• 소성∙가공
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• 제13권7호
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• pp.623-628
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• 2004

This paper is concerned with pressure welding, which has been known as a main bonding mechanism during the cold and warm forming such as clad extrusion or bundle extrusion/drawing. Bonding characteristics between the Cu and Al plates by pressure welding are investigated focusing on the weak bonding. Experiments are performed at the cold and warm temperatures ranging from the room temperature to $200^{\circ}C$. The important factors examined in this work are the welding pressure, pressure holding time, surface roughness, and temperature. A bonding map, which can identify the bonding criterion with a weak bonding strength of IMPa , is proposed in terms of welding pressure and surface roughness fur the cold and warm temperature ranges.

• 한국표면공학회지
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• 제56권3호
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• 마이크로전자및패키징학회지
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• 제31권3호
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• pp.91-98
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• 2024

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest "theoretically" possible temperature of 145 ℃. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 ℃, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 ℃. In particular, it is interesting to note that in the pressure sintering bonding process at 145 ℃, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 ℃, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 ℃, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.225-228
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• 2003

This paper is concerned with pressure welding, which has been known as a main bonding mechanism for the cold and warm clad forming. Bonding characteristics of pressure welding between the copper and aluminum plates are experimentally investigated. Experiments are performed at the cold and warm temperature range with the variation of important factors such as magnitude of pressure, surface roughness of Cu and Al plates, and pressure holding time. It could be concluded that the bonding criterion might be given as a function of bonding pressure and surface roughness for the cold and warm temperature ranges.

• 소성∙가공
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• 제7권1호
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• pp.66-71
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• 1998

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

• Journal of Welding and Joining
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• 제8권3호
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• pp.31-38
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• 1990

The bonding mechanism and bond strength were investigated for the cold pressure welding of Al to Al, Cu to Cu and Al to Cu by upsetting. A phenomenon of bonding betweenthe metallic components has been observed by a scanning electron microscope and metallurgical microscope. A modified equation for bond strength with respect to the reduction of height shows reasonably a good agreement with the experimental data. When the values of the hardening factor and threshold deformation for the given materials could be determined, the theoretical bond strength can be calculated.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.19-26
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• 2007

본 연구의 목적은 CMOS 이미지 센서용 Au 플립칩 범프와 전해 도금된 Au 기판 사이의 초음파 접합의 가능성 연구이다. 초음파 접합 조건을 최적화하기 위해서, 대기압 플라즈마 세정 후 접합 압력과 시간을 달리하여 초음파 접합 후 전단 시험을 실시하였다. 범프의 접합 강도는 접합 압력과 시간 변수에 크게 좌우되었다. Au 플립칩 범프는 상온에서 성공적으로 하부 Au 도금 기판과 접합되었으며, 최적 조건 하에서 접합 강도는 약 73 MPa이었다.

• 대한치과보철학회지
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• 제31권3호
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• pp.385-393
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• 1993

Injection processing of denture base resin was introduced by Pryer in 1942, in an attempt to reduce processing shrinkage. More recently a continuous-pressure injection type technique has been developed (SR-Ivocap, Ivoclar AG, Schaan, Liechtenstein.), and it reduced processing error and increased resin density. The purpose of this study was to compare tensile bond strength of heat-cured, cold-cured, and light-cured denture base resin bonded to continuous-pressure injection type resin. To know it, 60 cylindrical resin specimens were fabricated, and tensile bond strength were measured. The results were as follows : 1. The mean tensile bond strength bonded to continuous-pressure injection type resin was lower than bonded to conventional heat cured resin. But tensile bond strength of conventional heat cured resin bonding with light cured resin was lower than continuous-pressure injection type resin. 2. Of the tensile bond strength bonded to continuous-pressure injection type resin, tensile bond strength bonding with continuous-pressure injection type resin was the greatest(but not significantly different from bonding with conventional heat cured resin), followed by cold-cured, light-cured resin. 3. Of the tensile bond strength bonded to conventional heat cured resin, tensile bond strength bonding with conventional heat cured resin was the greatest and followed by continuous-pressure injection type resin, cold-cured resin, light-cured resin. According to these results, bonding of continuous-pressure injection type resin with conventional heat cured resin or continuous-pressure injection type resin is acceptable, but bonding with light-cured resin is questionable.

• 비파괴검사학회지
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• 제26권5호
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• pp.343-352
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• 2006

본 논문에서는 금속 연소관, 단열 고무 그리고 내열 복합재로 구성된 연소관 조립체의 접착 체결 상태를 확인하기 위해 변형률, 음향방출 신호 그리고 초음파 시험자료를 이용한 비파괴 시험 방법이 제시되었다. 또한 내압 상태에서 연소관 조립체의 각 계면 접착 상태를 정량적으로 평가하기 위해 유한요소 해석이 수행되었다. 공압 시험 중 계측한 변형률 값과 음향방출 신호 상관관계 연구를 통해 연소관 조립체의 접착 건전성 평가가 가능했다. 그리고 연소관 조립체의 여러 접착 계면 중 첫 번째 계면인 연소관과 고무간의 접착은 초음파 방법으로 분류하였다. 이러한 연구를 통해 연소관 조립체의 모든 접착 계면은 1) 초기 완전 미접착, 2) 공압 시험 중 완전 접착 분리, 3) 공압 시험 중 부분 접착 분리, 4) 완전 접착 등 4가지 형태로 분류 및 검출되었다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1997년도 춘계학술대회논문집
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• pp.140-143
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• 1997

The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.