• 한국정밀공학회지
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• 제29권5호
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• pp.563-571
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• 2012

In 3D integration package using TSV technology, bonding is the core technology for stacking and interconnecting the chips or wafers. During bonding process, however, warpage and high stress are introduced, and will lead to the misalignment problem between two chips being bonded and failure of the chips. In this paper, a finite element approach is used to predict the warpages and stresses during the bonding process. In particular, in-plane deformation which directly affects the bonding misalignment is closely analyzed. Three types of bonding technology, which are Sn-Ag solder bonding, Cu-Cu direct bonding and SiO2 direct bonding, are compared. Numerical analysis indicates that warpage and stress are accumulated and become larger for each bonding step. In-plane deformation is much larger than out-of-plane deformation during bonding process. Cu-Cu bonding shows the largest warpage, while SiO2 direct bonding shows the smallest warpage. For stress, Sn-Ag solder bonding shows the largest stress, while Cu-Cu bonding shows the smallest. The stress is mainly concentrated at the interface between the via hole and silicon chip or via hole and bonding area. Misalignment induced during Cu-Cu and Sn-Ag solder bonding is equal to or larger than the size of via diameter, therefore should be reduced by lowering bonding temperature and proper selection of package materials.

• Journal of Welding and Joining
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• 제31권6호
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• pp.77-83
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• 2013

3D packaging technology using TSV (Through Silicon Via)has been studied in the recent years to achieve higher performance, lower power consumption and smaller package size because electrical line is shorter electrical resistivity than any other packaging technology. To stack TSV chips vertically, reliable and robust bonding technology is required because mechanical stress and thermal stress cause fracture during the bonding process. Cu pillar/solder ${\mu}$-bump bonding process is usually to interconnect TSV chips vertically although it has weak shape to mechanical stress and thermal stress. In this study, we suggest Insert-Bump (ISB) bonding process newly to stack TSV chips. Through experiments, we tried to find optimal bonding conditions such as bonding temperature and bonding pressure. After ISB bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test.

• 한국재료학회지
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• 제12권10호
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1996년도 봄 학술발표회 논문집
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• pp.129-134
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• 1996

Bonding strength of reinforcing material has been recognized to be the most important factor which determines the strengthening effect and the durability of repair work. The properties of bonding layers affects the stress distribution at the end of the plate, therefore the behavior of bonding layer has to be investigated. In this study, the stress distribution at the end of the bonded plate has been tested and compared with Roberts' analysis. Shear stress and vertical normal stress at the end of strengtening plate are analysized and the effedts of bonding layer thickness, plate thickness and plate length on the bonding behavior are tested. The test results showed that thickness is one of the most important factor, which is the thinner the thickness, the smaller the maximum stress.

• 한국생산제조학회지
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• 제26권4호
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• pp.430-435
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• 2017

The effect of the surface profile on CFRP and aluminum metal bonding was studied. A small number of steps were made on the aluminum surface, and the shear stress and elongation were measured using a shear test after bonding with an autoclave method. As the number of surface steps increased, the shear stress and elongation increased. The surface bonding strength increased because of the effect of the mechanical and chemical bonding. When the number of effective stages was exceeded, the shear strength decreased again due to the aspect ratio of the step and the reduction of the penetration effect of the resin into the groove.

• Computers and Concrete
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• 제13권3호
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• pp.411-421
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• 2014

A central pullout test was conducted to investigate the bonding properties between high strength rebar and reactive powder concrete (RPC), which covered ultimate pullout load, ultimate bonding stress, free end initial slip, free end slip at peak load, and load-slip curve characteristics. The effects of varying rebar buried length, thickness of protective layer and diameter of rebars on the bonding properties were studied, and how to determine the minimum thickness of protective layer and critical anchorage length was suggested according the test results. The results prove that: 1) Ultimate pull out load and free end initial slip load increases with increase in buried length, while ultimate bonding stress and slip corresponding to the peak load reduces. When buried length is increased from 3d to 4d(d is the diameter of rebar), after peak load, the load-slip curve descending segment declines faster, but later the load rises again exceeding the first peak load. When buried length reaches 5d, rebar pull fracture occurs. 2) As thickness of protective layer increases, the ultimate pull out load, ultimate bond stress, free end initial slip load and the slip corresponding to the peak load increase, and the descending section of the curve becomes gentle. The recommended minimum thickness of protective layer for plate type members should be the greater value between d and 10 mm, and for beams or columns the greater value between d and 15 mm. 3) Increasing the diameter of HRB500 rebars leads to a gentle slope in the descending segment of the pullout curve. 4) The bonding properties between high strength steel HRB500 and RPC is very good. The suggested buried length for test determining bonding strength between high strength rebars and RPC is 4d and a formula to calculate the critical anchorage length is established. The relationships between ultimate bonding stress and thickness of protective layer or the buried length was obtained.

• Journal of Welding and Joining
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• 제19권3호
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• pp.342-347
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• 2001

Recently, adhesive-bonding technique is wifely used in manufacturing structures. Stress and strain analysis of joints are essential to design adhesive-bonded joints structure. The single-lap adhesive joint is the design dominating the range of adhesive joints. In this study, single-lap specimens with different joint dimensions were used for the tensile-shear test and finite element calculation in of order to investigate the effect of overlap length and adhesive-bonding thickness on adhesive strength and stress distribution of the joints. Consequently, it was found that overlap lap size and thickness can be important parameters of structure joints using adhesive bonding, which is effected on adhesive strength.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• 한국금형공학회:학술대회논문집
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• 한국금형공학회 2008년도 하계 학술대회
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• 한국표면공학회지
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• 제48권6호
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• pp.275-282
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• 2015

The cost for maintenance (replacement cost) of Ni-superalloy components in plant industry is very expensive because of high unit price of INCONEL 718. A development of repairing technology using kinetic spray process can be very helpful for reducing the maintenance cost. However, it is very difficult to produce well-deposited INCONEL 718 layer showing high interfacial bond strength via kinetic spraying. Thus, INCONEL 718 was deposited on SCM 440 substrate and the interfacial properties were investigated, in order to elucidate the cause of hindrance to the bonding between INCONEL 718 layer and SCM 440 substrate. As a result, it was revealed that the dominant obstacle to the interfacial bonding was excessive compressive residual stress accumulated in the coating layer, resulting from low plastic-deformation susceptibility of INCONEL 718. Nevertheless, the bonding state was enhanced by the post heat-treatment through relieving the residual stress and generating a diffusion/metallurgical bonding between the INCONEL 718 deposit and SCM 440 substrate.