• Title/Summary/Keyword: bonding surface

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Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB (Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향)

  • Kim, Jungsoo;Myung, Woo-Ram;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.97-103
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    • 2014
  • Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.

Application of the SASW Method to the Evaluation of Grouting Performance for a Soft Ground of a Tunnel (터널 원지반의 그라우팅 보강 평가를 위한 SASW 기법의 적용)

  • 조미라;강태호
    • Journal of the Korean Geotechnical Society
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    • v.19 no.6
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    • pp.273-283
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    • 2003
  • Fissured rock and soft ground always suggest, problems in the construction of the underground space. The stress release of the weak underground material by opening the underground space with a soft ground, fissures and joints can lead to the failure of the opening. Grouting of the weak rock and the soft ground, which is a process of injecting some bonding agents into the soft ground, is one of the measures to reinforce the soft ground and to prohibit the failure of the underground construction due to the stress release. The proper installation of the grouting is essential to ensuring the safety of the tunneling operation, so that the evaluation of the grouting performance is very significant. The general procedure of evaluating the grouting is coring the grouted section and measuring the compression strength of the core. However, sometimes when the grouted section is at the crown of the tunnel and the grouting is installed at a wide section, the coring is not good enough. This study is oriented to propose a new and a non-destructive procedure of evaluating the grouting performance. The proposed method is based on the wave propagation of elastic waves, and evaluates the shear stiffness of the ground and investigates the anomalies such as voids and cracks. The SASW ( Spectral-Analysis-of-Surface-Waves) method is one of the candidate s to make the inspection of the pouting performance, and is adopted in this study. The practical grouting activity was monitored by SASW method, and the proposed method was applied to the inspection of the grouting performance to check the verification of the proposed method.

Effect of Conditioning Methods on the Shear Bond Strength of Veneering composite on Zirconia Ceramic (Y-TZP ceramic의 표면처리에 따른 전장용 레진의 전단결합강도)

  • Nam, Hyun-Seok;Song, Kwang-Yeob;Ahn, Seung-Geun;Park, Ju-Mi
    • Journal of Dental Rehabilitation and Applied Science
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    • v.26 no.3
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    • pp.253-264
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    • 2010
  • The purpose of this study is to know whether Yttrium-stabilized-tetragonal -zirconia-polycrystal(Y-TZP ceramic) gets enough shear bond strength for clinical uses by applying veneering composite resin through surface treatment on it and finally to compare it with the case of applying veneering porcelain. LavaTM zirconia frameworks(3M ESPE, Seefeld, Germany) were prepared. Group P was manufactured with LavaTM Ceram(3M ESPE, Seefeld, Germany) in cylindrical shape which has 4mm diameter, 5mm height. Group ZSR disposed sandblasting and applied silane, bonding agent and after that indirect composite resin was applied. Group ZRR got tribochemical coating by RocatecTM system(3M ESPE. Seefeld, Germany) and treated silane. Finally Group ZPR took the same treatment and applied LavaTM Ceram in the size of 0.3-0.5mm height. After burning out, sandblasting, HF and silane was applied. And then, indirect composite resin was applied. 1000 cycle thermocycling was performed in $5-55^{\circ}C$ and shear bond strength was measured. There were no significant differences between combining veneering porcelain to Y-TZP ceramic group and combining veneering resin to Y-TZP ceramic group in the aspect of shear bond strength (p>.05).

Effect of gas composition on the characteristics of a-C:F thin films for use as low dielectric constant ILD (가스 조성이 저유전상수 a-C:F 층간절연막의 특성에 미치는 영향)

