• Title/Summary/Keyword: bonding surface

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Studies on Mechanical Properties of Thermoplastic Vulcanizate Containing Acid Group (Acid Group이 도입된 TPV (Thermoplastic Vulcanizate)계 열가소성 탄성체의 기계적 물성에 관한 연구)

  • Kim, Dong Ho;Kim, Gu Ni
    • Journal of Adhesion and Interface
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    • v.16 no.2
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    • pp.63-68
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    • 2015
  • We synthesized thermoplastic polyurethane elastomer containing carboxylic acid group and TPV (thermoplastic vulcanizate). We measured the mechanical, grip, debris, contact angle and adhesion properties according to introducing acid group in elastomer structure. Mechanical and wet slip properties were improved because of the hydrogen bonding by introduction of acid group. Also adhesion strength was increased as increasing of surface polarity by carboxylic acid group. The debris property of TPV made from TPU containing carboxylic acid group was improved.

A 12.5-Gb/s Optical Transmitter Using an Auto-power and -modulation Control

  • Oh, Won-Seok;Park, Kang-Yeob;Im, Young-Min;Kim, Hwe-Kyung
    • Journal of the Optical Society of Korea
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    • v.13 no.4
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    • pp.434-438
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    • 2009
  • In this paper, a 12.5-Gb/s optical transmitter is implemented using 0.13-${\mu}m$ CMOS technology. The optical transmitter that we constructed compensates temperature effects of VCSEL (Vertical cavity surface emitting laser) using auto-power control (APC) and auto-modulation control (AMC). An external monitoring photodiode (MPD) detects optical power and modulation. The proposed APC and AMC demonstrate 5$\sim$20-mA of bias-current control and 5$\sim$20-mA of modulation-current control, respectively. To enhance the bandwidth of the optical transmitter, an active feedback amplifier with negative capacitance compensation is exploited. The whole chip consumes only 140.4-mW of DC power at a single 1.8-V supply under the maximum modulation and bias currents, and occupies the area of 1280-${\mu}m$ by 330-${\mu}m$ excluding bonding pads.

Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder

  • Eom, Yong-Sung;Jang, Keon-Soo;Moon, Jong-Tae;Nam, Jae-Do
    • ETRI Journal
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    • v.32 no.3
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    • pp.414-421
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    • 2010
  • The interconnection mechanisms of a smart anisotropic conductive adhesive (ACA) during processing have been characterized. For an understanding of chemorheological mechanisms between the fluxing polymer and solder powder, a thermal analysis as well as solder wetting and coalescence experiments were conducted. The compatibility between the viscosity of the fluxing polymer and melting temperature of solder was characterized to optimize the processing cycle. A fluxing agent was also used to remove the oxide layer performed on the surface of the solder. Based on these chemorheological phenomena of the fluxing polymer and solder, an optimum polymer system and its processing cycle were designed for high performance and reliability in an electrical interconnection system. In the present research, a bonding mechanism of the smart ACA with a polymer spacer ball to control the gap between both substrates is newly proposed and investigated. The solder powder was used as a conductive material instead of polymer-based spherical conductive particles in a conventional anisotropic conductive film.

Design optimization of the outlet holes for bone crystal growing with bioactive materials in dental implants: Part II. number and shapes

  • Lee, Kangsoo;Kim, Geug Tae;Lee, Yong Keun
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.23 no.2
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    • pp.76-80
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    • 2013
  • For further improvement of osseo-integration of bone crystal with a dental implant, a design optimization study is carried out for various holes inside its body to deliver bioactive materials and the effect of bioactive material injection on the bone crystal growing. When bioactive material is absorbed, the bone crystal can grow into holes, which would increase the strength of implant bonding as well as a surface integration. The stress concentrations near the uppermost outlet holes were reduced with increasing the number of outlet holes. A design improvement in the uppermost outlet was shown to be effective in reducing the stress concentration. For design parameters under consideration in this study, total area of outlet of 6.38 $mm^2$ and maximum stress of 1.114 MPa, which corresponds to type 6-C. It is due to the minimization of maximum stress and total area of outlet. The design of the outlet facing down was more effective in reducing the maximum stress value compared with a horizontal symmetry.

Study on Shear Bond Strength of Ni-Cr Alloy for Porcelain Fused to Metal Crown at the Temperature of Degassing (치과 도재용착용 Ni-Cr 합금의 열처리에 따른 결합력 연구)

  • Joo, Kyu-Ji;Shin, Jae-Woo;Cho, Hong-Kyu
    • Journal of Technologic Dentistry
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    • v.38 no.2
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    • pp.69-77
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    • 2016
  • Purpose: This study was to evaluate the shear bond strength of ceramic fused to Ni-Cr alloy(Alophaloy) by heat treatment. Methods: The specimens were divided into 5 groups according to heat treatment conditions prior to porcelain application. Eighteen specimens from each group were subjected to the shear load a universal testing machine using a 0.1mm/min cross-head speed and two specimens from each group were observed with SEM and EDX line profile. Results: The observation of the oxide film on the metal surface by SEM photograph showed a coarsening with an increasing degassing hold time. The diffusion of metal oxide was observed farther from the opaque layer in the heat treated specimen than no heat treated specimen. The shear bond strength measured highest to A5(55.23MPa) in the 10min holding group and measured lowest from A1(24.38MPa) in the no heat treated group, and there was a significant difference(p<0.05). Conclusion: The shear bond strength of Ni-Cr alloy improved in the heat treatment compared to the no heat treatment specimen.

