• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.836-840
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• 2006

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

• 한국구조물진단유지관리공학회 논문집
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• 제18권5호
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• pp.41-50
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• 2014

본 연구에서는 섬유종류에 따른 인발특성과 섬유보강 콘크리트의 휨특성에 대하여 평가하기 위하여, 섬유의 재질 및 형상 다른 후크형 강섬유, 비정질 강섬유 및 폴리아미드 섬유에 대하여 인발시험과 섬유보강 콘크리트 시험체를 제작하여 휨특성을 평가하였다. 그 결과, 후크형 강섬유의 경우 최대인발하중에서 섬유가 매트릭스로부터 인발되었지만, 비정질 강섬유는 섬유와 매트릭스의 부착강도가 섬유자체의 인장강도보다 높아 섬유가 매트릭스로부터 인발되지 않고 파괴되는 현상을 나타내었다, 한편, 폴리아미드 섬유는 연신율에 의해 최대인발 하중까지 변위가 크게 발생하였으며, 최대하중이후에 섬유가 끊어지는 파괴특성을 나타내었다. 섬유보강 콘크리트의 휨특성에 있어서 비정질 강섬유는 매트릭스와의 부착강도가 높고, 섬유의 혼입개체수가 많아 콘크리트의 최대휨강도는 높았지만, 균열발생 이후 섬유가 매트릭스로부터 인발되지 않고 섬유가 파괴되는 것에 의해 응력의 저하가 급격하게 발생하지만, 후크형 강섬유보강 콘크리트는 균열발생 이후 섬유가 인발되면서 응력의 저하가 완만하게 발생하였다. 폴리아미드 섬유보강 콘크리트는 균열발생이후 섬유의 연신률에 의해 응력이 급격하게 저하하는 구간이 발생하였으며, 섬유와 매트릭스의 부착에 의해 재상승하였다가 섬유가 끊어지면서 파괴되었다. 섬유와 매트릭스의 인발특성은 섬유보강 콘크리트의 휨강도 및 변형 능력에 큰 영향을 미치는 것으로 판단된다.

• 대한기계학회논문집
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• 제12권4호
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• pp.755-759
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• 1988

Laminated Composites, SS41-Cu-SS41 plates are made by brazing bonding and hot bonding process. Fatigue repeated plane bending tests are carried out and the fracture behavior of Laminated composites, SS41-Cu-SS41 plates are compared with that of homogeneous steel, SS41plates. The following results are obtained; (1) The fatigue life of the brazing bonding plates is higher than those of SS41 plates and hot bonding plates under high stress. (2) The relations between the fatigue crack growth rate, da/dN and stress intensity factor are, da/dN=4.7*10$^{-10}$ $K^{3.20}$, for SS41 da/dN=7.8*10$^{-9}$ $K^{2.43}$, for CAH da/dN=3.6*10$^{-9}$ $K^{2.54}$, for CAB da/dN=1.58*10$^{-9}$ $K^{2.94}$ , for PAH da/dN=1.23*10$^{-9}$ $K^{2.69}$, for PAB

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 추계학술대회 논문집
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• pp.273-278
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• 1998

In this paper, basic micro-mechanical properties of unidirectional CFRP composite shell such as bonding strength, fiber volume fraction and void fraction are measured and tensile strength test is performed with a fixture. And then fracture surfaces are observed by SEM. In case of basic micro-mechanical properties, bonding strength is reduce with decreasing of radius of each ply in a shell for the effect of residual stress, fiber volume fraction is smaller than plate, and void fraction is vise versa. For these reason, tensile strength of shell is smaller than plate fabricated with same prepreg. For failure mode shell has many splitted part along its length, and it is assumed that this phenomenon is caused by the difference of bonding strength for residual stress.

• 한국분말재료학회지
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• 제28권1호
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• pp.1-6
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• 2021

Accurate and effective powder compaction analyses are performed for brittle materials such as graphite, utilized as a solid lubricant, by using the discrete element method (DEM). The reliability of the DEM analysis is confirmed by comparing the results of graphite powder compaction analyses using the DEM particle bonding contact model and particle non-bonding contact model with those from the powder compaction experiment under the same conditions. To improve the characteristics, the parameters influencing the compaction properties of the metal-graphite mixtures are explored. The compressibility increases as the size distribution of the graphite powder increases, where the shape of the graphite particles is uniform. The improved compaction characteristics of the metal-graphite (bonding model) mixtures are further verified by the stress transmission and compressive force distribution between the top and bottom punches. It is confirmed that the application of graphite (bonding model) powders resulted in improved stress transmission and compressive force distribution of 24% and 85%, respectively.

