• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.25-29
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• 2002

We have fabricated a vertical trench Hall device which is sensitive to the magnetic field parallel to the sensor surface. The vertical trench Hall device has been built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT has been measured.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.203-205
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• 1996

DLC(Diamond-Like Carbon) films were prepared by Inductively Coupled Plasma(ICP) CVD system. It was confirmed that the field emission characteristics are closely related to the richness of C-H bonding incorporated in the DLC. According to Fowler-Nordheim equation, it is thought that the ability of DLC to emit electron at relatively low voltage is due to the field enhancement caused by the nodules of ${\sim}100nm$ size on the surface of DLC. The electric field to start field emission was about $1.4{\times}10^9V/m$ in case of DLC film deposited at input power of 400W and substrate bias of -100V.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.631-632
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• 2006

Cr-C-Ni composites were synthesized in situ from elemental powders of Cr, Ni and C by high energy milling followed by reactive sintering. The milled powders with the grain size in nano-scale were pressed to compacts and sintered. During the following thermal treatment at first the chromium carbide was formed and then the $Cr_3C_2-Ni$ cermets were sintered in one cycle. The interface between the binder phase and the carbide grains of the in situ composite has a good bonding strength as it is not contaminated with oxidation films or other detrimental surface reactions.

• Journal of the Korea Institute of Military Science and Technology
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• v.10 no.3
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• pp.173-180
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• 2007

In this paper, we have proposed a simple finite element model for separation mode analysis on the roadwheel and track assembly of main battle tank and established a contact stress-based mechanism which could explain the initiation and growth of separation defect occurred during the test of padreplacable track. It was proved that the longitudinal contact shear stress component on the pin hole region of the track shoe body which is parallel to the driving direction is consistent with the crack initiation at the bonding surface between track shoe and wheel-side rubber. The longitudinal shear stress increased locally near the separated region after the separation initiated. So we could assume that the local stress concentration accelerates the separation growth according to the shear mode.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.251-253
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• 2002

We have fabricated a novel Vertical Trench Hall-Effect Device sensitive to the magnetic field parallel to the sensor chip surface for non-contact angular position sensing applications. The Vertical Trench Hall-Effect Device is built on SOI wafer which is produced by silicon direct bonding technology using bulk micromachining, where buried $SiO_2$ layer and surround trench define active device volume. Sensitivity up to 150 V/AT is measured.

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.569-569
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• 2003

I. Objectives The purpose of this study was to evaluate the effort of a modified luting procedure called "dual bonding technique" by compare micro-shear bond strength to different luting procedures of ceramics to dentin. II. Materials and Methods Eighty-four freshly extracted caries-and restoration-free human third molar were embedded in epoxy resin using acrylic ring. Flat superficial occlusal dentin surfaces were obtained, initially using a Low speed diamond saw and exposed detin surface was group with ＃600-grit SiC paper.(omitted)

• Proceedings of the KACD Conference
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• 2003.11a
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• pp.625-625
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• 2003

I. Objectives Self-etching primer adhesive system is affected to dentin surface conditioning and priming. Especially application time of self-etching primer is very important factor of clinical procedure which has direct influence on smear layer, etching reaction and primer penetration to dentin. This study evaluated the influence of application time of self-etching primers on microtensile bond strength (${\mu}{\;}TBS$) to dentin using three self-etching primer adhesive systems.(omitted)

• Bulletin of the Korean Chemical Society
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• v.16 no.10
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• pp.929-933
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• 1995

The electronic band structure and electrical properties of KMo4O6 containing chains of condensed molybdenum octahedra are analyzed by means of the extended Hu&ckel tight-binding method. KMo4O6 has partially filled bands of 1D as well as 3D character. They also exhibit the anisotropic band dispersions with bandwidths much larger along the c* axis than along the directions perpendicular to it. Thus, conduction electrons are essentially delocalized along the c* direction (i.e., the chain of condensed molybdenum octahedra) in the solid. The 1D band of two partially filled d-block bands leads to Fermi surface nesting with the wave vector q=0.3c*. The CDW instability due to this nesting is expected to cause the phase transition associated with the resistivity anomaly at low temperature. The characteristics of metallic behavior in the crystallographic ab plane are explained on the basis of the unnested 2D Fermi surfaces.

• Korean Journal of Metals and Materials
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• v.48 no.4
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• pp.326-334
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• 2010

Porous and net-shaped tantalum powder for a capacitor was formulated in a SHS (self-propagating high-temperature synthesis) process. However, this powder, which has weak strength among its particles and low flow ability, cannot be used for a capacitor. Therefore, this powder was sintered in a high-vacuum furnace to increase agglomeration to improve the flow ability, bonding strength among the particles, and shrinkage during pellet sintering. Finally, it was deoxidated with 2 wt% Mg powder to remove the increased surface oxygen that arose during the sintering process. The final product was analyzed in terms of its chemical and physical properties and was compared with a commercial powder used by a capacitor manufacturer.

• Journal of Industrial and Engineering Chemistry
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• v.67
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• pp.199-209
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• 2018

Polyethersulfone (PES)/sulfonated $TiO_2$ ($STiO_2$) nanoparticles (NPs) UF blended membranes were fabricated with different loadings of $STiO_2$. The modified membranes exhibited significant improvement in surface roughness, porosity, and pore size when compared to the PES membrane. The $P-STiO_2$ 1 and $P-TiO_2$ 1 blended membranes exhibited higher water flux, approximately 102.4% and 62.6%, respectively, compared to PES. SPP-$STiO_2$ and $P-STiO_2$ showed lower Rir fouling resistance than the $P-TiO_2$ blended membrane. Overall, the $STiO_2$-blended membranes provide high hydrophilicity permeability, anti-fouling performance, and improved BSA rejection attributed to the hydrogen bonding force and more electrostatic repulsion properties of $STiO_2$.