EFFECT OF DEGASSING CONDITION ON CERAMIC BOND STRENGTH OF Ni-Cr ALLOYS (Degassing 조건이 Ni-Cr 합금의 도재결합력에 미치는 영향)

  • Lee, Eun-Hwa;Jeon, Young-Chan;Jeong, Chang-Mo;Lim, Jang-Seop
    • The Journal of Korean Academy of Prosthodontics
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    • v.38 no.4
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    • pp.461-471
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    • 2000
  • This study evaluated the effect of degassing on the ceramic bond strength of two Ni-Cr alloys under varying holding time at the upper limit temperature and atmospheric conditions. Metal specimens were divided into 5 groups for each alloy according to degassing conditions prior to porcelain application no degassing, degassing under vacuum without hold, degassing under vacuum with hold for 5 min. and 10 min. respectively at the upper limit temperature and degassing in air. Total number of metal ceramic specimens was eighty and each group had eight specimens. The ceramic bond strength was measured by four-point flexural test using Instron and the fractured surface was examined under SEM. The results obtained were as follows. 1. Degassing in air improved the ceramic bond strength of Ni-Cr alloys. 2. In degassing under vacuum, hold at the upper limit temperature was advantageous to the ceramic bonding of Ni-Cr alloys. 3. After ceramic metal bond test, metal surfaces were partially covered with the thin porcelain layer, and the cohesive failures in porcelain were predominant in groups showing higher ceramic bond strength.

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Mechanical properties of epoxy composites reinforced with ammonia-treated graphene oxides

  • Park, Mi-Seon;Lee, Sangmin;Lee, Young-Seak
    • Carbon letters
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    • v.21
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    • pp.1-7
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    • 2017
  • The effects of ammonia-treated graphene oxide (GO) on composites based on epoxy resin were investigated. Ammonia solutions of different concentrations (14-28%) were used to modify GO. Nitrogen functional groups were introduced on the GO surfaces without significant structural changes. The ammonia-treated GO-based epoxy composites exhibited interesting changes in their mechanical properties related to the presence of nitrogen functional groups, particularly amine ($C-NH_2$) groups on the GO surfaces. The highest tensile and impact strength values were 42.1 MPa and 12.3 J/m, respectively, which were observed in an epoxy composite prepared with GO treated with a 28% ammonia solution. This improved tensile strength was 2.2 and 1.3 times higher than those of the neat epoxy and the non-treated GO-based epoxy composite, respectively. The amine groups on the GO ensure its participation in the cross-linking reaction of the epoxy resin under amine curing agent condition and enhance its interfacial bonding with the epoxy resin.

Synthesis of transparent conductive film containing solution -deposited poly (3, 4-ethylenedioxythiophene) (PEDOT) and water soluble multi-walled carbon nanotubes

  • Tung, Tran Thanh;Kim, Won-Jung;Kim, Tae-Young;Lee, Bong-Seok;Suh, Kwang-S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.205-206
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    • 2008
  • The transparent conductive film was prepared by bar coating method of poly (3, 4-ethylenedioxythiophene) (PEDOT) and poly (sodium 4-stylenesulfonate) grafted multi-walled carbon nanotubes (MWNT-PSS) nanocomposites solution on the polyethylene terephthalate (PET) film. In this case, multi-wall carbon nanotubes was treated by chemical methods to obtain water soluble MWNT-PSS and then blending with PEDOT. The non-covalent bonding of polymer to the MWNT surface was confirmed by Fourier transform infrared (FT-IR), thermal gravimetric analysis (TGA) and Transmission electro microscope (TEM) investigation also showed a polymer-wrapped MWNT structure. Furthermore, the electrical, transmission properties of the transparent conductive film were investigated and compared with control samples are raw PEDOT films.

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Formation Mechanism of a Large Schottky Barrier Height for Cr-AlGaN/GaN Heterostructure (Cr/n-AlGaN/GaN Schottky Contact에서 높은 쇼트키 장벽 형성 메카니즘에 관한 연구)

  • Nam, Hyo-Duk;Lee, Yeung-Min;Jang, Ja-Soon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.4
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    • pp.266-270
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    • 2011
  • We report on the formation mechanism of large Schottky barrier height (SBH) of nonalloyed Cr Schottky contacts on strained Al0.25Ga0.75N/GaN. Based on the current-voltage (I-V) and capacitance-voltage (C-V) data, the SBHs are determined to be 1.98 (${\pm}0.02$) and 2.07 (${\pm}0.02$) eV from the thermionic field emission and two-dimensional electron gas (2DEG) calculations, respectively. Possible formation mechanism of large SBH will be described in terms of the formation of Cr-O chemical bonding at the interface between Cr and AlGaN/GaN, low binding-energy shift to surface Fermi level, and the reduction of 2DEG electrons.

FE Analysis of RC Beams Strengthened with Carbon Fiber Sheet (탄소섬유쉬트로 보강된 RC 보의 유한요소해석)

  • 한상호;이경동
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.16 no.1
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    • pp.53-58
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    • 2003
  • Carbon fiber sheet has been used to rehabilitate many types of reinforced concrete members with its superior characteristics such as their lightweight, high strength, corrosion resistance, and easy execution. But the failure behavior of reinforced concrete members show a high variation by the bond characteristics between carbon fiber sheet and concrete surface. In this study, a bond stress-slip model, which accounts for changes in bonding behavior between concrete and carbon fiber sheet with some link elements, is proposed. The link elements are used to represent the concrete-carbon fiber sheet interface. To investigate the efficiency of this method, the analytical solutions for the behavior of reinforced concrete beam strengthened with carbon fiber sheet are compared with experimental ones. Results from the proposed model comparatively well agree with the experimental results.