  • 박정원;양성훈;이석형;손세일;오경희;박종완
    • Journal of the Korean Vacuum Society
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    • v.7 no.4
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    • pp.368-373
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    • 1998
  • As device dimensions approach submicrometer size in ULSI, the demand for interlayer dielectric materials with very low dielectric constant is increased to solve problems of RC delay caused by increase in parasitic resistance and capacitance in multilevel interconnectins. Fluorinated amorphous carbon in one of the promising materials in ULSI for the interlayer dielectric films with low dielectric constant. However, poor thermal stability and adhesion with Si substrates have inhibited its use. Recently, amorphous hydrogenated carbon (a-C:H) film as a buffer layer between the Si substrate and a-C:F has been introduced because it improves the adhesion with Si substrate. In this study, therfore, a-C:F/a-C:H films were deposited on p-type Si(100) by ECRCVD from $C_2F_6, CH_4$and $H_2$gas source and investigated the effect of forward power and composition on the thickness, chemical bonding state, dielectric constant, surface morphology and roughness of a-C:F films as an interlayer dielectric for ULSI. SEM, FT-IR, XPS, C-V meter and AFM were used for determination of each properties. The dielectric constant in the a-C:F/a-C:H films were found to decrease with increasing fluorine content. However, the dielectric constant increased after furnace annealing in $N_2$atomosphere at $400^{\circ}C$ for 1hour due to decreasing of flurorine content. However, the dielectric constant increased after furnace annealing in $N_2$atmosphere at $400^{\circ}C$ for 1hour due to decreasing of fluorine concentration.

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Shear bond strength of a self-adhesive resin cement to resin-coated dentin (간접수복용 복합레진과 자가 접착 레진 시멘트의 전단결합강도에 레진코팅법이 미치는 영향)

  • Hong, Jee-Youn;Park, Cheol-Woo;Heo, Jeong-Uk;Bang, Min-Ki;Ryu, Jae-Jun
    • The Journal of Korean Academy of Prosthodontics
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    • v.51 no.1
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    • pp.27-32
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    • 2013
  • Purpose: The aims of this study were to evaluate the effect of a resin coating on the shear bond strength of indirect composite restoration bonded to dentin with a self adhesive resin cement and to compare the shear bond strength with that of a conventional resin cement. Materials and methods: The occlusal enamels of thirty six extracted noncarious human molars were removed until the dentin flat surfaces of the teeth were exposed. Then, they were divided into 3 groups. The dentin surfaces of group 1 and 3 were left without any conditioning, while the dentin surfaces of group 2 were resin-coated with Clearfil SE bond and a flowable resin composite, Metafil Flo. After all specimens were temporized for 24 hours, indirect composite resin blocks fabricated by Tescera were bonded to dentins by Unicem for group 1 and 2, and by Panavia F for group 3. After 48 hours of water storage, shear bond strengths were measured. The data was analyzed with one-way analysis of variance and multiple comparison test (Tukey method). Results: The shear bond strengths of Unicem applied to resin coated dentin surfaces were significantly higher than those of Unicem and Panavia F used to uncoated dentin surfaces (P<.0001). Conclusion: Application of a resin coating to the dentin surface significantly improved the shear bonding strength of a self adhesive resin cement in indirect restoration.

Highly Sensitive Detection of Pathogenic Bacteria Using PDMS Micro Chip Containing Glass Bead (유리비드를 포함한 PDMS 마이크로칩을 이용한 고감도 감염성 병원균 측정에 관한 연구)

  • Won, Ji-Yeong;Min, Jun-Hong
    • KSBB Journal
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    • v.24 no.5
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    • pp.432-438
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    • 2009
  • Here, we demonstrated simple nucleic acid, RNA, concentration method using polymer micro chip containing glass bead ($100\;{\mu}m$). Polymer micro chip was fabricated by PDMS ($1.5\;cm\;{\times}\;1.5\;cm$, $100\;{\mu}m$ in the height) including pillar structure ($160\;{\mu}m\;(I)\;{\times}\;80\;{\mu}m\;(w)\;{\times}\;100\;{\mu}m\;(h)$, gap size $50\;{\mu}m$) for blocking micro bead. RNA could be adsorbed on micro glass bead at low pH by hydrogen bonding whereas RNA was released at high pH by electrostatic force between silica surface and RNA. Amount of glass beads and flow rate were optimized in aspects of adsorption and desorption of RNA. Adsorption and desorption rate was measured with real time PCR. This concentrated RNA was applied to amplification micro chip in which NASBA (Nucleic Acid Sequence Based Amplification) was performed. As a result, E.coli O157 : H7 in the concentration of 10 c.f.u./10 mL was successfully detected by these serial processes (concentration and amplification) with polymer micro chips. It implies this simple concentration method using polymer micro chip can be directly applied to ultra sensitive method to measure viable bacteria and virus in clinical samples as well as environmental samples.

