• Title/Summary/Keyword: bonding surface

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A Study on the Adhesiveness between Polyurethane Sheet for Maxillofacial Prostheses and Autopolymerizing Acrylic Resin in Various Polymerization Methods (다양한 중합방법에 따른 악안면 보철용 폴리우레탄과 자가중합 레진 간의 결합력에 관한 연구)

  • Kim, Doo-Yeol;Cho, In-Ho
    • Journal of Dental Rehabilitation and Applied Science
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    • v.16 no.2
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    • pp.123-132
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    • 2000
  • The field of maxillofacial prosthetics is concerned with the prosthetic reconstruction of missing head and neck tissue. Currently, facial prostheses are usually applied in cases of defects caused by the surgical removal of tumors or congenital defects. While silicone has been most widely used for the reconstruction of missing maxillofacial defects, it does not have ideal physical properties. Therefore, bonding a thin polyurethane sheet to silicone prostheses was recommended. In this case skin adhesives were used for the retention of maxillofacial prostheses. But retention of devices has always been problematic. The contributions of implants can be made to solve these problems. Implants have reduced the need for adhesive use, simplifying cleaning procedures and thus extending the life of the prostheses. For implant-retained prostheses, retentive matrix is necessary to hold attachments and/or magnets. The retentive matrix is usually fabricated with autopolymerizing acrylic resin or visible light- polymerized resin. The purpose of this study was to compare the adhesion-in-peel force of silicone adhesive to autopolymerizing acrylic resin and polyurethane sheet with two different surface textures : pumice polish only or retention groove, and three surface primers : Dow corning 1205 primer or Dow corning S-2260 primer or FactorII A-304 primer, and two polymerization methods : room temperature or dry heat oven. The t-peel bond strength of specimens was determined as described in ASTM Standard D1876-72. The results were statistically analyzed using the ANOVA test, multiple range test and t-test The results were as follows. 1. The t-peel bond strength of A-304 primer was the highest and statistically higher than that of S-2260(p<0.05). 2. The t-peel bond strength of specimens with retention groove was statistically higher than that of specimens polished with pumice(p<0.05). 3. The t-peel bond strength of specimens polymerized in dry heat oven was statistically higher than that of specimens in room temperature(p<0.01).

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A Study on the Tensile Strength between Light-cured Relining Resin and Metal Denture Base (광중합형 이장재와 금속의치상 간의 결합력에 관한 연구)

  • Park, In-Chae;Lee, Joon-Kyu;Chung, Chae-Heon
    • Journal of Dental Rehabilitation and Applied Science
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    • v.16 no.2
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    • pp.161-170
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    • 2000
  • The use of autopolymerizing-cured resin and light-cured resin for direct relining of complete and partial dentures has been popular. This investigation compared the adhesion of autopolymerizing-cured reline resin(Tokuso Rebase, Mild Rebaron) or light-cured reline resin(Mild Rebaron LC, Lighton-U) to metal base or resin base. Cylindrical samples were made from metal($Biosil^{(R)}$) or heat-cured resin(QC-20) and were prepared to produce a flat bonding surface. Cylindrical metal samples were roughened by scratch or by scratch and sandblast and were treated with primer(MR Bond) after scratch and sandblast. And then, liners were prossesed to the cylindrical metal or resin samples according to the manufacturer's recomendations so as to bond metal base or resin base. The specimens were tested in pure tension by using an Instron Univasal testing machine for the four direct reline resins. The results were as follows ; 1. In comparison with tensile bond strength of material relined on resin base or metal base, the case of resin base produced significantly higher tensile bond strengths than the case of metal base. 2. Metal surface pretreatment or primer improved the tensile bond strength between the reline resin and the metal($Biosil^{(R)}$) base. 3. The tensile bond strengths of Mild Rebaron LC relined on resin base or metal base were similar to those of the other reline resins.

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Adsorption Mechanism of Alkyl Ketones on Cation Supported by Layer Silicate. Link Formation of Hydroxyl Group (Layer Silicate에 지지된 양이온상에서 일어나는 Alkyl Ketones의 흡착기구. 水酸基의 Link 形成理論)

  • Jong Taik Kim;Jong Rack Sohn
    • Journal of the Korean Chemical Society
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    • v.17 no.4
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    • pp.247-255
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    • 1973
  • The self supported film specimen of Wyoming montmorillonite as a layer silicate saturated by cations,$Li^{+},\;Na^{+},\;K^{+},\;Ca^{2+},\;Ni^{2+},\;Al^{3+}$and$F^{3+}$ were allowed to contact acetone, methyl-ethyl ketone and diethyl ketone within the heatable gas cell. The i.r. spectra between $4000{\sim}1200cm^{-1}$ at different pressures of adsorbates indicated bond formation through carbonyl oxygen. Two types of carbonyl bond shift with maxima at $1713cm^{-1}$ and $1690cm^{-1}$ are attributed as coordinate bond formation of carbonyl with either surface hydroxyl or cationic hydroxyl group. The intensity of the vOH was analyzed and resonance form of cationic hydroxyl was proposed as an adsorption site. The tendency to form coordinate bond was in good agreement with calculated formal charge of carbonyl oxygen in an increasing order, acetone < methyl-ethyl ketone < diethyl ketone. As an additional mechanism of adsorption, weak hydrogen bonding of methyl hydrogen with surface oxygen was observed.

