C-Mn-Si transformation induced plasticity (TRIP) steels. The microstructures of TRIP steels were investigated by using advanced analysis techniques, such as three dimensional atom probe tomography (3D-APT). At first, the microstructure was observed by using TEM. TEM results revealed that microstructure of C-Mn-Si TRIP steel was composed of ferrite, bainte, and retained austenite. 3D-APT was used to characterize atomic-scale partitioning of added elements at the phase interface. In the retained austenite phase, Ti and B were enriched with C. However, there was no fluctuation of Mn and Si concentration across the interface. Through these analysis techniques, the advanced characteristics of constituent microstructure in C-Mn-Si TRIP steels were identified.

• 전기전자학회논문지
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• 제18권4호
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• pp.620-624
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• 2014

본 연구에서는, Ni/CNT/$SiO_2$ 구조의 4H-SiC MIS 캐패시터를 제작하고 전기적 특성을 조사하였다. 이를 통하여 4H-SiC MIS 소자에서 탄소나노튜브의 역할을 분석하고자 하였다. 탄소나노튜브는 이소프로필알코올과 혼합하여 $SiO_2$ 표면에 분산하였다. 소자의 전기적 특성 분석을 위하여 300-500K의 온도 범위에서 소자의 정전용량-전압 특성을 측정하였다. 밴드 평탄화 전압은 양의 방향으로 shift되었다. 정전용량-전압 그래프로부터 계면 포획 전하 밀도 및 산화막 포획 전하 밀도가 유도되었다. 산화막의 상태는 4H-SiC MIS 구조의 계면에서 전하 반송자 또는 결함 상태와 관련된다. 온도가 증가함에 따라 밴드 평탄화 전압은 음의 방향으로 shift되는 결과를 얻었다. 실험 결과로부터, Ni과 $SiO_2$ 계면에 탄소나노튜브를 첨가함에 따라 4H-SiC MIS 캐패시터의 게이트 특성을 조절 가능할 것으로 판단된다.

• 접착 및 계면
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• 제14권2호
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• pp.75-81
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• 2013

SiC 나노입자를 이용하여 에폭시 복합재료를 제조할 수 있다. SiC 형상에 따른 영향으로 복합재료의 계면 물성이 변화된다. SiC의 형상에 따른 계면 상태의 변화를 관찰하기 위해 베타 형태, 위스커 형태의 SiC 나노입자를 사용하였다. 나노입자에 대한 분산도를 평가하기 위해 커패시턴스를 이용한 분산도 평가방법을 활용하였다. FE-SEM을 이용하여 SiC 나노입자의 활용에 따른 나노복합재료의 파단면을 관찰하여, 그 강화 효과를 비교 분석하였다. 탄소섬유와 SiC 나노입자가 함유된 에폭시를 이용한 복합재료에 계면 물성을 비교하기 위해 층간전단강도 평가법과 계면전단강도 평가법을 이용하였다. 복합재료의 계면 물성을 강화하기 위해서는 베타 형태의 SiC 나노입자를 활용할 경우가 위스커 입자를 이용한 경우보다 높은 계면 강도를 나타냈다.

• 한국주조공학회지
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• 제17권1호
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• pp.28-35
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• 1997

SiC whisker and $Al_2O_3-SiO_2$ short fiber reinforced AC8A, AC8B and AC8B(J) marix composites were fabricated by squeeze casting method. Preform deformation, change of reinforcement volumefraction and formation of macro-segregation in two composites were investigated by using micro Vickers hardness test, analysis of macro and micro structures with OM, SEM and EDAX. $Al_2O_3-SiO_2$ short fiber preform manufactured with 5% $SiO_2$ binder in this study was considerably deformed and cracked, nevertheless, the short fibers were distributed homogeneously in the composites. In SiC whisker reinforced composites, on the other hand, preform deforming and cracking were not occurred, however, macro segregation zone formed along the infiltration routes by interface reaction during infiltration of molten metal into the preform was observed at center-low area in the composites. The decrease of hardness in the macro segregation zone resulted from the depletion of Si and Mg atoms.

• 대한금속재료학회지
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• 제46권12호
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• pp.830-834
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• 2008

NiSi is currently being employed in 45 nm CMOS devices as a contact material. We employed a first principles calculation to understand the movements of atoms when Co, Pd, and Pt were added to tetragonal-NiSi on Si (001). The Ni atoms in the tetragonal-NiSi/Si (001) favored away from the original positions along positive c-direction in a systematic way during the energy minimization. Two different Ni sites were identified at the interface and the bulk, respectively. The Ni site at the interface farther away from the interface was more favorable for Pd and Pt substitution. Co, however, prafered the bulk site to the interface site, unlike Pd and Pt.

