• Restorative Dentistry and Endodontics
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• 제10권1호
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• pp.153-160
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• 1984

The purpose of this study was to observe the tensile and bonding strength of the joined amalgam restoration. Amalgam alloys of fine-cut (F-type), spherical (S-type), and dispersed type (D-type) were selected in this study, and all specimens were divided into three groups according to the condensation methods as follows. Group I : the control group which condense the same kinds of mixed amalgam into the whole part of the mold respectively. Group II : the group which condense a mix of amalgam into one half of the mold, and then condense a new mix of amalgam into the rest half of the mold 15 minutes later. Group III : the group which condense a mixed amalgam into one half of the mold, and then condense a new mix of amalgam into the rest half of the mold 7 days later. All specimens were stored in incubator at $37{\pm}1^{\circ}C$ for seven days with immersing in saline solution before testing. The tensile and bonding strength of them were measured with Instron Universal Testing machine. The results were as follows: 1. In Group I, the order of tensile strength was F-type, S-type, and D-type. 2. In case of bonding of S-type + S-type, the difference of the bonding strength between Group II and III was not significant. (P> 0.05) 3. The bonding strength of F-type + S-type of Group II was marked the highest in value, and the lowest bonding strength was showed in bonded D-type + D-type of Group III. 4. In case of bonding with the different kinds of amalgam alloy in Group II, the specimen bonded to F-type was marked the highest bonding strength, and the specimen bonded with F-type was marked the lowest one. In Group II, the bonding strength of the specimens bonded with the same kinds of amalgam alloy was presented as the same order as that of Group I. 5. In Group III, the specimen connected with D-type marked the lowest bonding strength of all specimens. In Group III, the bonding strength of the specimens connected with the same kinds of amalgam alloy was the order of S-type + S-type, F-type + F-type, and D-type + D-type.

• 대한기계학회논문집A
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• 제24권10호
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• pp.2461-2468
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• 2000

In this paper, single fiber pull-out test is used to measure the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite with temperature. Fiber and matrix of $Ti_{50}-Ni_{50}$ shape memory alloy composite are respectively $Ti_{50}-Ni_{50}$ shape memory alloy and epoxy resin. To strengthen the interfacial bonding shear stress, various surface treatments are used. They are the hand-sanded surface treatment, the acid etched surface treatment and the silane coupled surface treatment etc.. The interfacial bonding shear strength of surface treated shape memory alloy fiber is greater than that of surface untreated shape memory alloy fiber by from 10% to 16%. It is assured that the hand-sanded surface treatment and the acid etched surface treatment are the best way to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory composite. The best treatment condition of surface is 10% HNO$_3$ solution in the etching method to strengthen the interfacial bonding shear strength of $Ti_{50}-Ni_{50}$ shape memory alloy composite.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• 대한치과기공학회지
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• 제30권2호
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• pp.71-77
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• 2008

Acrylic resin has been widely used for dental care since it requires relatively simple equipment for treatment and less time and cost are needed to make it and, furthermore, proper strength, dimensional stability as well as durability are ensured after treatment. A survey of denture users showed, however, that more than 60% of dentures installed need repair each year, $22{\sim}30%$ of which are due to falling out of teeth. This study is aimed at exploring the means to increase bonding strength of denture by reducing the causes for falling out of teeth during the processing of dentures. For this aim, the bonding strength of dentures was compares and analyzed before and after the glazed surface of teeth contacting denture was eliminated. From the analysis, it was revealed that there was a difference of 4.3MPa in average in bonding strength between 20MPa for the glazed surface not eliminated and 24.3MPa for the glazed surface eliminated.

• Restorative Dentistry and Endodontics
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• 제17권1호
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• pp.36-54
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• 1992

