• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.1-8
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• 2012

The effect of the grafting ratio on the mechanical property and adhesion property of the grafted EPDM modified with methacrylic acid (MA) was investigated. The storage modulus of MA-grafted EPDM was maintained higher than that of cross-linked EPDM vulcanizate by sulfur, but it was observed that the storage modulus was decreased at elevated temperature because of the weakened secondary bonding. When the functional group for hydrogen bonding was introduced in EPDM, it had excellent mechanical properties by the aggregate between grafted EPDM molecules and crystallinity of MA. The bonding strength between EPDM and other rubbers was very low because EPDM has nonpolar property and low molecular interaction to others. The bonding strength was increased as increasing grafting ratio and it was excellent enough to break the rubber during the peel test when the grafting ratio was more than 10%.

• Transactions on Electrical and Electronic Materials
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• v.18 no.4
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• Advances in nano research
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• v.5 no.4
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• pp.359-372
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• 2017

Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of $CuCl_2$ (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of $30-80^{\circ}C$. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at $400^{\circ}C$ and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metalli-ccopper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of $50^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.49-57
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• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• Restorative Dentistry and Endodontics
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• v.16 no.1
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• pp.60-73
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• 1991

The purpose of this study is to evaluate the effects of etching time, environmental temperature and humidity on the adhesion of composite resin to glass-ionomer cement. Two chemical cure composite resins (Clearfil F II and Microrest AP) and two glass-ionomer cements (Fuji ionomer Type I and KET AC-CEM) were used as the experimental materials. The experiment is performed in 3 stages: The first stage is to bond composite resins to glass-ionomer cements, and the surface was not etched, and etched for 20 seconds, 40 seconds, and 60 seconds. Then specimens are stored in distilled water at $37^{\circ}C$ for 24 hours to measure tensile strength. The second stage is to choose the one group that had the highest tensile strength from the first stage and prepare two experimental groups: One group with composite resin bonded to glass-ionomer cement without etching and bonding agent application and the other with composite resin bonded to glass-ionomer cement with etching but without any bonding agent application. The specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and tensile strength is measured. The third stage is to choose group that had the highest tensile strength from the first stage experiment, and bond composite resin to glass-ionomer cement at $24^{\circ}C$ 44%, $30^{\circ}C$ 44%, $30^{\circ}C$ 80%, and $32^{\circ}C$ 92%. The storage time of specimens is to bond immediately after storage, then changed to 30 sec., 60 sec., and 120 sec.. Specimens are stored in distilled water at $37^{\circ}C$ for 24 hours and their tensile strength are measured again. The following results were obtained: 1. As the etching time increases, the tensile bond strength between glass-ionomer cement and composite resin increase, and the tensile bond strength is the highest when acid etched for 60 minutes (P < 0.05). 2. After acid etching for 60 minutes, the tensile strength of the group with bonding agent was stronger than that without bonding agent application (P < 0.05). 3. The tensile strength of Clearfil F II was stronger than that of Microrest AP. 4. It was observed that the tensile bond strength is not affected by different storage time with different temperature and humidity. 5. As the humidity was increased, the tensile bond strength between glass-ionomer cement and composite resin decreased (P < 0.05).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1103-1107
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• 2005

Single-crystal silicon thin films on glass (SOG) and on fused-quartz (SOQ) were prepared using wafer bonding and hydrogen-induced layer transfer. Thinfilm transistors (TFTs) were subsequently fabricated. The high-temperature processed SOQ TFTs show better device performance than the low-temperature processed SOG TFTs. Tensile and compressive strain was measured respectively on SOQ and SOG. Consistent with the tensile strain, enhanced electron effective mobility was measured on the SOQ TFTs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.647-648
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• 2006

• Journal of Welding and Joining
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• v.12 no.2
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• pp.39-48
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• 1994

In comparison to the conventional brazing, laser welding of ceramics has advantages of direct bonding without filler material, which causes the thermal stress due to the differences of thermal expansion coefficients. In pulse-mode, laser welding of dispersion ceramic having high thermal resistance is possible at relatively low preheating temperature of $1300^{\circ}C$ In CW-mode, alumina can be welded at high preheating temperature $1500^{\circ}C$ under the condition of low feed rate of 500 mm/min, respectively. Further studies on developing mechanism of pores in the bead during laser welding of ceramics is required.

• Journal of Conservation Science
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• v.25 no.3
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• pp.273-282
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• 2009

As a result of investigating research papers concerning the metal bound rim decoration on four pieces of 'Bowl, white porcelain with impressed floral design and sliver bound rim' and one piece of 'Bowl, white porcelain with sliver bound rim' from among the Jingdezhen white porcelain, which are Sinan remains that are kept in a National museum of Korea. It was found that the material of the bound rim was not silver but tin, and lacquer was used as glue. Based on such a scientific analysis, this study conducted a reproduction test of the manufacturing technique and the bonding method of the metal bound rim attached to the upper tip of the china ware. As a way of reproducing the bound rim, the study was able to discover the best method in terms of the avoidance of loss of materials and the workability out of various cutting methods for tin plates, and it also discovered that the use of lacquer in mixture with soil showed a better workability than the use only of a lacquer ingredient in a test of the bonding method of a metal bound rim using lacquer. Also, in the test of a drying method, a bonding method after drying within a short time at a relatively high temperature was found to be more effective than the drying method after humidifying at a normal temperature, which is used in traditional lacquer ware preservation treatment.