• Title/Summary/Keyword: bumps

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Development of Expandable Steel Pipe Piles to Improve Bearing Capacity (지지력 향상을 위한 확장형 강관말뚝에 관한 연구)

  • Kim, Uiseok;Kim, Junghoon;Kim, Jiyoon;Min, Byungchan;Choi, Hangseok
    • Journal of the Korean GEO-environmental Society
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    • v.22 no.12
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    • pp.5-13
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    • 2021
  • Expandable steel pipe piles have been developed to ensure stability and reduce construction costs during underground floor remodeling and extension work. Expandable steel pipe piles are more economical and stable than micropiles. Extensible steel pipe pile is a method of improving the performance of steel pipes by expanding steel pipes underground. In this paper, the changes in buckling strength according to the shape of steel pipes in an extended steel pipe pile were identified, a numerical analysis model was developed to determine the expended part effect of bumps due to steel pipe expansion, and the optimal steel pipe expansion was calculated through material tests. The larger the expansion diameter of the steel pipe and the greater the number of expanded part, the greater the buckling strength. Numerical results showed that the number of expanded part has a greater effect on buckling strength than the expansion rate. When the expansion rate is more than 1.2 times, it can be seen that as the number of expanded part increases, the effect of increasing buckling strength increases significantly. It was also noted that the expanded part effect of the bumps occur significantly when the extension angle is less than 45° and the expansion rate is 1.3 times higher. When the steel pipe is failure, the expanded rate is 20 to 32%, averaging 25.4%. Through the material test, it was analyzed that it is desirable to limit the maximum expansion rate for performing steel pipes to 16%.

Virtual Prototyping Simulation for a Passenger Vehicle

  • Kwon Son;Park, Kyung-Hyun;Eom, Sung-Sook
    • Journal of Mechanical Science and Technology
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    • v.15 no.4
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    • pp.448-458
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    • 2001
  • The primary goal of virtual prototyping is to eliminate the need for fabricating physical prototypes, and to reduce cost and time for developing new products. A virtual prototyping seeks to create a virtual environment where the development of a new model can be flexible as well as rapid, and experiments can be carried out effectively concerning kinematics, dynamics, and control aspects of the model. This paper addresses the virtual environment used for virtual prototyping of a passenger vehicle. It has been developed using the dVISE environment that provides such useful features as actions, events, sounds, and light features. A vehicle model including features, and behaviors is constructed by employing an object-oriented paradigm and contains detailed information about a real-size vehicle. The human model is also implemented not only for visual and reach evaluations of the developed vehicle model, but also for behavioral visualization during a crash test. For the real time driving simulation, a neural network model is incorporated into the virtual environment. The cases of passing bumps with a vehicle are discussed in order to demonstrate the applicability of a set of developed models.

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Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging (초음파 플립칩 접합 모듈의 위상최적화 설계 및 성능 실험)

  • Kim, Ji Soo;Kim, Jong Min;Lee, Soo Il
    • Journal of Welding and Joining
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    • v.30 no.6
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    • pp.113-119
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    • 2012
  • Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

Fault Detector and Length Measurement of Electric Cables Based on Frequency Waves

  • Chawporn, Talerngkiat;Chaikla, Amphawan;Sriratana, Witsarut;Trisuwannawat, Thanit
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.45-48
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    • 2003
  • This research presents an approach to simultaneously detect the faults and measure the length of the electric cables. This approach is easy to use and inexpensive. Moreover, it can be applied to any kinds and sizes of the electric cable. This paper uses 750V $4{\times}4$ Sq.mm. cables. The concept is to send the 2 kHz pulse into the electric cable. When the pulse bumps into the fault, it bounces back. Then, the total time the pulse travels back and forth and the shape of the pulse after bumping are inspected using the pulse detector and pulse converter. Next, the signal obtained is modulated with 10 MHz carrier pulse to segregate into several small pulses before sending to 8-bit counter. The length of the electric cable can be obtained using microcontroller and the location of the faults can be seen on the LCD screen. This approach can be used to inspect the electric cables with the length of at least 15 m.

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High frequency measurement and characterization of ACF flip chip interconnects

  • 권운성;임명진;백경욱
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.11a
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    • pp.146-150
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    • 2001
  • Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

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Electromigration of Sn-3.5 Solder Bumps in Flip Chip Package (플립칩 패키지내 Sn-3.5Ag 솔더범프의 electromigration)

  • 이서원;오태성
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.4
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    • pp.81-86
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    • 2003
  • Electromigration of Sn-3.5Ag solder bump was investigated using flip chip specimens which consisted of upper Si chip and lower Si substrate. While the resistance of the flip chip sample did not almost change until the time right before the failure, the resistivity increased abruptly at the moment when complete failure of the solder joint occurred in the flip chip sample. At current densities of $3\times 10^4$$4\times 10^4$A/$\textrm{cm}^2$, the activation energy for electromigration of the Sn-3.5Ag solder bump was characterized as ∼0.7 eV. Failure of the Sn-3.5Ag solder bump occurred at the solder/UBM interface due to the formation and propagation of voids at cathode side of the solder bump.