• 한국세라믹학회지
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• 제54권4호
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• pp.340-348
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• 2017

$SiC_f/SiC$ composites were joined using a $60{\mu}m-thick$ $Ti_3AlC_2$ or $Ti_3SiC_2$ MAX phase tape. The filler tape was inserted between the $SiC_f/SiC$ composites containing a 12 wt.% $Al_2O_3-Y_2O_3$ sintering additive. The joining was performed to a butt-joint configuration at $1600^{\circ}C$ or $1750^{\circ}C$ in an Ar atmosphere by applying 3.5 MPa using a hot press. Microstructural and phase analyses at the joining interface confirmed the decomposition of $Ti_3AlC_2$ and $Ti_3SiC_2$, indicating the joining by solid-state diffusion. The results showed sound joining interface without the presence of cracks. Joining strengths higher than 150 MPa could be obtained for the joints using $Ti_3AlC_2$ or $Ti_3SiC_2$ at $1750^{\circ}C$, while those for joined at $1600^{\circ}C$ decreased to 100 MPa approximately without the deformation of the joining bodies. The thickness of initial filler tape was reduced significantly after joining because of the decomposition and migration of MAX phase owing to the plasticity at high temperatures.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.267-270
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• 2003

We have studied the interfacial diffusion phenomena and the role of ${\alpha}-Al_2O_3$ buffer layer as a diffusion barrier in the $Ba-ferrite/SiO_2$ magnetic thin films for high-density recording media. In the interface of amorphous Ba-ferrite ($1900-{\AA}-thick)/SiO_2$ thin film during annealing, the interfacial diffusion started to occur at ${\sim}700^{\circ}C$. As the annealing temperature increased up to $800^{\circ}C$, the interfacial diffusion abruptly proceeded resulting in the high interface roughness and the deterioration of the magnetic properties. In order to control the interfacial diffusion at the high temperature, we introduced ${\alpha}-Al_2O_3$ buffer layer ($110-{\AA}-thick$) in the interface of $Ba-ferrite/SiO_2$ thin film. During the annealing of $Ba-ferrite/{\alpha}-Al_2O_3/SiO_2$ thin film even at ${\sim}800^{\circ}C$, the interface was very smooth. The smooth interface of the film was also clearly shown by the cross-sectional FESEM. The magnetic properties, such as saturation magnetization 3nd intrinsic coercivity, were also enhanced, due to the inhibition of interfacial diffusion by the ${\alpha}-Al_2O_3$ buffer layer. Our study suggests that the ${\alpha}-Al_2O_3$ buffer layer act as a useful interfacial diffusion barrier in the $Ba-ferrite/SiO_2$ thin films.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.168-168
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• 2009

고효율 실리콘 이종접합 태양전지 제작을 위한 요소기술 중 a-Si:H/c-Si 간의 계면 안정화는 태양전지 효율에 중요한 역할을 한다. 본 연구에서는 n-type 결정질 실리콘 기판을 사용하여, 소수전하들의 재결합을 방지하고, 계면 안정화를 실행하는 방안으로 실리콘 기판 습식 세정을 수행하였다. 반도체 공정에서 일반적으로 알려진 RCA 세정기법에 HF 세정을 마지막공정으로 추가하여 자연 산화막과 기타 불순물을 더욱 효과적으로 제거할 수 있도록 실험을 진행하였다. 마지막 공정으로 추가된 HF 세정에 의한 a-Si:H/c-Si 계면 안정화 효과를 관찰하기 위하여 HF농도와 HF 세정시간에 따른 소수반송자 수명을 측정하였다. 또한 HF 세정 이후 공정의 영향을 확인하기 위하여 PE-CVD법으로 a-Si:H 박막 증착 이전 실리콘 기판의 온도와 상온에서 머무는 시간에 따른 a-Si:H/c-Si 계면안정화 특성을 분석하였다. 본 실험을 통해 HF세정공정이 계면특성에 미치는 영향을 확인하였으며 실리콘 기판 습식 세정이 이종접합태양전지 특성에 미치는 영향을 분석하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.245-247
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• 2007

Sn-base solder bump is mainly used in micro-joining for flip chip package. The quantity of intermetallic compounds that was formed between Cu pad and solder interface importantly affects reliability. In this research, micro-bump was fabricated by two binary electroplating and the intermetallic compounds(IMCs) was estimated quantitatively. When the micro Sn-Ag solder bump was made by electroplating, SiC powder was added in the plating solution for protecting of intermetallic growth. Then, the intermetallic compounds growth was decrease with increase of amount of SiC power. However, if the mount of SiC particle exceeds 4 g/L, the effect of the growth restraint decrease rapidly.