• 한국소음진동공학회논문집
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• 제13권8호
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• pp.598-604
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• 2003

In this paper a general solution method is presented to obtain the unbalance response orbit from the finite element based equations of motion of a gear-coupled two-shaft rotor-bearing system, whose shafts rotate at their different speeds from each other. Particularly, are proposed analytical solutions of the maximum and minimum radii of the orbit. The method has been applied to analyze the unbalance response of a 800 refrigeration-ton turbo-chiller rotor-bearing system having a bull-pinion speed increasing gear. Bumps in the unbalance response of the driven high speed compressor rotor system have been observed at the first torsional natural frequency due to the coupling effect of lateral and torsional dynamics. Further, the proposed analytical solutions have agreed well with those obtained by a full numerical approach. The proposed analytical solutions can be generally applied to obtain the maximum and minimum radii of the unbalance response orbits of dual-shaft rotor-bearing systems coupled by bearings as well.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.1276-1279
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• 2007

The main objectives of the Load/Unload are no slider-disk contact and no media damage. But, it remains unsolved technical problems on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. Keeping in mind of these points, to prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. First, referring to the simulation results, we select the optimal bump shapes to improve unload performance by unload analysis. Second, the disk bump is mechanically manufactured by pressing disk surface using tungsten tips. The bumps are variously processed by changing pressing pressure of tungsten tips. After confirming bump shape by nano-scanner, the optimal bump shape is applied to experimental unload process. Through this experiment, it is conformed that the unload performance was improved by using the optimal disk bump to prevent the slider-disk contact.

• Tribology and Lubricants
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• 제22권5호
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• pp.252-259
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• 2006

Air foil bearing supports the rotating journal using hydrodynamic force generated at thin air film. The bearing performances, stiffness, damping coefficient and load capacity, depend on the rotating speed and the performance of the elastic foundation, bump foil. The main focus of this study is to decide the dynamic performance of corrugated bump foil, structural stiffness and Coulomb damping caused by friction between bump foil and top foil/bump foil and housing. Structural stiffness is determined by the bump shape (bump height, pitch and bump thickness), dry-friction, and interacting force filed up to fixed end. So, the change of the characteristics was considered as the parameters change. The air foil bearing specification for analysis follows the general size; diameter 38.1 mm and length 38.1 mm (L/D=1.0). The results show that the stiffness at the fixed end is more than the stiffness at the free end, Coulomb damping is more at the fixed end due to the small displacement, and two dynamic characteristics are dependent on each other.

• Tribology and Lubricants
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• 제23권3호
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• pp.123-129
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• 2007

This paper presents a theoretical model for the analysis of double-bumped AFBs. The stiffness and damping coefficients of the double bump vary depending on the external load and its friction coefficient. In the case of a lightly loaded condition where only the upper bump contributes to deformation, the double bump is in the single active region. In the case of a heavily loaded condition where both the upper and lower bumps contribute to deformation, the double bump is in the double active region. So the double bump can be either in the single or double active region depending on vertical deflection. The equivalent stiffness and damping coefficients of the bump system are derived from the vertical and horizontal deflection of the bump, including the friction effect. A static and dynamic performance analysis is carried out by using the finite difference method and the perturbation technique. The results of the performance analysis for a double-bumped AFB are compared with those obtained for a single-bumped AFB. This paper successfully proves that a double bumped AFB has higher load capacity, stiffness, and damping than a single-bumped AFB in a heavily loaded condition.

• 한국전기전자재료학회논문지
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• 제23권12호
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.

• 한국방송∙미디어공학회:학술대회논문집
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• 한국방송공학회 2014년도 추계학술대회
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• pp.226-227
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• 2014

We demonstrate nanoscale local anodic oxidation (LAO) patterning on few layer graphene using atomic force microscope (AFM) at room temperature and normal atmosphere. We focus on the humidity dependency in nanoscale oxidation of graphene. The relationship between the oxidation size and the AFM setting values, such as set point, tip speed, and humidity are observed. By changing these values, proper parameters were found to produce features on demand size. This technique provides an easy way to form graphene oxide lithography without any chemical resists. We have obtained oxidation size down to 50-nm with 6-nm-height oxide barrier line with $0.1{\mu}m/s$ tip scanning speed and micrometer size symbols on a graphene flake. We attribute the bumps to local anodic oxidation on graphene surface and combination of oxygen ions into the graphene lattice.

• Journal of Welding and Joining
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• 제19권5호
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• pp.520-525
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• 2001

The Sn-Pb eutectic solder bump formation ($150\mu\textrm{m}$ diameter, $250\mu\textrm{m}$ pitch) by electroplating was studied for flip chip package fabrication. The effect of current density and plating time on Sn-Pb deposit was investigated. The morphology and composition of plated solder surface was examined by scanning electron microscopy. The plating thickness increased wish increasing time. The plating rate became constant at limiting current density. After the characteristics of Sn-Pb plating were investigated, Sn-Pb solder bumps were fabricated in optimal condition of $7A/dm^$. 4hr. Ball shear test after reflow was performed to measure adhesion strength between solder bump and UBM (Under Bump Metallurgy). The shear strength of Sn-Pb bump after reflow was higher than that of before reflow.

• 한국임상수의학회지
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• 제33권4호
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• pp.221-224
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• 2016

An 8 month-old male Maltese (weighing 2.0 kg) was referred with loud heart murmur at routine physical exam in local animal clinic. Electrocardiogram found left ventricular hypertrophy pattern (4.5 mV R-wave). Diagnostic imaging studies revealed the elongation of left ventricle (LV) with classic triple bumps on the main pulmonary artery, aorta and left atrium on the ventrodorsal view of radiograph. Echocardiography revealed patent ductus arteriosus (PDA) duct and continuous turbulent shunt flow (maximal velocity 4.83 m/s) between the aorta and pulmonary artery with left to right direction. The PDA in this dog was successfully closed through femoral vein (transvenous approach) using a 5 mm Amplatz$^{(R)}$ Canine Duct Occluder. To the best of author's knowledge, this is the first case of PDA occlusion treated with Amplatz Canine Duct Occluder through femoral vein.

• Journal of Welding and Joining
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• 제21권2호
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• ETRI Journal
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• 제35권6호
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.