• Journal of Dental Rehabilitation and Applied Science
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• v.22 no.3
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• pp.211-220
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• 2006

Need of porcelain-repair system is largely demanding as dental porcelain restorations are increased in clinical dentistry. This study investigated shear bond strength of commercial porcelain-repair systems on dental porcelain and their reliability. Experimental groups were as follows; Group A Super Bond C&B, Group B Porcelain repair kit, Group C Ceramic repair, and Group D Spectrum system as a control. Porcelain disks were fired and embedded in epoxy resin. Porcelain surface were ground using 220 grit SiC disk, then cleaned in ultrasonic bath. Then porcelain specimens were treated with each repair system. A clear polystyrene cylinder 3.5 mm in internal diameter was filled with composite resin. Then the resin cylinder was polymerized with a visible light curing unit. Thirty one specimens at each group were prepared and stored at $37^{\circ}C$ distilled water for 48 h. Specimens were tested in an Instron testing machine according to ISO TR 11405. Mean shear bond strength and standard deviation of each group was $15.7{\pm}4.1MPa$ (Group A), $12.8{\pm}4.9MPa$ (Group B), $7.2{\pm}3.0MPa$ (Group C) and $9.6{\pm}2.2MPa$ (Group D). ANOVA and Tukey HSD post-hoc test showed that there were significant differences between groups (p<0.05). Data of bond strength were analyzed with two-parameter Weibull distribution. Confidence interval of Weibull modulus (m-parameter) at 95% of Group A (3.5-6.3) and Group D (3.6-6.0) were significantly higher than Group B (2.2-3.7) and Group C (2.0-3.4). There was little correlation between mean shear bond strength and Weibull modulus. Results indicated that acid-etching of porcelain surface increased porcelain-resin shear bonding strength.

• Journal of Sensor Science and Technology
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• v.16 no.6
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• pp.457-461
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• 2007

This paper describes the characteristics of poly (polycrystalline) 3C-SiC grown on $SiO_{2}$ and AlN substrates, respectively. The crystallinity and the bonding structure of poly 3C-SiC grown on each substrate were investigated according to various growth temperatures. The crystalline quality of poly 3C-SiC was improved from resulting in decrease of FWHM (full width half maximum) of XRD and FT-IR by increasing the growth temperature. The minimum growth temperature of poly 3C-SiC was $1100^{\circ}C$. The surface chemical composition and the electron mobility of poly 3C-SiC grown on each substrate were investigated by XPS and Hall Effect, respectively. The chemical compositions of surface of poly 3C-SiC films grown on $SiO_{2}$ and AlN were not different. However, their electron mobilities were $7.65{\;}cm^{2}/V.s$ and $14.8{\;}cm^{2}/V.s$, respectively. Therefore, since the electron mobility of poly 3C-SiC films grown on AlN buffer layer was two times higher than that of 3C-SiC/$SiO_{2}$, a AlN film is a suitable material, as buffer layer, for the growth of poly 3C-SiC thin films with excellent properties for M/NEMS applications.

• Journal of Adhesion and Interface
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• v.16 no.2
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• pp.55-62
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• 2015

It was investigated that the effect of surface modification and concentration of fumed silica on the adhesion properties and thermal stability of 2-EHA/AA pressure sensitive adhesive (PSAs) prepared by UV irradiation. The influence of repeating units of crosslinking agent on PSAs were also studied. From SEM analysis, PSAs synthesized with surface modified silica had finer dispersion of silica particles in polymer matrix due to the interfacial interaction. Results of the study showed that increase in tack and peel strength when under 0.3 wt% of silane treated silica were added in the reaction mixture. The addition of PEGDMA for crosslinking agent offers positive effect on adhesion properties in comparison with PSAs using EGDMA for crosslinker, which may be attributed to high mobility of ethylene oxide repeating units in PEGDMA. From the thermal degradation residue of PSAs, it was revealed that thermal stability was improved with silica addition due to the strong interfacial bonding between silane modified silica and polymer matrix, which may act as a thermal barriers into 2-EHA/AA PSAs.