The purpose of this study was to compare the shear bond strengths to ground dentin surfaces of four dentinal bonding agents in 193 teeth. Various dentin surfaces treated with four dentin bonding agents were attached with two restorative composite resins. The effectiveness of the bonding were tested by the monitoring the shear bond strength. The shear bond strengths were measured after 2 hours and 24 hours after surface conditioning with four dentin bonding agents. Effects of EDTA, the additive illumination, and sealer treatments without primer on bond strength to dentin surfaces were assessed. In addition the effects of the thickness of specimens ranging from 0.65 mm to 1.95 mm and the ratio of catalyst and base paste on the bond strength of chemical cure composite resin were estimated. The shear bond strength was determined by testing specimens in the Instron universal testing machine (Model No. 1122) at a crosshead speed of 1.0 mm/min. Following condusions were drawn: 1. The highest mean shear bond strengths of chemical cure composite resin to dentin conditioning with dentin bonding agents aged 2 hours were obtained, and then that was decreased with time followed by EDTA treatment. 2. In light cure composite resin, the shear bond strength was increased following dentin conditioning with bonding agents with time, irradiation time and EDTA treatment except in SB group. 3. The thicker the composite resin specimen was, the less the shear bond strength in chemical cure composite resin was. 4. In light cure composite resin, there was a little change in shear bond strength following dentin conditioning with bonding agents. 5. In chemical cure composite resin, the shear bond strength was the highest in the ratio of 1/1 of catalyst and base part. 6. Without a dentin primer, shear bond strength to dentin conditioned only with UB sealer was the highest among four sealers in light cure composite resin.

• Journal of Welding and Joining
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• 제21권4호
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• pp.69-74
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• 2003

The mechanical properties of STD11 Joints by using TLP (Transient Liquid Phase Diffusion) bonding method employing MBF-30 and MBF-80 insert metals were investigated with concerning to the microstructural change. TLP bonding of STD 11 was carried out at 1323∼1423K for 0.6ks∼3.6ks in vacuum. The microstructure and the element distribution of the interlayer between tool steels and insert metals showed specific feature with bonding conditions. It was found that the width of the interlayer increased at initial bonding stage. However, the width of interlayer showed nearly constant value during the isothermal solidification. After isothermal solidification was completed, the joint showed homogeneous element distribution and similar microstructure with base metal because of the grain boundary migration to the bonded interlayer. The bonding strength measured by a tensile test has been varied with the bonding conditions. The maximum joint strength, 760MPa, was obtained with the condition of 1423K for 1.2ks using MBF30 insert metal in this experiment.

• 마이크로전자및패키징학회지
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• 제27권3호
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• pp.55-60
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• 2020

최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

• 한국자동차공학회논문집
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• 제6권1호
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• pp.143-150
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• 1998

The evaluation of joint fatigue strength of light weight materials for electrical vehicle body has been performed through single lap joint tests with the design parameters such as joint style, adherend, bonding overlap length and bonding thickness. Fatigue strength was evaluated through 5-Hz, tension-tension, load controlled test with the stress ratio zero value. It is experimentally observed that fatigue strength of joint increases for the increase of overlap length. The combinations of Al-Al and Al-FRP adherends show that fatigue strength of joint is hardly changed for the increase of bonding thickness, but FRP-FRP adherend specimen shows that fatigue strength of joint increases after decreases for the increase of bonding thickness. Al-Al adherend specimen has much higher fatigue length than Al-FRP and FRP-FRP adherend specimens. Riveting at adgesive bonded joint gives little effect on fatigue strength.

• The Journal of Advanced Prosthodontics
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• 제9권5호
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• pp.350-357
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• 2017

PURPOSE. The object of the present study was to evaluate the shear bonding strength of composite to PEKK by applying several methods of surface treatment associated with various bonding materials. MATERIALS AND METHODS. One hundred and fifty PEKK specimens were assigned randomly to fifteen groups (n = 10) with the combination of three different surface treatments (95% sulfuric acid etching, airborne abrasion with $50{\mu}m$ alumina, and airborne abrasion with $110{\mu}m$ silica-coating alumina) and five different bonding materials (Luxatemp Glaze & Bond, Visio.link, All-Bond Universal, Single Bond Universal, and Monobond Plus with Heliobond). After surface treatment, surface roughness and contact angles were examined. Topography modifications after surface treatment were assessed with scanning electron microscopy. Resin composite was mounted on each specimen and then subjected to shear bond strength (SBS) test. SBS data were analyzed statistically using two-way ANOVA, and post-hoc Tukey's test (P<.05). RESULTS. Regardless of bonding materials, mechanical surface treatment groups yielded significantly higher shear bonding strength values than chemical surface treatment groups. Unlike other adhesives, MDP and silane containing self-etching universal adhesive (Single Bond Universal) showed an effective shear bonding strength regardless of surface treatment method. CONCLUSION. Mechanical surface treatment behaves better in terms of PEKK bonding. In addition, self-etching universal adhesive (Single Bond Universal) can be an alternative bonding material to PEKK irrespective of surface treatment method.

• 대한기계학회논문집A
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• 제25권1호
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• pp.11-15
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• 2001

We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.