• Journal of Welding and Joining
• /
• v.13 no.3
• /
• pp.134-146
• /
• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of Welding and Joining
• /
• v.11 no.4
• /
• pp.70-78
• /
• 1993

An attempt was made to investigate the effect of brazing time on microstructure, microhardness, and corrosion of Zircaloy -4as well as the beryllium diffusion into its sheet. The sheets were coated with beryllium and brazed at $1020^{\circ}C$ for 20-40 minutes in $2{\times}10^{-5}$ torr vacuum atmosphere. 1. Microstructurally the brazed zone was largely divided into three regions: a region of continuous or partially formed of eutectic liquid films along grain boundaries; a region of precipitation in both grains and grain boundaries; a region of elongated wide structure of .alpha.-laths, which was not affected by beryllium. 2. Due to the precipitates, the beryllium-migrated region was hardened and the width of the hardened region increased with increasing brazing time. 3. Beryllium brazed Zircaloy -4 sheets showed a higher corrosion rate than those of as-received and heat-treated at a brazing temperature. 4. Diffusion coefficient of beryllium into Zircaloy -4 at $1020^{\circ}C$ for 30 minutes was $7.67{\times}10^{-7}cm^2/sec.$ It seemed that Be penetrated Zircaloy -4 by forming eutectic liquid films along grain boundaries in the proximity of Be/Zr interface and it, thereafter, diffused into Zircaloy mainly by interstitial solid solution.

• Korean Journal of Metals and Materials
• /
• v.47 no.4
• /
• pp.242-247
• /
• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.545-550
• /
• 2002

In order to ensure the signal could be transported cocrrectly, the microwave devices made of Aluminmn alloys must be assembled and brazed flaw-freely. In this paper, a new approach of using contact reactive brazing (CRB) process to realize the compact brazing of Aluminum alloys was put forward. The reason for this is that CRB, which realizes bonding depending on the liquid alloy produced by metallurgy reaction between the materials to be joined, overcomes the limitation of traditional brazing that the macroscopically disorganized filling flow of liquid filler metal would result in defects in brazed seam. Joint ofLF21 (AA3003) with the compactness of over 95% was brazed by the method of CRB using Si powder as an interlayer. At last, the influence of the physical parameter related to the Si powder interlayer on the compactness of the joints was investigated in detail.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2011.05a
• /
• pp.187-187
• /
• 2011

지르코니아 ($ZrO_2$) 표면에 금속 (Au)으로 표면 코팅한 후 Ti-6Al-4V와 진공 브레이징 접합을 행하였다. 표면에 코팅한 Au 층의 영향을 비교 분석하기 위하여 Au를 코팅하지 않은 지르코니아도 모재로 사용하였다. 접합소재로는 Ag-Cu-Ti계 active filler를 사용하였다. $ZrO_2$/Ti-6Al-4V 브레이징 결과, active filler는 양측 모재 표면에 wetting 되었으며, Ti-6Al-4V 내부로 filler 확산으로 인하여 두 모재의 direct joint가 관찰되었다. 접합 계면 사이에 접합부 결함은 관찰되지 않았다.

• 연구논문집
• /
• s.29
• /
• pp.141-149
• /
• 1999

Brazing of Fe-Cr-Al alloy was carried out at $1200^{\circ}C$ in vacuum furnace using nickel-based filler metals : BNi-5 powder(Ni-Cr-Si-Fe base alloy} and MBF-50 foil (Ni-Cr-Si-B). The effect of boron content on the stability of oxide scale on the brazed joint was investigated by means of cyclic oxidation test performed at $1050^{\circ}C$ and $1200^{\circ}C$. Apparently, the joints brazed with MBF-50 containing boron showed relatively stable oxidation rates compared to boron-free BNi-5 at both temperatures. However, it was considered that the slower weight loss of MBF-50 brazed specimen wasn’t resulted from the low oxidation rate but from the spallation of oxide layer. The oxide layer consisted of thick spinel oxide on the surface and $Al_2 O_3$ internal oxide layer along the interface between mother alloy and braze, the mother alloy was also eroded seriously by the formation of spinel oxides such as $FeCr_2 O_4$ and $NiCr_2 O_4$ on the surface, likely to be induced by the change of oxide forming mechanism due to diffusion of boron from the braze. On the contrary, the joint brazed with BNi-5 showed the good oxidation resistance during the cyclic oxidation test. It seems that the oxidation can be retarded by the formation of stable $Al_2 O_3$ layer at the surface.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2005.05a
• /
• pp.273-273
• /
• 2005

• Journal of Powder Materials
• /
• v.4 no.4
• /
• pp.252-257
• /
• 1997

Cu-brazed layer between the sintered-cam(Fe-5Cr-lMo-0.5P-2.5C, wt%) and seamless steelpipe(0.25-0.35C, 0.3-1.0 Mn, bal Fe, wt%) in the camshaft shows a columnar structure of $\gamma$-phase growing from the steel pipe. Liquid phase sintered 60Fe-40Cu alloys are carburized to simulate the brazing process giving rise to the columnar growth. Liquid film migrations and columnar growth of $\gamma$-grains are observed in the carburized regions. The $\gamma$-grains grow in the same direction as the C-diffusion. Fe-solubility in the liquid of carburized region is higher than in the uncarburized by about 0.3 at%. The columnar growth is driven by the gradient of the supersaturated Fe-solute in the liquid between two adjacent $\gamma$-grains.

• Journal of the Korean Electrochemical Society
• /
• v.27 no.1
• /
• pp.8-14
• /
• 2024

Austenitic stainless steel 316L has been used a lot of applications because of its high corrosion resistance and formability. In addition, copper brazing is employed to create complex shape of 316L stainless steel for various engineering parts. In such system, copper-based filler metals make galvanic cell at metal/filler metal interface, and it accelerates corrosion of stainless steel. Furthermore, Cu-rich region formed by diffused copper in austenitic stainless steel can promote a pitting corrosion. In this study, we used an ammonia (NH₃) gas to nitride the 316L stainless steel for improving the corrosion resistance. The thickness of the nitride (nitrogen high) layer increased with the treatment temperature, and the surface hardness also increased. The potentiodynamic polarization test showed the improvement of corrosion resistance of 316L stainless steel by enhancing the passivation on nitride layer. However, in case of high temperature nitriding, a chromium nitride was formed and its fraction increased, so that the corrosion resistance was decreased compared to the intact 316L stainless steel.

• Journal of Welding and Joining
• /
• v.25 no.3
• /
• pp.64-71
• /
• 2007

The dissolution phenomenon of the solid phase powder and base metal by liquid phase insert metal during Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111(base metal) powder and the GNi3 (Ni-l4Cr-9.5Co-3.5Al-2.5B) powder was investigated. In case of the mixed powder contains modified GTD111 powder 50wt%, all of the powder was melted by liquid phase at 1423K. At the temperature between solidus and liquidus of GNi3, liquid phase penetrated into the boundary of the modified GTD111 powder and solid particle separated from powder was melted easily because area of reaction was increased. With increasing mixing ratio of the modified GTD111, it needed the higher temperature to melt all of the modified GTD111 powder. During Transient Liquid Phase bonding using the mixed powder composed of the modified GTD111 50wt% and GNi3 50wt% as insert metal, width of the bonded interlayer was increased with increasing bonding temperature by reaction of the base metal and liquid phase in insert metal. Dissolution of the base metal and modified powder by liquid phase progressed all together and after all of the powder was melted nearly, the dissolution of the base metal occurred quickly.