• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• Korean Journal of Materials Research
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• v.15 no.9
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• pp.555-559
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• 2005

An oxygen free copper severely-deformed by eight cycles (an equivalent strain of $\~6.4$) of accumulative roll-bonding (ARB) was annealed at various temperatures ranging from 100 to $300^{\circ}C$. The annealed copper was characterized by transmission electron microscopy (TEM) and tensile & hardness test. TEM observation revealed that the ultrafine grains developed by the ARB still remained up to $150^{\circ}C$, however above $200^{\circ}C$ they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. Tensile strength and hardness of the copper decreased slightly with the annealing temperature up to $150^{\circ}C$, however they dropped largely above $200^{\circ}C$. Annealing characteristics of the copper were compared with those of a commercially pure aluminum processed by ARB and subsequently annealed.

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.12-17
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• 2008

Carbon nanotube (CNT) cathodes were fabricated using nano-sized silver (Ag) powders as a bonding material between the CNTs and cathode electrodes. The effects of the powder size on the sintering behavior, the current density and emission image for CNT cathodes were investigated. As the diameter of the Ag powders decreases to 10 nm, the sintering temperature of the CNT cathode was lowered primarily due to the higher specific surface area of the Ag powders. In this study, it was demonstrated that nano-sized Ag powders can be feasibly used as a bonding material for a screen-printed CNT cathode, yielding a high current density and a uniform emission image.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.23-26
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• 2006

For mechanical and electrical stability and environment protection. Cu and stainless steel stabilizers are laminated to a Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. This architecture allows the wire to meet operational requirements including stresses at cryogenic temperature. winding tensions as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. We have experimentally studied mechanical properties of the laminated stainless steel and Cu stabilizers on YBCO coated conductors. We have laminated YBCO coated conductors by continuous dipping soldering process. We have investigated lamination interface between solder and stabilizer of the YBCO coated conductor. We evaluated bonding properties. tensile / shear bonding strength. and peeling strength laminated YBCO coated conductors.

• Fibers and Polymers
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• v.3 no.1
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• pp.38-42
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• 2002

Polypropylene filaments were spun from a mixture of PP chips of two different Melt Flow Index (MFI) (3 MFI and 35 MFI). A significant difference was observed in the melting characteristics of the resultant filaments from either of the individual components as observed from the DSC. The main difference being in the degree of melting achieved at any temperature in the initial stages of the melting range, which was found to be higher in case of the filaments spun from the b]end. These filaments were then thermally bonded using silicon oil bath and heated roller method. Subsequently the bond strength of the filaments was measured on the Instron Tensile Tester using the loop technique. The values of the world strengths obtained from the blend were compared with those made from the individual component. It was found that the bond strength of the bonds obtained from the blended filament at a given temperature was higher than that of the bonds made from the filaments of either of the individual components, which is also suggested by the DSC curves. The difference in the bond strength was found to be as high as 25% in case of the blend with 60:40 composition ratios of the 3 MFI and 35 MFI components respectively.

• Structural Engineering and Mechanics
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• v.48 no.5
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• pp.643-660
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• 2013

Reinforced concrete structures are vulnerable to high temperature conditions such as those during a fire. At elevated temperatures, the mechanical properties of concrete and reinforcing steel as well as the bond between steel rebar and concrete may significantly deteriorate. The changes in the bonding behavior may influence the flexibility or the moment capacity of the reinforced concrete structures. The bond strength degradation is required for structural design of fire safety and structural repair after fire. However, the investigation of bonding between rebar and concrete at elevated temperatures is quite difficult in practice. In this study, bond constitutive relationships are developed for normal and high-strength concrete (NSC and HSC) subjected to fire, with the intention of providing efficient modeling and to specify the fire-performance criteria for concrete structures exposed to fire. They are developed for the following purposes at high temperatures: normal and high compressive strength with different type of aggregates, bond strength with different types of embedment length and cooling regimes, bond strength versus to compressive strength with different types of embedment length, and bond stress-slip curve. The proposed relationships at elevated temperature are compared with experimental results.

