• Title/Summary/Keyword: buffer insertion

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Improvement of Hybrid EL Efficiency in Nanoparticle EL Devices by Insertion of the Layers of PVK and BaF2

  • Lee, Jun-Woo;Cho, Kyoung-Ah;Kim, Hyun-Suk;Park, Byoung-Jun;Kim, Sang-Sig;Kim, Sung-Hyun
    • Transactions on Electrical and Electronic Materials
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    • v.6 no.3
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    • pp.101-105
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    • 2005
  • Electroluminescence(EL) and current-voltage(I-V) characteristics of hybrid EL devices containing Pr and Mn co-doped ZnS nanoparticles were investigated in this study. For the insertion of a hole transport layer of poly (N-vinyl carbazole)(PVK), the current level became lower due to the accumulation of electrons at the interface between PVK and nanoparticles. When both PVK and buffer layer $BaF_2$ were simultaneously introduced, the enhanced EL efficiency and improved I-V characteristics were obtained. This results from the additional increase of hole injection owing to the internal field induced by the significant accumulation of electrons at the interface. The presence of buffer layer $BaF_2$ together with PVK makes it possible the charge accumulation enough to induce the sufficient internal field for further hole injection.

Clock Mesh Network Design with Through-Silicon Vias in 3D Integrated Circuits

  • Cho, Kyungin;Jang, Cheoljon;Chong, Jong-Wha
    • ETRI Journal
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    • v.36 no.6
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    • pp.931-941
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    • 2014
  • Many methodologies for clock mesh networks have been introduced for two-dimensional integrated circuit clock distribution networks, such as methods to reduce the total wirelength for power consumption and to reduce the clock skew variation through consideration of buffer placement and sizing. In this paper, we present a methodology for clock mesh to reduce both the clock skew and the total wirelength in three-dimensional integrated circuits. To reduce the total wirelength, we construct a smaller mesh size on a die where the clock source is not directly connected. We also insert through-silicon vias (TSVs) to distribute the clock signal using an effective clock TSV insertion algorithm, which can reduce the total wirelength on each die. The results of our proposed methods show that the total wirelength was reduced by 12.2%, the clock skew by 16.11%, and the clock skew variation by 11.74%, on average. These advantages are possible through increasing the buffer area by 2.49% on the benchmark circuits.

Effects of thermal annealing of AlN thin films deposited on polycrystalline 3C-SiC buffer layer (다결정 3C-SiC 버퍼층위 증착된 AlN 박막의 열처리 효과)

  • Hong, Hoang-Si;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.112-112
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    • 2009
  • In this study, the effect of a long post-deposition thermal annealing(600 and 1000 $^{\circ}C$) on the surface acoustic wave (SAW) properties of polycrystalline (poly) aluminum-nitride (AlN) thin films grown on a 3C-SiC buffer layer was investigates. The poly-AlN thin films with a (0002) preferred orientation were deposited on the substrates by using a pulsed reactive magnetron sputtering system. Experimental results show that the texture degree of AlN thin film was reduced along the increase in annealing temperature, which caused the decrease in the electromechanical coupling coefficient ($k^2$). The SAW velocity also was decreased slightly by the increase in root mean square (RMS) roughness over annealing temperature. However, the residual stress in films almost was not affect by thermal annealing process due to small lattice mismatch different and similar coefficient temperature expansion (CTE) between AlN and 3C-SiC. After the AlN film annealed at 1000 $^{\circ}C$, the insertion loss of an $IDT/AlN/3C-SiC/SiO_2/Si$ structure (-16.44 dB) was reduced by 8.79 dB in comparison with that of the as-deposited film (-25.23 dB). The improvement in the insertion loss of the film was fined according to the decrease in the grain size. The characteristics of AlN thin films were also evaluated using Fourier transform-infrared spectroscopy (FT-IR) spectra and X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM) images.