• Restorative Dentistry and Endodontics
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• 제34권5호
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• pp.442-449
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• 2009

이 연구의 목적은 5급 와동의 복합레진 수복에서 상아질 접착제를 비교적 두껍게 도포하거나 낮은 탄성계수(low elastic modulus)를 가진 복합레진을 선택하는 방법을 택하여 수복물의 탄성율의 차이에 따른 치아와 복합레진 경계에서 발생하는 응력의 차이를 알아보는 것이었다. abfraction 병소가 있는 하악 제 1소구치를 유한요소법을 이용하여 모델로 만들었다. 병소는 상아질 접착제의 두께 ($50{\mu}m$, $100{\mu}m$, $150{\mu}m$) 및 복합레진의 종류를 달리하며 수복되었다. 170N의 교합압을 협측 또는 설측에서 가하여 상아질 접착제와 치아면에서의 Von Mises stress를 측정하였다. 상아질 접착제의 두께가 두꺼울수록 상아질 접착제면에 가해지는 Von Mises stresss 는 감소하였다. 낮은 탄성계수 값을 가진 복합레진에서 Von Mises stress가 더 작았다. 치근상아질 경계 (margin)가 법랑질 경계에서보다 더 큰 응력이 발생하였다. 상아질 접착제면에 작용하는 교합압의 영 향을 감소시키기 위해 상아질 접착제를 두껍게 바르거나 낮은 탄성계수 값을 가진 복합레진을 사용하는 것이 추천된다.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1995년도 가을 학술발표회 논문집
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• pp.293-298
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• 1995

This study experimentally evaluate the bonding performance of repair and strengthening materials. It is very important problem to justify bonding properties between repair and strengthening materials and old concrete. Many previous research and investigation showed that bonding strength of reinforcing materials determines the strengthening effect and the durability of repair work. Therefore, menifestation of bonding properties and the improvement of bonding performance of repair and strengthening materials are very important. In order to improve the perforamnce of repair work, it needs to investigate the behavior of bonding materials, such as stress distribution along the bonding area and the long term performance of the material. The target repair methods are steel plate addition technique and repair mortar method, and the test parameters studied in this paper include epoxy thickness, bonding surface texture, and bonding area.

• 한국정밀공학회지
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• 제16권1호통권94호
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• pp.227-237
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• 1999

As the interface bonding phenomenon between the matrix and the reinforcements has a large effect on the mechanical properties of MMCs, a sugestion of the strength analysis technique considering the residual stress and the interface bonding phenomenon is very important for the design of pans and the estimation of fatigue behavior. In this paper the three dimensional finite element anaysis is performed during the elasto-plastic deformation of the particulate reinforced metal matrix composites. It was analyzed with the volume fractions in view of microscale. Bonding strength. interface separation and matrix void growth between the matrix and the reinforcements will be predicted on deformation under tensile loading. An interface seperation is estimated by the fracture criterion which is a critical value of generalized plastic work per unit volume. The shape of the reinforcement is assumed to be a perfect sphere. And the type of the reinforcement distribution is assumed as FCC array. The thermal residual stress in MMCs is induced by the heat treatment. It is included at the simulation as an initial residual stress. The element birth and death method of the ANSYS program is used for the estimation of the interface bonding strength, void generation and propagation. It is assumed that the fracture in the matrix region begin to occur under the external loading when the plastic work per unit volume is equal to the critical value. The fracture strain will be defined. The experimental data of the extruded $SiC_p$>/606l Al composites are compared with the theoretical results.

• 대한금속재료학회지
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• 제46권9호
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• pp.585-592
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• 2008

Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

• 한국생산제조학회지
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• 제7권1호
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• pp.58-68
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• 1998

Advantages of adhesively bonded joints and techniques of weight reduction have led to increasing use of structural adhesives such as LSI(large scale integration) package, automobile, aircraft in the various industries. In spite of such wide applications of adhesively bonded joints, the evaluation method of bonding strength has not been established. Stress singularity occurs at the interface edges of adhesively bonded joints and it is required to analyze it. In this paper, the stress singularity using 2-dimensional elastic boundary element method (BEM) with the changes of the lap length and adhesive for single lap joint was analyzed, and experiments of strength evaluation were carried out. As the results, the evaluating method of bonding strength considering stress singularity at interface edges of adhesively bonded joints and stress intensity factor of interface crack have been proposed in static and fatigue test.