• Title/Summary/Keyword: bonding performance

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Direct and indirect bonding of wire retainers to bovine enamel using three resin systems: shear bond strength comparisons (부착 유지장치의 직, 간접 부착법에 따른 전단 접착력 비교)

  • Kwon, Tae-Yub;Meina, Hu;Antoszewska, Joana;Park, Hyo-Sang
    • The korean journal of orthodontics
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    • v.41 no.6
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    • pp.447-453
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    • 2011
  • Objective: We compared the shear bond strength (SBS) of lingual retainers bonded to bovine enamel with three different resins using direct and indirect methods. Methods: Both ends of pre-fabricated twisted ligature wires were bonded to bovine enamel surfaces using Light-Core, Tetric N-Flow, or Transbond XT. Phosphoric acid-etched enamel surfaces were primed with One-Step prior to bonding with Light-Core or Tetric N-Flow. Transbond XT primer was used prior to bonding with Transbond XT. After 24 hours in water at $37^{\circ}C$, we performed SBS tests on the samples. We also assigned adhesive remnant index (ARI) scores after debonding and predicted the clinical performance of materials and bonding techniques from Weibull analyses. Results: Direct bonding produced significantly higher SBS values than indirect bonding for all materials. The SBS for Light-Core was significantly higher than that for Tetric N-Flow, and there was no significant difference between the direct bonding SBS of Transbond XT and that of Light-Core. Weibull analysis indicated Light-Core performed better than other indirectly bonded resins. Conclusions: When the SBS of a wire retainer is of primary concern, direct bonding methods are superior to indirect bonding methods. Light-Core may perform better than Transbond XT or Tetric N-Flow when bonded indirectly.

Performance Evaluation and Design of Upstream Scheduling Algorithms To Support Channel Bonding (채널 결합 기반 상향스트림 스케줄링 알고리즘 설계와 성능평가)

  • Roh, Sun-Sik
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.46 no.5
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    • pp.8-18
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    • 2009
  • CableLAB published DOCSIS 3.0 Specifications to supply broadband access to homes and small businesses. The primary technique of DOCSIS 3.0 Specification is channel bonding which provides cable operators with a flexible way to significantly increase up/downstream speeds. In this paper, we propose the upstream scheduler that serves channel bonding. Proposed scheduler consists of two sub-scheduler: bonding group scheduler and channel scheduler. Also, we propose three scheduling algorithms to allocate request bandwidth of CM to each bonding channel: equivalent scheduling algorithm, current request-based scheduling algorithm, and last grant-based scheduling algorithm. In order to evaluate the performance of these algorithms and DOCSIS 3.0 MAC protocol, we develop the DOCSIS 3.0 simulator with the network simulator, OPNET, to model DOCSIS network, CMTS, and CM. Our results show that equivalent scheduling algorithm is superior to others in the view of transmission delay and throughput and DOCSIS 3.0 protocol provides higher throughput than pre-DOCSIS 3.0 protocol.

Debonding and Postbuckling Failure Characteristics of Composite Stiffened Panels (복합재 보강패널의 분리파손 및 좌굴 후 강도 특성)

  • Kim, Kwang-Soo;Yoo, Jae-Seok;An, Jae-Mo;Jang, Young-Soon;Yi, Yeong-Moo
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.04a
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    • pp.59-63
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    • 2005
  • Compression tests were performed for six types of hat stiffened composite panels with different bonding methods and stiffener section shapes. Six panels showed similar behaviors in buckling and post-buckling region before a skin-stiffener separation failure occurred. The skin-stiffener separation failures occurred in the panels with closed type stiffeners regardless of bonding methods, but not in the panels with open type stiffeners. The separation failures not only reduced the postbuckling strength but also changed buckling mode and postbuckling stiffness. All the separation failures were initiated at the stiffener flange edges closest to skin buckling crests. The co-cured or secondary bonded panels with open type stiffeners had the largest structural performance. Because the post-buckling strength and performance of the composite stiffened panels are reduced by the separation failure, it is important to find bonding methods, stiffener types and manufacturing parameters for preventing of the separation failure.