• Korean Journal of Materials Research
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• v.20 no.8
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• pp.434-438
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• 2010

The selenization process has been a promising method for low-cost and large-scale production of high quality CIGS film. However, there is the problem that most Ga in the CIGS film segregates near the Mo back contact. So the solar cell behaves like a $CuInSe_2$ and lacks the increased open-circuit voltage. In this study we investigated the Ga distribution in CIGS films by using the $Ga_2Se_3$ layer. The $Ga_2Se_3$ layer was applied on the Cu-In-Ga metal layer to increase Ga content at the surface of CIGS films and to restrict Ga diffusion to the CIGS/Mo interface with Ga and Se bonding. The layer made by thermal evaporation was showed to an amorphous $Ga_2Se_3$ layer in the result of AES depth profile, XPS and XRD measurement. As the thickness of $Ga_2Se_3$ layer increased, a small-grained CIGS film was developed and phase seperation was showed using SEM and XRD respectively. Ga distributions in CIGS films were investigated by means of AES depth profile. As a result, the [Ga]/[In+Ga] ratio was 0.2 at the surface and 0.5 near the CIGS/Mo interface when the $Ga_2Se_3$ thickness was 220 nm, suggesting that the $Ga_2Se_3$ layer on the top of metal layer is one of the possible methods for Ga redistribution and open circuit voltage increase.

• Current Photovoltaic Research
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• v.1 no.1
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• pp.63-68
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• 2013

We investigated the effects of Au eutectic reaction on Si thin film growth by hot wire chemical vapor deposition. Small SiC and Si nano-particles fabricated through a wet etching process were coated and biased at 50 V on micro-textured Si p-n junction solar cells. Au thin film of 10 nm and a Si thin film of 100 nm were then deposited by an electron beam evaporator and hot wire chemical vapor deposition, respectively. The Si and SiC nano-particles and the Au thin film were structurally embedded in Si thin films. However, the Au thin film grew and eventually protruded from the Si thin film in the form of Au silicide nano-balls. This is attributed to the low eutectic bonding temperature ($363^{\circ}C$) of Au with Si, and the process was performed with a substrate that was pre-heated at a temperature of $450^{\circ}C$ during HWCVD. The nano-balls and structures showed various formations depending on the deposited metals and Si surface. Furthermore, the samples of Au nano-balls showed low reflectance due to surface plasmon and quantum confinement effects in a spectra range of short wavelength spectra range.

• The Journal of the Korea Contents Association
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• v.15 no.2
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• pp.344-351
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• 2015

The purpose of this study was to evaluate the effect of the surface treatment of widely used in dental of silane coupling agent concentration on the shear bond strength of denture base resin and self curing resins. Denture base resin surface was treated with silane coupling agent concentration, after self curing resins were injected shear bond strength was measured. The results of silane coupling agent(MPS) concentration on the shear bond strength of Vertex self curing resin showed that the value of 5%, 7% groups were higher than that of other group(P<0.05). Silane coupling agent concentration on the shear bond strength of Kooliner resin showed that the value of 5% was highest(P<0.05). Therefore, we could conclude 5% MPS to strengthen effectively the shear bonding property of denture base resin and self curing resins of this study.

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.5
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• pp.502-513
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• 2001

The purpose of this study was to evaluate the effect of dentin pretreatment with Dentin Conditioner, Ultra-Etch, conditioner of Fuji Plus cement on the shear bond strength of resin-reinforced glass ionomer cements to dentin and analyze the fractured surfaces. To evaluate the bond strength, the extracted human teeth which had uniform area of exposed dentin were cemented with conventional glass ionomer cement, 3M $RelyX^{TM}$ Luting (Vitremer luting cement), Fuji Plus cement after dentin pretreatment. The shear bond strength was measured using the Universal testing machine (Instron Co., USA) with a crosshead speed of 1mm/m. The effect of dentin pretreatment was evaluated by observing pretreated dentin surfaces under the scanning electron microscope, measuring the shear bond strength and observing the fractured surfaces under the scanning electron microscope. The results were as follows : On the SEM observation of surface morphology, the specimens treated with Dentin Conditioner. Ultra-Etch and conditioner of Fuji Plus cement were removed the smear layer and funneled dentinal tubules in dentin surfaces. In $RelyX^{TM}$ Luting cement group, shear bond strength of pretreated group was significantly higher than control group. In Fuji Plus cement group and Fuji I group, regardless of the type of pretreatment agents, there was tendency of increase in the shear bond strength. On the SEM observation of fractured surfaces, as the shear bond strength increase, it were shown thicker cement layers and were not shown dentinal tubules According to these results. it were shown that dentin pretreatment have much effect on bonding states.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.456-461
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• 2009