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An Evaluation on Thermal-Structural Behavior of Nozzle Assembly during Burning Time (연소시간 중 노즐조립체의 열-구조적 거동분석에 관한 연구)

  • Ro, Younghee;Seo, Sanggyu;Jeong, Seongmin
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2017.05a
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    • pp.536-542
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    • 2017
  • A great deal of difficulty is encountered in the thermo-mechanical analyses of nozzle assembly for solid propellant rocket motors. The main issue in this paper is the modeling of the boundary conditions and the connections between the various components-gaps, relative movements of the components, contacts, friction, etc. This paper evaluated the complex phenomena of nozzle assembly during burning time with co-simulation which include fluid, thermal surface reaction/ablation and structural analysis. The validity of this approach was verified by comparison of analysis results with measured strains.

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Deposition Behavior and Microstructure of Fe-based Amorphous Alloy Fabricated by Vacuum Kinetic Spraying Process (진공 저온 분사 공정을 통해 형성된 Fe계 비정질 재료의 적층거동 및 미세구조 변화 관찰)

  • Kwon, Juhyuk;Park, Hyungkwon;Lee, Illjoo;Lee, Changhee
    • Korean Journal of Materials Research
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    • v.24 no.1
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    • pp.60-65
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    • 2014
  • Fe-based amorphous coatings were fabricated on a soda-lime glass substrate by the vacuum kinetic spray method. The effect of the gas flow rate, which determines particle velocity, on the deposition behavior of the particle and microstructure of the resultant films was investigated. The as-fabricated microstructure of the film was studied by field emission scanning electron microscopy (FE-SEM) and high resolution transmission electron microscopy (HR-TEM). Although the activation energy for transformation from the amorphous phase to crystalline phase was lowered by severe plastic deformation and particle fracturing under a high strain rate, the crystalline phases could not be found in the coating layer. Incompletely fractured and small fragments 100~300 nm in size, which are smaller than initial feedstock material, were found on the coating surface and inside of the coating. Also, some pores and voids occurred between particle-particle interfaces. In the case of brittle Fe-based amorphous alloy, particles fail in fragmentation fracture mode through initiation and propagation of the numerous small cracks rather than shear fracture mode under compressive stress. It could be deduced that amorphous alloy underwent particle fracturing in a vacuum kinetic spray process. Also, it is considered that surface energy caused by the formation of new surfaces and friction energy contributed to the bonding of fragments.

EFFECT OF REWETTING AGENT ON DENTINAL MICROTENSILE BOND STRENGTH (상아질에 적용된 재 습윤제가 미세인장 결합강도에 미치는 영향)

  • Kang, Hee-Young;Cho, Young-Gon;Kim, Jong-Uk;Park, Byung-Cheul;Yoo, Sang-Hoon;Jin, Cheul-Hee;Choi, Hee-Young;Ki, Young-Jae
    • Restorative Dentistry and Endodontics
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    • v.29 no.2
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    • pp.153-161
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    • 2004
  • This study investigated that the effect of rewetting agent on dentinal microtensile bond strength(${\mu}TBS$). Human molars were sectioned to expose the superficial dentin surfaces. Samples were divided into two groups according to type of adhesives-Single Bond (S) and One-Step (0)], and again subdivided into five groups by different dentin surface treatment-dry for 15s (D), blot dry (BD) or dry for 15s, and rewet with different rewetting agents [distilled water (DW), Gluma Desensitizer (GD) and Aqua-Prep (AP)] for 30s. After application of adhesive, composite resin was built up on the bonding surface. Each tooth was sectioned to obtain stick with $1\textrm{mm}^2$ cross sectional area and the ${\mu}TBS$ was determined by EZ test. In the S group, the mean ${\mu}TBS$ of GD, AP, and BD group was significantly higher than that of DW and D group (p < 0.05), In the O group, the mean, ${\mu}TBS$ of AP, GD, BD and DW group was significantly higher than that of D group (p < 0.05). The data suggested that Gluma Desensitizer and Aqua-Prep could be successfully used as rewetting agents, and Distilled water could be acceptable in aceton based adhesive system only.