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Sketch-based 3D modeling by aligning outlines of an image

  • Li, Chunxiao;Lee, Hyowon;Zhang, Dongliang;Jiang, Hao
    • Journal of Computational Design and Engineering
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    • v.3 no.3
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    • pp.286-294
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    • 2016
  • In this paper we present an efficient technique for sketch-based 3D modeling using automatically extracted image features. Creating a 3D model often requires a drawing of irregular shapes composed of curved lines as a starting point but it is difficult to hand-draw such lines without introducing awkward bumps and edges along the lines. We propose an automatic alignment of a user's hand-drawn sketch lines to the contour lines of an image, facilitating a considerable level of ease with which the user can carelessly continue sketching while the system intelligently snaps the sketch lines to a background image contour, no longer requiring the strenuous effort and stress of trying to make a perfect line during the modeling task. This interactive technique seamlessly combines the efficiency and perception of the human user with the accuracy of computational power, applied to the domain of 3D modeling where the utmost precision of on-screen drawing has been one of the hurdles of the task hitherto considered a job requiring a highly skilled and careful manipulation by the user. We provide several examples to demonstrate the accuracy and efficiency of the method with which complex shapes were achieved easily and quickly in the interactive outline drawing task.

Antiblurry Dejitter Image Stabilization Method of Fuzzy Video for Driving Recorders

  • Xiong, Jing-Ying;Dai, Ming;Zhao, Chun-Lei;Wang, Ruo-Qiu
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.11 no.6
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    • pp.3086-3103
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    • 2017
  • Video images captured by vehicle cameras often contain blurry or dithering frames due to inadvertent motion from bumps in the road or by insufficient illumination during the morning or evening, which greatly reduces the perception of objects expression and recognition from the records. Therefore, a real-time electronic stabilization method to correct fuzzy video from driving recorders has been proposed. In the first stage of feature detection, a coarse-to-fine inspection policy and a scale nonlinear diffusion filter are proposed to provide more accurate keypoints. Second, a new antiblurry binary descriptor and a feature point selection strategy for unintentional estimation are proposed, which brought more discriminative power. In addition, a new evaluation criterion for affine region detectors is presented based on the percentage interval of repeatability. The experiments show that the proposed method exhibits improvement in detecting blurry corner points. Moreover, it improves the performance of the algorithm and guarantees high processing speed at the same time.

Estimation of Subjective Evaluations for Impact Sound and Analysis of the Effects for Parts of a Car (자동차 임팩트 소음에 대한 주관적 평가 및 차량 개발에 응용)

  • Park, Sang-Won;Lee, Sang-Kwon;Bae, Byung-Kuk
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.5
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    • pp.37-44
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    • 2010
  • Impact noise is induced in a car when it is driven on a harsh road or over some bumps. This noise occurs with the very high level of sound, which affects passengers in some way or other. Although it is impossible to clearly remove such noise, it is necessary to research an improvement in sound quality for impact noise. A new sound metric for impact sound is presented. This metric is verified by comparison between mean subjective ratings and several sound metrics. In this paper, more objective attributes are considered, which the attributes are expressing the level and modulation of sound. Three sound metrics are employed to get impact sound indexes for each course by the method of multiple linear regressions. The indexes are verified by considering the correlation between the estimated values from the multiple linear regressions and the mean subjective ratings by evaluators. Also, the subjective ratings on the indexes are estimated for the case in which some parts of suspension system are changed. The estimated ratings represent more reasonable or acceptable ratings. Thus, such indexes can be used for modification of the parts of suspension system under considering a good sound quality.

Part tolerancing through multicale defect analysis

  • Petitcuenot, Mathieu;Anselmetti, Bernard
    • International Journal of Aeronautical and Space Sciences
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    • v.17 no.1
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    • pp.109-119
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    • 2016
  • When manufactured parts undergo large deformations during the manufacturing process, the global specifications of a part based on the concept of tolerance zone defined in the ISO 1101 standard [1] enable one to control the part's global defects. However, the extent of this tolerance zone is too large when the objective is to minimize local defects, such as hollows and bumps. Therefore, it is necessary to address local defects and global defects separately. This paper refers to the ISO 10579 standard [2] for flexible parts, which enables us to define a stressed state in order to measure the part by straightening it to simulate its position in the mechanism. The originality of this approach is that the straightening operation is performed numerically by calculating the displacement of a cloud of points. The results lead to a quantification of the global defects through various simple models and enable us to extract local defects. The outcome is an acceptable tolerance solution. The procedure is first developed for the simple example of a steel bar with a rectangular cross section, then applied to an industrial case involving a complex 3D surface of a turbine blade. The specification is described through ISO standards both in the free state and in the straightened state.