• Journal of the Computational Structural Engineering Institute of Korea
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• v.33 no.3
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• pp.187-192
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• 2020

To reduce fuel consumption by reducing the weight of the deck of a dump truck and to design an eco-friendly deck, accurate structural analysis is required. To date, the load on the deck has been calculated based on the hydrostatic pressure or by applying the earth pressure theory. However, these methods cannot be used to determine the non-uniformity of the load on the deck. Load distribution varies depending on the size distribution and interaction of aggregate particles. Compared with the finite element method, the discrete element method can simulate the behavior of aggregate particles more effectively. In this study, major properties were obtained by measuring bulk density and repose. The deck of a 15 ton dump truck was simulated using the obtained properties and bumping, breaking, and turning load conditions were applied. EDEM, which is a discrete element analysis software, was employed. The stress and strain distribution of the deck were calculated by NASTRAN and compared with the measured values. The study revealed that the results derived from a DEM simulation were more accurate than those based on mathematical assumption.

• Transactions of the Korean Society of Automotive Engineers
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• v.25 no.1
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• pp.28-34
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• 2017

The vehicle stabilizer link is one of the suspension components that reduces the bumping and rolling during vehicle driving. However, this stabilizer link could be a source of the abnormal noises when its free gaps have higher than normal values. Therefore, the current study aims at investigating the quantitative relationships between the abnormal noises and free gaps of the vehicle stabilizer links, as well as the length of time that the vehicle stabilizer links could be used without generating abnormal noises. In this study, the abnormal noises were measured based on the magnitude of the stabilizer link vibration, while the free gaps were quantified through the force-displacement curves of the stabilizer links. Harsh durability tests were also conducted in order to quantify the operating cycles of the stabilizer links before generating the abnormal noises, along with the concomitant measurements of the free gaps. The current results showed that the abnormal noises of the stabilizer links were detected when its free gaps were larger than 0.12 mm. However, the free gaps of the stabilizer links, which are bigger than 0.1 mm, produced the abnormal noises at 1.5 million cycles under harsh durability test conditions. A parametric study in the future that would reflect the different shapes and sizes of the stabilizer links for diverse vehicles could determine more generalized relationships between the abnormal noises and free gaps of the vehicle stabilizer links.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.18 no.1
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• pp.29-35
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• 2018

Safety accidents are frequently occurring in day care centers in recent years. The number of types of safety accidents is bumping into, falling, burning, school bus accident, insertion... etc., and the number of children who have died due to such accidents is increasing steadily every year. Therefore, it is urgent to prevent accidents at day care centers. IoT (Internet of Things) is managed by connecting various sensors and related products from the living space to the Internet in order to prevent them from being dangerous. In particular, IoT products can be automatically controlled by smart phones and sensors anytime and anywhere, thus saving energy, time, convenience and prompt accuracy. This paper proposes a research model to prevent and respond to disasters by using SK LoRa communication network and Arduino, which are Internet access networks for building disaster management in schools, kindergartens and day care centers. And various sensors needed for building disaster management express various safety states in the building and suggests a system that can control the residential environment by transmitting and receiving data to smart phone.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.82-82
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• 2010

표면실장 공법을 통해 CSP 패키지를 보드에 실장 하는데 있어 무연솔더 접합부의 신뢰성에 영향을 미치는 인자 중 가장 중요한 것은 접합부에 형성되는 IMC (Intermetallic compound, 금속간화합물)인 것으로 알려져 있다. 접합부의 칩 부분에는 솔더와 칩의 UBM (Under bump metalization)이 접합하여 IMC가 형성되나, 보드 부분에는 솔더와 보드의 UBM 뿐만 아니라 그 사이에 솔더 페이스트가 함께 접합되어 IMC가 형성된다. 본 연구에서는 패키지의 신뢰성 연구를 위해 솔더 페이스트의 유무 및 두께에 따른 무연 솔더 접합부의 미세조직의 변화를 분석하였다. 본 실험에서는 Sn-3.0(Wt.%)Ag-0.5Cu 조성과 본 연구진에 의해 개발된 Sn-Ag-Cu-In 조성의 직경 $450{\mu}m$ 솔더 볼을 사용하였으며, 솔더 페이스트는 상용 Sn-3.0Ag-0.5Cu (ALPHA OM-325)를 사용하였다. 칩은 ENIG (Electroless nickel immersion gold) finish pad가 형성된 CSP (Chip scale package)를, 보드는 OSP (Organic solderability preservative)/Cu finish pad가 형성된 것을 사용하였다. 실험 방법은 보드를 솔더 페이스트 없이 플라즈마 처리 한 것, 솔더 페이스트를 $30{\mu}m$ 두께로 인쇄한 것, $120{\mu}m$의 두께로 인쇄한 것, 이렇게 3가지 조건으로 준비한 후, 솔더 볼이 bumping된 칩을 mounting하여, $242^{\circ}C$의 peak 온도 조건의 oven(1809UL, Heller)에서 reflow를 실시하여 패키지를 형성하였다. 이후 시편은 정밀 연마한 후, OM(Optical Microscopic)과 SEM(scanning electron microscope) 및 EDS(energy dispersive spectroscope)를 사용하여 솔더 접합부 IMC의 미세조직을 관찰, 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.43-49
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• 2007