A Study on the Resistance Welding of Metallic Sandwich Panel : Part 1 - Determination of Process Parameters (저항 용접을 이용한 금속 샌드위치 판재 접합에 관한 연구 : Part 1 - 공정변수의 선정)

  • Lee Sang-Min;Kim Jin-Beom;Na Suck-Joo
    • Journal of Welding and Joining
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    • v.23 no.6
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    • pp.49-54
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    • 2005
  • Inner Structured and Bonded(ISB) panel, a kind of metallic sandwich panel, consists of two thin skin plates bonded to a micro-patterned inner structure. Its overall thickness is $1\~3mm$and it has attractive properties such as ultra-lightweight, high efficiency in stiffness-to-weight and strength-to-weight ratio. In many previous studies, resistance welding, brazing and adhesive bonding are studied for joining the panel. However these methods did not consider productivity, but focused on structural characteristics of joined panels, so that the joining process is very complicated and expensive. In this paper, a new joining process with resistance welding is developed. Curved surface electrodes are used to consider the productivity and the stopper is used between electrodes during welding time to maintain the shape of inner structure. Welding time, gap of electrodes and distance between welding points are selected as the process parameters. By measuring the tensile load with respect to the variation of welding time and gap of electrodes, proper welding conditions are studied. Welding time is proper between 1.5-2.5cycle. If welding time is too long, then inner structures are damaged by overheating. Gap of electrode should be shorter than threshold value fur joint strength, when total thickness of inner structure and skin plate is 3.3mm, the threshold distance is 3.0mm.

Effects of Deposition Parameters on the Bonding Structure and Optical Properties of rf Sputtered a-Si$_{1-x}$C$_{x}$: H films (RF 스퍼터링으로 증착된 a-Si$_{1-x}$C$_{x}$: H 박막의 결합구조와 광학적 성질에 미치는 증착변수의 영향)

  • 한승전;권혁상;이혁모
    • Journal of Surface Science and Engineering
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    • v.25 no.5
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    • pp.271-281
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    • 1992
  • Amorphous hydrogenated silicon carbide(a-Si1-xCx : H) films have been prepared by the rf sputtering using a silicon target in a gas mixture of Argon and methane with varying methane gas flow rate(fCH) in the range of 1.5 to 3.5 sccm at constant Argon flow rate of 30sccm and rf power in the range of 3 to 6 W/$\textrm{cm}^2$. The effects of methane flow rate and rf power on the structure and optical properties of a-Si1-xCx : H films have been analysed by measuring both the IR absorption spectrum and the UV transmittance for the films. With increasing the methane flow rate, the optical band gap(Eg) of a-Si1-xCx : H films increases gradually from 1.6eV to the maximum value of 2.42eV at rf power of 4 W/$\textrm{cm}^2$, which is due to an increases in C/Si ratio in the films by an significant increase in the number of C-Hn bonds. As the rf power increases, the number of Si-C and Si-Hn bonds increases rapidly with simultaneous reduction in the number of C-Hn bonds, which is associated with an increase in both degree of methane decomposition and sputtering of silicon. The effects of rf power on the Eg of films are considerably influenced by the methane flow rate. At low methane flow rate, the Eg of films decreased from 2.3eV to 1.8eV with the rf power. On the other hand, at high methane flow rate, that of films increased slowly to 2.4eV.

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Characteristics of electrically conductive adhesives filled with silver-coated copper

  • Nishikawa, Hiroshi;Terad, Nobuto;Miyake, Koich;Aoki, Akira;Takemoto, Tadashi
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.217-220
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    • 2009
  • Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

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Study on Peel Strength Measurement of 3D Printing Composite Fabric by Using FDM (FDM 방식을 활용한 3D 프린팅 복합직물의 박리강력 측정 연구)

  • Han, Yoojung;Kim, Jongjun
    • Journal of Fashion Business
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    • v.23 no.2
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    • pp.77-88
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    • 2019
  • One way of appling 3D printing to garments is through the combination of 3D polymer filaments in textile fabrics. it is essential to understand the interface between the polymer and the 3D composite fabric in order to enhance the adhesion strength between the polymers and the peeling strength between the fabric and the polymer. In this study, the adhesion of composite printed specimens using a combination of fabric and polymers for 3D printing was investigated, and also the change in adhesion was investigated after the composite fabric printed with polymers was subjected to constant pressure. Through this process, the aims to help develop and utilize 3D printing textures by providing basic data to enhance durability of 3D printing composite fabrics. The measure of the peeling strength of the composite fabric prepared by printing on a fabric using PLA, TPU, Nylon polymer was obtained as follows; TPU polymer for 3D printing showed significantly higher peel strength than polymers of composite fabric using PLA and Nylon polymer. In the case of TPU polymer, the adhesive was crosslinked because of the reaction between polyurethane and water on the surface of the fabric, thus increasing the adhesion. It could be observed that the adhesion between the polymer and the fiber is determined more by the mechanical effect rather than by its chemical composition. To achieve efficient bonding of the fibers, it is possible to modify the fiber surface mechanically and chemically, and consider the deposition process in terms of temperature, pressure and build density.