A Study on the Bond Strength of BCB-bonded Wafers (BCB 수지로 본딩한 웨이퍼의 본딩 결합력에 관한 연구)

  • Kwon, Yongchai;Seok, Jongwon;Lu, Jian-Qiang;Cale, Timothy;Gutmann, Ronald
    • Korean Chemical Engineering Research
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    • v.45 no.5
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    • pp.479-486
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    • 2007
  • Four point bending is used to study the dependences of bond strength of benzocyclobutene(BCB) bonded wafers and BCB thickness, the use of an adhesion promoter, and the materials being bonded. The bond strength depends linearly on BCB thickness, due to the thickness-dependent contribution of the plastic dissipation energy of the BCB and thickness independence of BCB yield strength. The bond strength increases by about a factor of two with an adhesion promoter for both $2.6{\mu}m$ and $0.4{\mu}m$ thick BCB, because of the formation of covalent bonds between adhesion promoter and the surface of the bonded materials. The bond strength at the interface between a silicon wafer with deposited oxide and BCB is about a factor of three higher than that at the interface between a glass wafer and BCB. This difference in bond strength is attributed to the difference in Si-O bond density at the interfaces. At the interfaces between plasma enhanced chemical vapor deposited (PECVD) oxide coated silicon wafers and BCB, and between thermally grown oxide on silicon wafers and BCB, 12~13 and $15{\sim}16bonds/nm^2$ need to be broken. This corresponds to the observed bond energies, $G_0s$, of 18 and $22J/m^2$, respectively. Maximum 7~8 Si-O $bonds/nm^2$ are needed to explain the $5J/m^2$ at the interfaces between glass wafers and BCB.

Avoidance of Internal Resonances in Hemispherical Resonator Assemblies from Fused Quartz Connected by Indium Solder

  • Sarapuloff, Sergii A.;Rhee, Huinam;Park, Sang-Jin
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2013.04a
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    • pp.835-841
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    • 2013
  • Modern solid-state gyroscopes (HRG) with hemispherical resonators from high-purity quartz glass and special surface superfinishing and ultrathin gold coating become the best instruments for precise-grade inertial reference units (IRU) targeting long-term space missions. Designing of these sensors could be a notable contribution into development of Korea as a space nation. In participial, 40mm diameter thin-shell resonator from high-purity fused quartz, fabricated as a single-piece with its supporting stem has been designed, machined, etched, tuned, tested, and delivered by STM Co. (ATS of Ukraine) several years ago; an extremely-high Q-factor (upto 10~20 millions) has been shown. Understanding of the best way how to match such a unique sensor with inner glass assembly of the gyro means how to use the high potential in a maximal extent; and this has become the urgent task. Inner quartz glass assembly has a very thin indium (In) layer soldered the resonator and its silica base (case), but effects of internal resonances between operational modal pair of the shell-cup and its side (parasitic) modes can notable degrade the potential of the sensor as a whole, instead of so low level of resonator's intrinsic losses. Unfortunately, there are special combinations of dimensions of the parts (so-called, "resonant sizes"), when intensive losses of energy occurs. The authors proposed to use the length of stem's fixture as an additional design parameter to avoid such cases. So-called, a cyclic scheme of finite element method (FEM) and ANSYS software were employed to estimate different combinations of gyro assembly parameters. This variant has no mismatches of numerical origin due to FEM's discrete mesh. The optimum length and dangerous "resonant lengths" have been found. The special attention has been paid to analyses of 3D effects in a cup-stem transient zone, including determination of a difference between the positions of geometrical Pole of the resonant hemisphere and of its "dynamical Pole", i.e., its real zone of oscillation node. Boundary effects between the shell (cup) and 3D short "beams" (inner and outer stems) have been ranged. The results of the numerical experiments have been compared with the classic model of a quasi-hemispherical shell band with inextensional midsurface, and the solution using Rayleigh's functions of the $1^{st}$ and $2^{nd}$ kinds. To guarantee the truth of the recommended sizes to a designer of the real device, the analytical and FEM results have been compared with experimental data for a party of real resonators. The consistency of the results obtained by different means has been shown with errors less than 5%. The results notably differ from the data published earlier by different researchers.

