• Journal of computational fluids engineering
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• v.10 no.3 s.30
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• pp.19-26
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• 2005

The purpose of this paper is the study on the characteristics of an inlet system with shock/boundary layer interactions by using various types of bumps which are substituted for the conventional bleeding system in supersonic inlet. in this study a comprehensive numerical analysis has been performed to understand the three-dimensional flow field including shock/boundary layer interaction and growth of turbulent boundary layer that might occur around a three-dimensional bump in a supersonic inlet. The characteristics of boundary layer seen in the current numerical simulations indicate the potential capability of a three-dimensional bump to control shock/boundary layer interaction in supersonic inlets.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.56-56
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• 2013

Sn-Ag 전해도금시 도금욕의 Sn 이온의 농도, Ag 이온의 농도, MSA 함량 및 인가 전류밀도 등의 인자들이 솔더의 조성과 표면형상에 미치는 영향에 관하여 연구하였다. 본 연구를 통하여 20의 미세피치와 15의 범프 높이를 가지는 공정 Sn-Ag 솔더 범프를 형성하였다. 도금된 솔더의 조성은 XRF와 ICP 분석을 통하여 확인하였고 형상은 광학현미경과 SEM을 통해 분석하였다. 또한 void 발생 여부 확인을 위해 FIB장비 및 X-Ray inspection장비를 사용 내부 Void 형상을 분석하였다. 전해 도금시 작용하는 주요 도금인자의 변경을 통해 15ASD에서 양호한 Bump를 구현하였다.

• KSTLE International Journal
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• v.3 no.2
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• pp.114-118
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• 2002

In this work, head-disk interactions are studied when flying height becomes lower than laser bump height on the landing zone of a disk. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps. Conventional and padded pico sliders sweep between landing Bone and data zone and, then, the dynamic behavior of the pico sliders and head-disk impacts are investigated using AE and stiction/friction signals. After 200n cycle-sweep tests, bearing analysis and AFM analysis indicate that there are some signs of wear and plastic deformation in the landing zone of a disk, although AE and stiction/friction signals are not significantly changed during the sweep tests. The experimental results of this paper suggest that in CSS tests at component level, more rigorous examination methods of wear and plastic deformation might be necessary as flying height becomes getting lower.

• Journal of Biosystems Engineering
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• v.23 no.4
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• pp.327-334
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• 1998

This work was intended to determine the optimum values of the cab suspension parameters by a simulation method in order to minimize the seat accelerations of agricultural tractors in the frequencies lower than 50Hz. A dynamic model of cab motions was developed and verified using a tractor excited over half-sine bumps on a concrete test road. A simulation program based on the model was also developed. A method was proposed to determine the optimum values of the suspension parameters. It was found that the natural frequencies of the cab and seat suspensions must be apart as far as possible until the sum of seat and cab accelerations is minimized, which also reduces the seat accelerations maximally.

• Journal of Astronomy and Space Sciences
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• v.23 no.2
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• pp.91-96
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• 2006

We use near-infrared observations of eight selected Galactic globular clusters to estimate their distances by comparing the observed and theoretically predicted K magnitudes of the red giant branch bumps and tips. The K magnitude levels of the RGB bump and tip have been measured from the luminosity function of the selected RGB stars in the clusters. Theoretical absolute $M_k$ magnitudes of the RGB bump and tip are taken from the Yonsei-Yale isochrones. Comparing the observed apparent K magnitude with the derived absolute $M_k$ magnitude, we calculate the distance moduli of the clusters. We discuss the dependency of the derived distance modulus on the cluster age and the uncertainty of the distance measurement from the near-infrared photometry of the RGB bump and tip.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.456-462
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• 2002

In the present work, a low cost and fine pitch bumping process by electroless Ni/immersion Au UBM (under bump metallurgy) and stencil printing for the solder bump on the Al pad is discussed. The Chip used this experimental had an array of pad 14x14 and zincate catalyst treatment is applied as the pretreatment of Al bond pad, it was shown that the second zincating process produced a dense continuous zincating layer compared to first zincating. Ni UBM was analyzed using Scanning electron microscopy, Energy dispersive x-ray, Atomic force microscopy, and X-ray diffractometer. The electroless Ni-P had amorphous structures in as-plated condition. and crystallized at 321 C to Ni and Ni$_3$P. Solder bumps are formed on without bridge or missing bump by stencil print solder bump process.

• Korean journal of applied entomology
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• v.59 no.1
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• pp.23-24
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• 2020

ecently, dandelion leaf-gall midge of the genus Cystiphora, forming reddish-purple round bumps on dandelion (Taraxacum spp.) have been reported for the first time in Gyeonggi-do, Korea. Therefore, we report the observed area, damage pattern, and morphological characteristics of developmental stages.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.4
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• pp.15-26
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• 1998

Full car model is needed for investigating as a entire dynamics of vehicle. In this study, 7DOF of full car model's dynamics is selected. This paper proposes the output feedback controller based on optimal control theory. Input data and output data from the optimal controller are used for neural network system identification of the suspension system. To do system identification, neural network which has robustness against nonlinearities and disturbances is adapted. This study uses back-propagation algorithm to train a multil-layer neural network. After obtaining a neural network model of a suspension system, a neuro-controller is designed. Neuro-controller controls suspension system with off-line learning method and multistep ahead prediction model based on the neural network model and a neuro-controller. The optimal controller and the neuro-controller are designed and then, both performances are compared through. For simulation, sinusoidal and rectangular virtual bumps are selected.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.