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Data Stream Storing Techniques for Supporting Hybrid Query (하이브리드 질의를 위한 데이터 스트림 저장 기술)

  • Shin, Jae-Jyn;You, Byeong-Seob;Eo, Sang-Hun;Lee, Dong-Wook;Bae, Hae-Young
    • Journal of Korea Multimedia Society
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    • v.10 no.11
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    • pp.1384-1397
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    • 2007
  • This paper proposes fast storage techniques for hybrid query of data streams. DSMS(Data Stream Management System) have been researched for processing data streams that have busting income. To process hybrid query that retrieve both current incoming data streams and past data streams data streams have to be stored into disk. But due to fast input speed of data stream and memory and disk space limitation, the main research is not about querying to stored data streams but about querying to current incoming data streams. Proposed techniques of this paper use circular buffer for maximizing memory utility and for make non blocking insertion possible. Data in a disk is compressed to maximize the number of data in the disk. Through experiences, proposed technique show that bursting insertion is stored fast.

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LiNbO3 integrated optic devices with an UV-curable polymer buffer layer

  • Jeong, Woon-Jo;Kim, Seong-Ku;Park, Gye-Choon;Lee, Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05b
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    • pp.111-118
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    • 2002
  • A new lithium niobate optical modulator with a polymer buffer layer on Ni in-diffused optical waveguide is proposed for the fist time, successfully fabricated and examined at a wavelength of 1.3 mm. By determining the diffusion parameters of Ni in-diffused waveguide to achieve more desirable mode size which is well matched to the mode in the fiber, the detailed results on the achievement of high optical throughput are reported. In addition, the usefulness of polymer buffer layer which can be applicable to a buffer layer in Ni in-diffused waveguide devices is demonstrated. Several sets of channel waveguides fabricated on Z-cut lithium niobate by Ni in-diffusion were obtained and on which coplanar traveling-wave type electrodes with a polymer-employed buffer layer were developed by a conventional fabrication method for characterizing of electro-optical performances of the proposed device. The experimental results show that the measured half-wave voltage is of ~10 V and the total measured fiber-to-fiber insertion loss is of ~6.4 dB for a 40 mm long at a wavelength of =1.3 mm, respectively. From the experimental results, it is confirmed that the polymer-employed buffer layer in LiNbO3 optical modulator can be a substitute material instead of silicon oxide layer which is usually processed at a high temperature of over $300^{\circ}C$. Moreover, the fabrication tolerances by using polymer materials in LiNbO3 optical modulators are much less strict in comparison to the case of dielectric buffer layer.

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Impedance spectroscopy analysis of polymer light emitting diodes with the LiF buffer layer at the cathode/organic interface (LiF 음극 버퍼층을 사용한 폴리머의 효율 향상에 관한 임피던스 분석)

  • Kim, H.M.;Jang, K.S.;Yi, J.;Sohn, Sun-Young;Park, Kuen-Hee;Jung, Dong-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.277-278
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    • 2005
  • Admittance Spectroscopic analysis was applied to study the effect of LiF buffer layer and to model the equivalent circuit for poly(2-methoxy-5-(2'-ethylhexyloxy)-1,4-phenylenevinylene) (MEH-PPV)-based polymer light emitting diodes (PLEDs) with the LiF cathode buffer layer. The single layer device with ITO/MEH-PPV/Al structure can be modeled as a simple parallel combination of resistor and capacitor. Insertion of a LiF layer at the Al/MEH-PPV interface shifts the highest occupied molecular orbital level and the vacuum level of the MEH-PPV layer as a result the barrier height for electron injection at the Al/MEH-PPV interface is reduced. The admittance spectroscopy measurement of the devices with the LiF cathode buffer layer shows reduction in contact resistance ($R_c$), parallel resistance ($R_p$) and increment in parallel capacitance ($C_p$).