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Structure/Property of Adhesives and Adhesion Performance (접착제의 구조물성과 접착특성)

  • Hiroshi Mizumachi
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.29 no.1
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    • pp.73-83
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    • 1997
  • Most of the materials used in various industrial fields and also in our daily life are multi-component materials or composite materials, and it is well known that there are many cases where adhesion between the constituents within the bonded systems plays an important role. There are various types of performance evaluation tests for the bonded materials, among which tests for evaluating the bond performance under various conditions may be regarded as the most interesting ones for those engaged in work related to adhesion. I have studied on the mechanism of adhesion form the rheological standpoint with my colleagues, including some students from Korea, and I am very happy to be able to have a talk on some of our research works. In Japan, the so-called "adhesives" are usually classified into two categories;adhesives and pressure sensitive adhesives (PSA). Adhesives are the materials which solidify after bonding and are after used as the structural adhesives because the adhesive strength is comparatively strong. On the other hand, the pressure sensitive adhesives never solidify and are used as PSA tapes, labels or decals. About the adhesives, we have examined the dependence of adhesive strength(shear, tensile, peel) upon both temperature and rate of deformation, and found out some empirical rules which are applicable to most of the adhesive systems. We have also developed a simplified theory of adhesion, which is deseribed in terms of mechanical equivalent mode1 and a few failure criteria. Although some of the common rules can be accounted for according to this theory, it must be pointed out that a fracture mechanical approach ms inevitable especially in the region where the meehanical relaxation time of the adhesive is extremely large [W. W. Lim and H. Mizumachi]. About the pressure sensitive adhesives, we have studied on the PSA performance (peel, tack, holding power) as a function of both the viscoelastic properties and surface chemical properties of the materials, and found out some rules, and again we have developed a theory which deseribes the mechanism. And in addition, we have studied on the miscibility between linear polymers and oligomers, because PSA is generally manufactured by blending gums and tackifier resins. Many phase diagrams have been found and some of them have been analyzed on thermodynamic basis, and it became evident that the miscibility is a very important factor in PSA [H. J. Kin and H. Mizumachi]. In this presentation, I want to emphasize the fact that the adhesion performance is closely related to the structure/property of the adhesives.adhesives.

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Effects of Anodic Voltages of Photcatalytic TiO2 and Doping in H2SO4 Solutions on the Photocatalytic Activity (광촉매 TiO2의 황산용액에서의 양극산화전압과 도핑이 광촉매 활성에 미치는 영향)

  • Lee, Seung-Hyun;Oh, Han-Jun;Chi, Choong-Soo
    • Korean Journal of Materials Research
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    • v.22 no.8
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    • pp.439-444
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    • 2012
  • To compare the photocatalytic performances of titania for purification of waste water according to applied voltages and doping, $TiO_2$ films were prepared in a 1.0 M $H_2SO_4$ solution containing $NH_4F$ at different anodic voltages. Chemical bonding states of F-N-codoped $TiO_2$ were analyzed using surface X-ray photoelectron spectroscopy (XPS). The photocatalytic activity of the co-doped $TiO_2$ films was analyzed by the degradation of aniline blue solution. Nanotubes were formed with thicknesses of 200-300 nm for the films anodized at 30 V, but porous morphology was generated with pores of 1-2 ${\mu}m$ for the $TiO_2$ anodized at 180 V. The phenomenon of spark discharge was initiated at about 98 V due to the breakdown of the oxide films in both solutions. XPS analysis revealed the spectra of F1s at 684.3 eV and N1s at 399.8 eV for the $TiO_2$ anodized in the $H_2SO_4-NH_4F$ solution at 180 V, suggesting the incorporation of F and N species during anodization. Dye removal rates for the pure $TiO_2$ anodized at 30 V and 180 V were found to be 14.0% and 38.9%, respectively, in the photocatalytic degradation test of the aniline blue solution for 200 min irradiation; the rates for the F-N-codoped $TiO_2$ anodized at 30 V and 180 V were found to be 21.2% and 65.6%, respectively. From the results of diffuse reflectance absorption spectroscopy (DRS), it was found that the absorption edge of the F-N-codoped $TiO_2$ films shifted toward the visible light region up to 412 nm, indicating that the photocatalytic activity of $TiO_2$ is improved by appropriate doping of F and N by the addition of $NH_4F$.