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Moderating Effects of Parental Attachment and Teacher's Concerns in the Relationships between Children's Roles and School Adjustment among Children's of Alcoholics (알코올 중독자 부모를 둔 청소년의 자녀역할과 학교 적응과의 관계에서 부모애착과 교사관심의 조절효과)

  • Kim, Hae-Ryun;Park, Soo-Kyung
    • Journal of the Korean Home Economics Association
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    • v.49 no.4
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    • pp.37-50
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    • 2011
  • The purpose of this study is to examine the relationships between children's roles, parental attachment, teacher's concerns and school adjustment among Children's Alcoholics(COAs). Participants were 2,803 middle and high school students in Seoul. The regression analysis results showed that hero role was positively associated with school bonding and academic performance but increased the level of anxiety/depression. Meanwhile, scapegoat and lost children's roles were negatively associated with school bonding and also increased the level of anxiety/depression. Mascot role were positively associated with school bonding and academic performance but had no relation with anxiety/depression. Regarding moderating effects, maternal attachment moderated the relationship between scapegoat role and school bonding while teacher's concerns moderated the relationship between hero role and anxiety/depression, and the relationship between scapegoat role and anxiety/depression. These findings suggested that practitioners need to consider the contributions of children's roles on school adjustment and moderating effects of maternal attachment or teacher's concerns when intervention programs are developed to improve school adjustment among COAs.

A Study on the Joint Performance Change of Self-Admixed Waterproofing Sheet by Induced Bonding of Asphalt Compound (아스팔트 컴파운드 간 접합을 유도한 자착식 방수 시트의 시트 간 접합부 성능 변화 연구)

  • Kim, Dong-Bum;Kim, Sun-Do;Park, Jin-Sang;Ko, Sam Seog;Kim, Byoung-Il;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2017.05a
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    • pp.234-235
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    • 2017
  • The bonding of the asphalt-based waterproof sheet is carried out in such a manner that the sheet and the sheet are adhered together and the lower adhesive layer of one sheet is adhered to the upper film layer of the other sheet, and the asphalt layer and the PE or HDPE film layer are bonded. When the joints are formed in the form of junctions between heterogeneous materials and exposed to the concrete joint movements and other deteriorating factors, the integrity of the joints can deteriorate and problems such as lifting and peeling off of the joints can occur. Therefore, this study was carried out to prevent unstable joint adhesion of the asphalt compound and film layer and to prevent defects in the adhesion between self - adhesive waterproof sheets. The self-adhesive waterproof sheet of this study can maximize bond stability by inducing bond between asphalt compounds during sheet-to-sheet bonding, thereby improving bonding strength.

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A Study on Improvement of Bonding Shear Strength of Geogrid-Reinforced Asphalt Pavements (섬유보강 아스팔트 포장 부착 전단강도 개선방안 연구)

  • Park, Sang Gu;Kim, Ki Hyun;Kwon, Soo Ahn;Jeong, Jin Hoon
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.29 no.5D
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    • pp.619-625
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    • 2009
  • Test constructions were performed at 3 sites to investigate ways for maximizing performance of geogrid-reinforced asphalt pavements known to reduce reflection cracking and rutting. Problems during construction operation which can affect bonding shear strength of the geogrid-reinforced asphalt pavements were defined and the construction conditions were intentionally made during the test constructions. Both immediately and 1year after the test constructions, cores were obtained from positions with good and bad construction conditions and then bonding shear strength tests were performed to be compared each other. Rules to be kept at construction sites were suggested to improve performance of the geogrid-reinforced asphalt pavements.