• Journal of Korea Foundry Society
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• v.22 no.4
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• pp.174-183
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• 2002

Twin-roll process is a relatively new continuous casting process which can produce high-quality strip products directly, and solidification rate can reach $10^3$ to $10^4$ K/s, leading to fine and uniform microstructures with enhanced mechanical properties. The strip casting condition for producing fine Al-Sn alloy strip was obtained experimentally, and defects appearing on the strip was examined. Crack formation and surface quality of the strip was found to depend mainly on process parameters such as melt temperature, roller gap and rolling speed. Sn structure of network type was observed in Al-20Sn and Al-40Sn alloy strips, and cell spacing of Al-40Sn alloy was smaller than that of Al-20Sn. Banding strength of the heat treated specimens increased with increasing of soaking time and temperature, and bonding strength of Al-20Sn alloy was more superior than that of Al-40Sn alloy. However wear resistance of Al-40Sn alloy contained large amount of soft Sn which possess good anti-friction characteristics was superior than that of Al-20Sn alloy.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.8
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• pp.1-4
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• 2011

This study was the coorrelation between the electrical properties and the dielectric constant of organic inorganic hybrid type low k SiOC film. SiOC film as low-k films was deposited by the chemical vapor deposition and then annealed at 30 $0{\sim}500^{\circ}C$ to find out the properties of the depending on the temperature and polarity. SiOC film decreased the dielectric constant after annealing process, and the electrical properties were improved at the sample annealed at $400^{\circ}C$. From the XRD patterns, there were two kinds of bonding structures in SiOC film. There was the difference in the bonding structure between the samples annealed under $300^{\circ}C$ and the samples annealed over $400^{\circ}C$. The change was confirmed near $400^{\circ}C$.

• Proceedings of the Korean Institute of Building Construction Conference
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• v.y2004m10
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• pp.21-26
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• 2004

This study deals with the Hydrated Ability of the Ready-Mixed Concrete's Sludge which is the recycling technology of that sludge. The experiment gathers sludge from Ready-mixed factory. shatters these into pieces in dry condition and understands the differences between current using Portland cement. And then. this examines the possibility of the recycle as a bonding agent through the Compressive Strength and considers the recovery of the hydration. This experiment concludes the same Chemical Composition with the normal Portland cement. while. under the appropriate procedure in hydration recovery. this sludge can be used as the bonding agent in cement. The chemical composition of solid Remicon sludge shows that it has 1.8 times $SiO_2$ than the normal Portland cement. meaning lots of aggregate in Remicon sludge. Also. the specific gravity of Remicon sluge increases with the rise of Baking Temperature and has no difference between 2.77 and 2.94. The mortar flow used for combining the baking material of Remicon sludge does was not changed and is the highest between $750^{\circ}C{\cdot}120min\;and\;800^{\circ}C{\cdot}180min$. Additionally. the Compressive Strength increases with the age, certifying the same Hydrated Ability like cement and the best condition for hydration is $750^{\circ}C{\cdot}120min.$

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.308-314
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• 2018

Among the fuel cell electrolyte candidates in the intermediate temperature range, glass materials show stable physical properties and are also expected to have higher ion conductivity than crystalline materials. In particular, phosphate glass has a high mobility of protons since such a structure maintains a hydrogen bond network that leads to high proton conductivity. Recently, defects like volatilization of phosphorus and destruction of the bonding structure have remarkably improved with introduction of cations, such as Zr4+ and Nb5+, into phosphate. In particular, niobium has proton conductivity on the surface because of higher surface acidity. It can also retain phosphorus content during heat treatment and improve chemical stability by bonding with phosphorus. In this study, we fabricate niobium phosphate glass thin films through sol-gel processing, and we report the chemical stability and electrical properties. The existence of the hydroxyl group in the phosphate is confirmed and found to be preserved at the intermediate temperature region of $150-450^{\circ}C$.