• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.171-172
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• 2018

The purpose of this study is to confirm the adhesion performance of the three - dimensional forming fiber panels by the dimensional forming angle. As a result of applying the three dimensional surface shape to the back side of the fiber panel and testing the adhesion strength by the three dimensional forming angle, it was confirmed that the bonding strength of the specimens to which the dimensional molding was applied was higher than that of the non dimensional molding. In addition, the highest adhesion strength was confirmed in a specimen having a three-dimensional forming angle of 70 °.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.9-12
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• 2004

Presented is a preliminary design concept of the carbon-glass hybrid composite rebars for the application in the construction field. A glass fiber rod with indentation is used for the core of the rebar. Carbon fibers are placed over the glass core by pultrusion. To increase the mechanical locking force and bonding surface, carbon filament windings are added in the hoop direction over the carbon face. Finite element analysis and test were conducted to evaluate the effective stiffness and strength of the rods. The results show that the effective axial stiffness of the rebar with indentation are about $50\%$ of the straight rebar.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.2
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• pp.144-148
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• 2013

In this paper, the ultra water-repellent thin films were prepared by RF PECVD. On the basis of surface morphology, chemical bonding states and plasma diagnostics, a formation model of clusters for the ultra water-repellent films was discussed from considerations of formation process and laser scattering results. Moreover, using laser scattering method, the relative change of quantity of nano-clusters or size of agglomerates could be confirmed. From the results, the films were deposited with nano-clusters and those of agglomerates, which formed in organosilicon plasma, and formation of agglomerates were depended on the deposition time.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.59-66
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• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.

• Journal of the Korean Geophysical Society
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• v.6 no.4
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• pp.245-259
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• 2003

Two multichannel analysis of surface wave (MASW) surveys were conducted over a soil site in Tacoma Water's Green River Facility, Washington, where construction of a chemical treatment facility had been planned. The purpose of the surveys was to compare soil stiffness characterized by shear-velocity (Vs) distribution before and after Deep Dynamic Compaction (DDC) operation that was designed to improve the soil stiffness. Site soil consisted of very heterogeneous gravel and cobbles in a sand-and-silt matrix. Results from each survey are represented by two 2-D Vs maps delineating Vs variation of soil below the surveyed lines. One map was constructed from those dispersion curves that were analyzed with a significant amount of subjective judgment involved, whereas the other map was constructed from those dispersion curves analyzed with as much objective information as possible. Comparison of 2-D Vs maps indicates that Vs actually decreased after the DDC operations, possibly due to the loss (or reduction) of cohesive bonding between soil particles caused by the compaction operations.

• Journal of the Semiconductor & Display Technology
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• v.1 no.1
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• pp.15-19
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• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• Journal of IKEEE
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• v.19 no.2
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• pp.232-236
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• 2015

Super-junction trench MOSFET (SJ TMOSFET) devices are well known for lower specific on-resistance and high breakdown voltage (BV). For a conventional power MOSFET (metal-oxide semiconductor field-effect transistor) such as trench double-diffused MOSFET (TDMOSFET), there is a tradeoff relationship between specific on-state resistance and breakdown voltage. In order to overcome the tradeoff relationship, a SJ TMOSFET structure is suggested, but sensing the temperature distribution of TMOSFET is very important in the application since heat is generated in the junction area affecting TMOSFET. In this paper, analyzing the temperature characteristics for different number bonding for SJ TMOSFET with an embedded temperature sensor is carried out after designing the diode temperature sensor at the surface of SJ TMOSFET for the class of 100 V and 100 A for a BLDC motor.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.8
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• pp.153-157
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• 2003

In the present work, the effect of plasma treatment of aluminum on the fracture toughness of CFRP/aluminum composites was investigated. The surface of the aluminum was treated by a DC plasma. The plasma treatment was carried out at volume ratio of acetylene gas to nitrogen gas of 5:5 and the treatment time used was 30 sec. Cracked lap shear specimens of aluminum/CFRP composites were made using secondary bonding procedure. Fracture toughness of aluminum/CFRP composites was determined using the work factor approach. Then, the fracture toughness of plasma-treated aluminum/CFRP composites was compared with that of untreated aluminum/CFRP composites. The results showed that the fracture toughness of plasma-treated aluminum/CFRP composites was about 50 % higher than that of untreated aluminum/CFRP composites.

• KSBB Journal
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• v.16 no.2
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• pp.115-122
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• 2001

Molecular imprinting has now been established as a technique which allows the creation of tailor-made binding sites for many classes of compounds. MIPs were prepared by covalent and non-covalent chemical bonding systems, by interactions between functional monomer and template. The shape of MIP is divided to particle and membrane. MIP membranes can be prepared by surface imprinting, in-situ polymerization, wet phase inversion and the dry phase inversion method. MIPs have been mainly used for analytical separation and biosensor systems to separate and detect chiral compounds and materials with similar structures. However the application of MIP by the chemical industries is still in its infancy stages. This review summarizes the preparative characteristics and applications of MIP with respect to chiral separations and biosensors.

• Journal of the Korean Ceramic Society
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• v.32 no.5
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• pp.601-607
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• 1995

The bond strength between the low-firing-substrate and Cu conductor depended on the softening point and the amount of frit added to the metal paste. The addition of 3 wt% frit (softening point: 68$0^{\circ}C$) to the metal paste resulted in the improvement of bond strength, which was approximately 3 times higher (3kg/$\textrm{mm}^2$) than that of non frit condition. It was also found that fracture surface shifted to the ceramic substrate in the interface region. These phenomena were attributed to the frit migration into the metal-ceramic interface. It was thought that the migration of glass frit occurred extensively when the softening point of glass firt was 68$0^{\circ}C$. The sheet resistance of Cu conductor remained constant by the addition of 4 wt% frit regardless of softening point of frit. For all samples with more than 4 wt% frit, the sheet resistance increased abruptly.