Scallop-free TSV, Copper Pillar and Hybrid Bonding for 3D Packaging (3D 패키징을 위한 Scallop-free TSV와 Cu Pillar 및 하이브리드 본딩)

  • Jang, Ye Jin;Jung, Jae Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.4
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    • pp.1-8
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    • 2022
  • High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO2 hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

Flexural Behavior of iFLASH System with No Blast Metal Cleaned Steel Plates (비표면처리 강판을 사용한 iFLASH 시스템의 휨성능 평가)

  • Kim, Yong-Yeal;Ryu, Jaeho;Yoon, Sung-Won;Ju, Young K.
    • Journal of the Korean Society for Advanced Composite Structures
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    • v.6 no.4
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    • pp.30-37
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    • 2015
  • iFLASH System is new structural floor system which consists of sandwich panels filled with nano-composite. The nano-composite has low specific gravity and high bonding strength with steel plates. The bonding strength is one of important factors for structural performance of iFLASH System and it can further be improved by surface preparation such as blast metal cleaning. However, using none blast steel plates is recommended since surface preparation generates additional fabrication time and cost. In this study, a bonding strength test and bending experiment were conducted to check feasibility of applying none blast steel plates to iFLASH System. Moreover, stress in bonding plane between steel plates and nano-composite was analytically evaluated by finite element method. Consequently, flexural capacity of the specimen was 11% higher than theoretically calibrated value and its flexural behavior was structurally efficient without defect of bonding.

Crosslinkable Warm-melt-Polyurethanes Offer Instant-fix Characteristics

  • Merz, Peter W.
    • Journal of Adhesion and Interface
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    • v.3 no.1
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    • pp.37-42
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    • 2002
  • Adhesives are becoming increasingly accepted for advanced engineering/boding tasks. Therefore the understanding of the basic principles and the benefits of elastic bonding and structural bonding respectively is of utmost importance. Structural bonding means adhesive performance in load-bearing environments. Furthermore. the time to achieve handling strength has an impact on the economics of an assembly line. The paper gives briefly a summary about the fundamentals of elastic bonding and discusses different adhesive systems in the context of handling strength. Hereby the focus lies on the Warm Melt Technology, and its potential is compared to standard adhesives (l-part, 2-part and Booster Technology, a special 2-C system). Examples illustrate their economical benefits. Main Points : ${\bullet}$ The basic principles and benefits of elastic bonding ${\bullet}$ Warm-melt Technology in comparison with standard adhesives ${\bullet}$ Handling strength an economic issue ${\bullet}$ Combination with Booster-Technology, a special 2-C PUR system ${\bullet}$ Presentation of real world applications Learning Objectives: ${\bullet}$ Fundamentals of elastic bonding ${\bullet}$ Warm-melt Technology: correlation between chain length and cristallinity ${\bullet}$ Handling strength and curing speed of various systems in comparison ${\bullet}$ Real world applications illustrate the potential of the Warm-melt Technology.

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Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique (3중 접합 공정에 의한 MEMS 공진기의 웨이퍼레벨 진공 패키징)

  • Yang, Chung Mo;Kim, Hee Yeoun;Park, Jong Cheol;Na, Ye Eun;Kim, Tae Hyun;Noh, Kil Son;Sim, Gap Seop;Kim, Ki Hoon
    • Journal of Sensor Science and Technology
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    • v.29 no.5
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    • pp.354-359
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    • 2020
  • The high vacuum hermetic sealing technique ensures excellent performance of MEMS resonators. For the high vacuum hermetic sealing, the customization of anodic bonding equipment was conducted for the glass/Si/glass triple-stack anodic bonding process. Figure 1 presents the schematic of the MEMS resonator with triple-stack high-vacuum anodic bonding. The anodic bonding process for vacuum sealing was performed with the chamber pressure lower than 5 × 10-6 mbar, the piston pressure of 5 kN, and the applied voltage was 1 kV. The process temperature during anodic bonding was 400 ℃. To maintain the vacuum condition of the glass cavity, a getter material, such as a titanium thin film, was deposited. The getter materials was active at the 400 ℃ during the anodic bonding process. To read out the electrical signals from the Si resonator, a vertical feed-through was applied by using through glass via (TGV) which is formed by sandblasting technique of cap glass wafer. The aluminum electrodes was conformally deposited on the via-hole structure of cap glass. The TGV process provides reliable electrical interconnection between Si resonator and aluminum electrodes on the cap glass without leakage or electrical disconnection through the TGV. The fabricated MEMS resonator with proposed vacuum packaging using three-layer anodic bonding process has resonance frequency and quality factor of about 16 kHz and more than 40,000, respectively.