Chemical composition and status of chemical bonding of the YAG($Y_3Al_5O_{12}$) ceramics after the exposure to fluorine plasma have been investigated using X-ray photoelectron spectroscopy, with the analysis on its erosion behavior. On the surface, F showed the maximum content, decreasing with depth, meanwhile the cation composition remained almost constant, irrespective of the position. The peaks due to Y in the reaction layer consisted of two kinds, showing the Y-O and Y-F bonds. These surface modifications under fluorine plasma seem to promote the erosion of the YAG ceramics. Excess addition of $Al_2O_3$ or $Y_2O_3$ into stoichiometric YAG produced 2nd phases of $Al_2O_3$ and $YAlO_3$, respectively, resulting in the slight difference in the local erosion rates. But, the overall average erosion rate was not sensitive to such excess additions of $Al_2O_3$ or $Y_2O_3$.

• The Journal of Advanced Prosthodontics
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• v.5 no.2
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• pp.98-103
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• 2013

PURPOSE. To evaluate the effects of hydrofluoric acid etching and Er,Cr:YSGG laser irradiation on the shear bond strength of resin cement to lithium disilicate ceramic. MATERIALS AND METHODS. Fifty-five ceramic blocks ($5mm{\times}5mm{\times}2mm$) were fabricated and embedded in acrylic resin. Their surfaces were finished with 1000-grit silicon carbide paper. The blocks were assigned to five groups: 1) 9.5% hydrofluoric-acid etching for 60 s; 2-4), 1.5-, 2.5-, and 6-W Er,Cr:YSGG laser applications for 60 seconds, respectively; and 5) no treatment (control). One specimen from each group was examined using scanning electron microscopy. Ceramic primer (Rely X ceramic primer) and adhesive (Adper Single Bond) were applied to the ceramic surfaces, followed by resin cement to bond the composite cylinders, and light curing. Bonded specimens were stored in distilled water at $37^{\circ}C$ for 24 hours. Shear bond strengths were determined by a universal testing machine at 1 mm/min crosshead speed. Data were analyzed using Kruskal-Wallis and Mann-Whitney U-tests (${\alpha}$=0.05). RESULTS. Adhesion was significantly stronger in Group 2 ($3.88{\pm}1.94$ MPa) and Group 3 ($3.65{\pm}1.87$ MPa) than in Control group ($1.95{\pm}1.06$ MPa), in which bonding values were lowest (P<.01). No significant difference was observed between Group 4 ($3.59{\pm}1.19$ MPa) and Control group. Shear bond strength was highest in Group 1 ($8.42{\pm}1.86$ MPa; P<.01). CONCLUSION. Er,Cr:YSGG laser irradiation at 1.5 and 2.5 W increased shear bond strengths between ceramic and resin cement compared with untreated ceramic surfaces. Irradiation at 6 W may not be an efficient ceramic surface treatment technique.

• Journal of Dental Rehabilitation and Applied Science
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• v.16 no.3
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• pp.211-220
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• 2000

The use of autopolymerizing-cured resin and light-cured resin for direct relining of complete and partial dentures has been popular. This investigation compared the adhesion of autopolymerizing-cured reline resin(Tokuso Rebase, Mild Rebaron) or light-cured reline resin(Mild Rebaron LC, Lighton-U) to metal base or resin base. Cylindrical samples were made from metal($Biosil^{(R)}$) or heat-cured resin(QC-20) and were prepared to produce a flat bonding surface. Cylindrical metal samples were roughened by scratch or by scratch and sandblast and were treated with primer(MR Bond) after scratch and sandblast. And then, liners were prossesed to the cylindrical metal or resin samples according to the manufacturer's recommendations so as to bond metal base or resin base. The specimens were tested in pure tension by using an Instron Univesal testing machine for the four direct reline resins. The results were as follows ; 1. In comparison with tensile bond strength of material relined on resin base or metal base, the case of resin base produced significantly higher tensile bond strength than the case of metal base. 2. Metal surface pretreatment or primer improved the tensile bond strength between the reline resin and the metal($Biosil^{(R)}$) base. 3. The tensile bond strength of Mild Rebaron LC relined on resin base or metal base were similar to those of the other reline resins.