Thickness of intermetallic compounds and consumption rates of under bump metallurgies (UBMs) were investigated in wafer-level solder bumping with variations of UBM materials and reflow times. In the case of Cu UBM, $0.6\;{\mu}m-thick$ intermetallic compound layer was formed before reflow of Sn solder, and the average thickness of the intermetallic compound layer increased to $4\;{\mu}m$ by reflowing at $250^{\circ}C$ for 450 sec. On the contrary, the intermetallic layer had a thickness of $0.2\;{\mu}m$ on Ni UBM before reflow and it grew to $1.7\;{\mu}m$ thickness with reflowing for 450 sec. While the consumption rates of Cu UBM were 100nm/sec fur 15-sec reflow and 4.50-sec for 450-sec reflow, those of Ni UBM decreased to 28.7 nm/sec for 15-sec reflow and 1.82 nm/sec for 450-sec reflow.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.1-7
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• 2008

We studied a growth behavior of Intermetallic compounds(IMCs) during solder bumping with two reflow methods. Ti(50 nm), Cu($1{\mu}m$), Au(50 nm) and Ti(50 nm) thin films were deposited on $SiO_2$/Si wafer using the DC magnetron sputtering system as the under bump metallization(UBM). And the $5{\mu}m$ thick Cu bumps and $20{\mu}m$ thick Sn bumps were fabricated on UBM by electroplating. Sn bumps were reflowed in RTA(Rapid Thermal Annealing) system and convection reflow oven. When RTA system was used, reflow was possible without using flux and IMC thickness formed in the solder interface was thinner than that of a convectional method.

• Journal of Soil and Groundwater Environment
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• v.14 no.3
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• pp.47-56
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• 2009

This is a study about how the increase of strength is changed when ground improvement material is mixed with either coastal clay or sandy soil. The ground improvement material was made from mixing a certain proportion of the slag which is by-products generated by smelting the iron ore and the paper fly ash which is formed by bumping up the paper. The ground improvement material was added to coastal soil and sandy soil each. And then according to ratio of water contents, number of curing days and ratio of mixture, specimen for uniaxial compression test was made. The change of uniaxial compression strength and the generated substances was analyzed while the specimen is being cured for 28days. The result of analysis shows that the strength of coastal clay was increased about eleven times more than that of sandy soil. This means that ettringite reaction by ground improvement material becomes more distinctive in the coastal clay than in the sandy soil.

• Journal of Digital Convergence
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• v.12 no.10
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• pp.61-71
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• 2014

Global commerce is apparently here to bind Korean firms as well as Koreans. The advertising, buying and selling of goods and services recognizes no borders. As a result, enforcing territorially based trademark rights has become ever more challenging. Remote trademark owners who peacefully coexisted in a time before the internet and increasing globalism are now bumping heads. The internet also has made it easier for unscrupulous operators to deceive consumers and divert customers from established businesses by misappropriating trademarks on web-sites and in domain names. U.S. federal courts have been willing to help American businesses halt trademark infringements that reaches outside the United States. This is particularly true for e-business, via the internet, and the trend toward enforcement seems to be in favor of the trademark owner. This article discusses this trend as well as the extraterritorial enforcement of trademark rights by U.S. courts under the Lanham Act. It also offers suggestions for protecting valuable trademark rights worldwide. This paper will contribute to global Korean firms and Koreans who carefully read arguments in this valuable literature.