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Red emission organic light-emitting diode with electrochemically deposited PANI-CSA layer

  • Kim, Ju-Seung;Kim, Dae-Jung;Gu, Hal-Bon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.08a
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    • pp.81-84
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    • 2003
  • Conductive polyaniline(PANI)-camphosulfonic acid (CSA) film applied as a hole injection layer in ITO/PANI/P3HT/LiF/Al device. In the AFM images, electrochemically polymerized PANI-CSA films have the small particles and smooth sufficient for application as hole injection layer. By insertion of PANI-CSA buffer layer, the turn on voltage of ITO/PANI/P3HT/LiF/Al device lowed by 3V, whereas that of ITO/P3HT/LiF/Al device shows 5V.

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$LiNbO_3$ integrated optic devices with an UV-curable polymer buffer layer (고분자 버퍼층을 갖는 $LiNbO_3$ 집적 광디바이스)

  • Jeong, Woon-Jo;Kim, Seong-Ku;Kim, Dae-Joung;Kim, Jong-Uk;Park, Gye-Choon;Gu, Hal-Bon
    • Proceedings of the KIEE Conference
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    • 2002.11a
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    • pp.230-233
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    • 2002
  • A new lithium niobate optical modulator with a polymer buffer layer on Ni in-diffused optical waveguide is proposed for the fist time, successfully fabricated and examined at a wavelength of 1.3 ${\mu}m$. The experimental results show that the measured half-wave voltage is of ${\sim}10$ V and the total measured fiber-to-fiber insertion loss is of ${\sim}-6.4$ dB for a 40 mm long waveguide at a wavelength of 1.3 ${\mu}m$, respectively.

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Temperature and the Interfacial Buffer Layer Effects on the Nanostructure in the Copper (II) Phthalocyanine: Fullerene Bulk Heterojunction

  • Kim, Hyo Jung;Kim, Jang-Joo;Jeon, Taeyeol;Kong, Ki Won;Lee, Hyun Hwi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.275.1-275.1
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    • 2014
  • The effects of the interfacial buffer layer and temperature on the organic bulk heterojunction (BHJ) nanostructures of copper phthalocyanine (CuPc) and fullerene (C60) systems were investigated using real time in-situ x-ray scattering. In the CuPc:C60 BHJ structures, standing-on configured ${\gamma}$-CuPc phase was formed by co-deposition of CuPc and C60. Once formed ${\gamma}$-phase was thermally stable during the annealing upon $180^{\circ}C$. Meanwhile, the insertion of CuI buffer layer prior to deposition of the CuPc:C60 BHJ layer induced lying-down configured CuPc crystals in the BHJ layer. The lying CuPc peak intensity and the lattice parameter were increased by the thermal annealing. This increment of the intensity seemed to be related to the strain at the interface between CuPc:C60 and CuI, which was proportional to the enhancement of the power conversion efficiency of the device.

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The Effect of $ZrO_2-Y_2O_3\;(YSZ)$ Buffer Layer on Layer on Low-Field Magnetoresistance of LSMO Thin Films ($ZrO_2-Y_2O_3\;(YSZ)$ 중간층이 저 자장영역에서의 LSMO 박막의 자기저항 특성에 미치는 영향)

  • 심인보;오영제;최세영
    • Journal of the Korean Magnetics Society
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    • v.9 no.6
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    • pp.306-311
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    • 1999
  • $La_{2/3}Sr_{1/3}MnO_3(LSMO)/YSZ/SiO_2/Si(100)$ polycrystalline thin films were fabricated be chelated sol-gel method The effect of YSZ buffer layer at low field (120 Oe) spin-polarized tunneling magnetotransport (TMR) properties of LSMO thin film was studied at room temperature. Single perovskite LSMO thin films was obtained. The maximum TMR ratio was increased from 0.2 to 0.42 % by the insertion of YSZ buffer. YSZ as diffusion barrier was attributed to the fine microstructure of LSMO thin films and the reduction of dead layer between LSMO and $SiO_2/Si(100)$ interfaces.

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