• Title/Summary/Keyword: build-up

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Output Behavior of Build-Up Force Measuring System (BUILD-UP 힘측정 시스템의 출력거동)

  • 강대임;송후근;홍창선
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.9
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    • pp.2194-2205
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    • 1995
  • In order to reduce the systematic error of a build-up system, we have proposed a new test procedure in which all force transducers in a build-up system are rotated by 90.deg. with a base platen fixed on a force standard machine. The setting positions of force transducers on the output of a build-up system were investigated using an orthogonal array. The effects of the parallelism of a build-up system and of the bending moment sensitivity of a force transducer were considered. The experimental results show that the setting position of the base platen hardly affects the output of the build-up system, but the setting positions of force transducers affects it strongly. It reveals that the new test procedure reduces effectively the systematic error of a build-up system.

The Direction of Capability-based Military Build-up (국가능력에 기초한한 군사력 건설방향)

  • 이필중
    • Journal of the military operations research society of Korea
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    • v.27 no.2
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    • pp.88-109
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    • 2001
  • Defense minister of the ROK, Kim Bong-sin suggested that the ROK′s military build-up policy will change from "scenario-based" to "capability-based". Entering the 1990s the ROK′s military build-up policy met difficulties to accomplish its goal, modernizing and strengthening of its force structure and weapon systems because of limited budget. The concept of capability-based military build-up could commit a fault in estimating total amount of defense resources required for force planing. This is because that the total amount of defense resources related to force plan for the 15 years is fixed to embody military strategy. The concept of capability-based military build-up plays a role as a constraint in choosing a military strategy. This has no connection with military build-up. Therefore the resources of mid-term military build-up program and scale of annual defense budget could be affected by the situations of its national economy. In this respect, the scale of annual defense budget and resources could be changed in accordance with national economic condition, however, the total amount of resources required to build-up military force for 15 years, namely resources of military force planing requirement for 15 years, is given already for the accomplishment of military strategy. The purpose of this study is to seek a direction of the ROK′s military build-up policy in a viewpoint of capability-based military build-up.

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Large Force Measuring System Using Build-up Technique; (Build-up 기법을 이용한 대용량 힘 측정 시스템 개발)

  • Kang, Dae-Im;Song, Hou-Keun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.21 no.3
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    • pp.477-484
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    • 1997
  • This paper describes the build-up force measuring system of 9.9 MN capacity which consists of nine force transducers of each having 1.1 MN capacity. We have specially designed a force transducer for a build-up force measuring system to reduce the uncertainty of a build-up system and to accomodate the new test procedure for a build-up system. It reveals that the relative uncertainty of the force measuring system is less than 1.5*10$^{-4}$ in the ran9e of 1-4.5 MN irrespective of loading direction. The force measuring system may be used to calibrate a 10 MN force standard machine to be used as a large force standard in Korea.

BUILD-UP 원리를 이용한 힘센서 제작 및 특성평가에 관한 연구

  • ;Force Lab
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.10a
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    • pp.154-158
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    • 2001
  • 산업이 고도화, 대형화됨에 따라 조선, 건설, 기계산업문야에서 대용량 힘 측정의 필요성이 날로 증가하고 있다. 힘 측정에 사용되는 힘 센서는 국가 힘 표준인 힘 표준기로부터 교정을 받아 사용함으로써 힘 측정 결과에 대해 국제적으로 인정받을 수 있다. 본 연구에서는 build-up 힘 표준기에 사용되는 build-up 힘센서를 설계 및 제작하고 힘 센서 각각의 특성과 build-up 시스템 전체의 특성을 실험하여 build-up 힘 센서의 오차를 평가하였다.

Analysis of pollutant build-up model applied to various urban landuse

  • Choi, Jiyeon;Na, Eunhye;Ryu, Jichul;Kim, Jinsun;Kim, Hongtae;Shin, Dongsuk
    • Membrane and Water Treatment
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    • v.10 no.1
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    • pp.13-17
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    • 2019
  • This study was conducted to analyse the application of pollutant build-up model on various urban landuses and to characterize pollutant build-up on urban areas as a source of stormwater runoff pollution. The monitored data from impervious surfaces in urban areas such as commercial (8 sites), industrial (10 sites), road (8 sites), residential (10 sites), recreational (5 sites) from 2008 to 2016 were used for the analysis of pollutant build-up model. Based on the results, the average runoff coefficients vary from 0.35 to 0.61. In all landuses except recreational landuse, the runoff coefficient is 0.5 or more, which is the highest in the commercial area. Commercial landuse where pollutants occur at the highest EMC in all landuse, and it is considered that NPS management is necessary compared with other landuses. The maximum build-up load for organic matter (BOD) was highest in the commercial area ($4.59g/m^2$), and for particular matter (TSS) in the road area ($5.90g/m^2$) while for nutrient (TN and TP) in the residential area ($0.40g/m^2$, $0.14g/m^2$). The rate constants ranged from 0.1 to 1.3 1/day depending on landuse and pollutant parameters, which means that pollutant accumulation occurs between 1 and 10 days during dry day. It is clear that these build-up curves can generally be classified based on landuse. Antecedent dry day (ADD) is a suitable and reasonable variable for developing pollutant build-up functions. The pollutant build-up curves for different landuse shows that these build-up curves can be generally categorized based on landuse.

Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology (쾌속조형과 스크린 인쇄기술을 이용한 빌드업인쇄회로기판의 제조공정기술개발)

  • 조병희;정해도;정해원
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.2
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    • pp.130-136
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    • 2000
  • Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

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New Zero-Voltage-Switching Method for High Efficiency Half-Bridge Converter (새로운 영전압 스위칭 방식을 이용한 고효율 하프-브릿지 컨버터)

  • Lee Sung-Sae;Moon Gun-Woo
    • Proceedings of the KIPE Conference
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    • 2006.06a
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    • pp.25-27
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    • 2006
  • This paper proposes a new full ZVS-range asymmetrical half bridge converter. It uses the variable transient current build-up technique with the load variations. The current build-up is accomplished by using the secondary synchronous switch control. Due to the blocking capacitor in secondary side, the voltage applied to leakage inductor varies with the load variations during current build-up period. Therefore, the unnecessary current build-up of leakage inductor current in heavy load condition is prevented and more current build-up in medium and light load condition is achieved for ZVS operation. That is, the variant current build-up with the load variation is accomplished for the ZVS operation. Furthermore, the DC offset of the transformer magnetizing current is also eliminated and the utilization of magnetic core is maximized.

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THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES

  • Takagi, Kiyoshi
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.289-296
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    • 1999
  • The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

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Build-up Phenomenon and Self-Cleaning Effect upon Wire Electrode Surface of an Electrolytic Ozone Generator in Tap Water (수 분해형 오존발생장치의 전극선 비대현상과 자기회복 현상)

  • Moon, Jae-Duk;Kim, Yong
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.40 no.6
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    • pp.626-629
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    • 1991
  • The negative wire of an electrolytic ozone generator, proposed by authors, has been contaminated by attaching the impurity particulate in tap water, which is called BUILD-UP phenomenon. The higher applied voltage and the larger wire diameter have shown the higher build-up rate, which makes the current reducing largely and concurrently the ozone production smaller. It is found that the positive electrode of the ozone generator has a strong SELF-CLEANING effect by detaching the impurity particulate from its surface, which, however, is used us a novel means of solving the build-up problem. As a result, the build-up problem can be solved effectively by applying an alternate square wave pulse voltage to the electrodes so as to get the self-cleaning ability on the both electrodes during each of the half pulse duration time.

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