Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
권호 표지
DOI QR코드

DOI QR Code

3D Accuracy Enhancement of BGA Shiny Round Ball Using Optical Triangulation Method

광삼각법을 이용한 고반사 BGA 볼의 정밀 높이 측정 방법

  • Joo, Byeong Gwon (Department of Research and Development, Intekplus Co., Ltd.) ;
  • Cho, Taik Dong (Department of Mechanical Design Engineering, Chungnam University)
  • 주병권 (인텍플러스 개발부) ;
  • 조택동 (충남대학교 기계설계공학과)
  • Received : 2015.04.17
  • Accepted : 2015.07.22
  • Published : 2015.09.01
Download PDF
⟨ Previous Next ⟩

Abstract

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.

Keywords

References

  1. Choi, W., Park, Y., and Lee, J., "The Method of Precision Three Dimension Height Inspection by Laser Scan," The Journal of Korean Institute of Information Technology, Vol. 9, No. 12, 2011.
  2. Kim, M.-Y., "Three-Dimensional Machine Vision System Based on Moire Interferometry for the Ball Shape Inspection of Micro BGA Packages," Journal of the Microelectronics and Packaging Society, Vol. 19, No. 1, pp. 81-87, 2012. https://doi.org/10.6117/kmeps.2012.19.1.081
  3. Ko, K. W., Sim, J. H., and Kim, M. Y., "A High-Speed White-Light Scanning Interferometer for Bump Inspection of Semiconductor Manufacture," J. Korean Soc. Precis. Eng., Vol. 30, No. 7, pp. 702-707, 2013. https://doi.org/10.7736/KSPE.2013.30.7.702
  4. Koo, Y. M. and Lee, K. H., "Development of 3D Inspection Equipment Using White Light Interferometer with Large FOV," Journal of Korean Institute of Intelligent Systems, Vol. 22, No. 6, pp. 694-699, 2012. https://doi.org/10.5391/JKIIS.2012.22.6.694
  5. Kim, H.-J., Yoon, D.-H., and Kim, H.-I., "3D Precision Measurement of Scanning Moire Using Line Scan Camera," Korean Journal of Optics and Photonics, Vol. 19, No. 5, pp. 376-380, 2008. https://doi.org/10.3807/HKH.2008.19.5.376
  6. Park, Y.-S. and Kim, J.-S., "A Study on the Vision Inspection System for the Defects Detection of Micro- BGA Device," J. Korean Soc. Precis. Eng., Vol. 24, No. 4, pp. 44-56, 2007.
  7. Lee, S.-S., Park, Y. S., Kim, J. S., and Joo, H. N., "The Development of a Stereo Vision Algorithm for Height Measurement of Ball Peak Point of BGA Device," Journal of the Korean Institute of Illuminating and Electrical Installation Engineers Conference, pp. 431-436, 2005.
  8. Kim, J.-S. and Park, Y.-S., "A Study on the Measurement Algorithm for the Ball Height of BGA Device Using Stereo Vision," Journal of the Korean Institute of Illuminating and Electrical Installation Engineers, Vol. 20, No. 6, pp. 26-34, 2006. https://doi.org/10.5207/JIEIE.2006.20.6.026
  9. Amkor Technology, "Flip Chip Packaging Technology Solutions," http://www.amkor.com/go/Flip-Chip-Packaging (Accessed 13 August 2015)
  10. Van Assen, H. C., Egmont-Petersen, M., and Reiber, J. H., "Accurate Object Localization in Gray Level Images Using the Center of Gravity Measure: Accuracy Versus Precision," IEEE Transactions on Image Processing, Vol. 11, No. 12, pp. 1379-1384, 2002. https://doi.org/10.1109/TIP.2002.806250