• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• Proceedings of the Korea Concrete Institute Conference
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• 1995.10a
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• pp.293-298
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• 1995

This study experimentally evaluate the bonding performance of repair and strengthening materials. It is very important problem to justify bonding properties between repair and strengthening materials and old concrete. Many previous research and investigation showed that bonding strength of reinforcing materials determines the strengthening effect and the durability of repair work. Therefore, menifestation of bonding properties and the improvement of bonding performance of repair and strengthening materials are very important. In order to improve the perforamnce of repair work, it needs to investigate the behavior of bonding materials, such as stress distribution along the bonding area and the long term performance of the material. The target repair methods are steel plate addition technique and repair mortar method, and the test parameters studied in this paper include epoxy thickness, bonding surface texture, and bonding area.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.353-358
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• 2001

The cement concrete pavements are designed twenty years of performance life in Korea. At the present time, some expressways have been elapsed seventy percent of performance life which are detecting local failures. The most repair methods using to repair failures are partial depth repair and full section repair. These methods are most important bonding strength between rapid curing materials and substrate concrete pavements. This study was performed to evaluate bonding strength of the composites section made of rapid curing material and substrate concrete pavements. The pull-out tester was used to test bonding strength for the composites section made of each materials. In the results of the test, the bonding strength values of the epoxy mortar and acrylic mortar are higher than those of the other materials. The performance life of repaired section is affected by various factor. The bonding strength of bonded composites section may be affect the performance life, significantly.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.17-24
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• 2020

As an interconnect scaling faces a technical bottleneck, the device stacking technologies have been developed for miniaturization, low cost and high performance. To manufacture a stacked device structure, a vertical interconnect becomes a key process to enable signal and power integrities. Most bonding materials used in stacked structures are currently solder or Cu pillar with Sn cap, but copper is emerging as the most important bonding material due to fine-pitch patternability and high electrical performance. Copper bonding has advantages such as CMOS compatible process, high electrical and thermal conductivities, and excellent mechanical integrity, but it has major disadvantages of high bonding temperature, quick oxidation, and planarization requirement. There are many copper bonding processes such as dielectric bonding, copper direct bonding, copper-oxide hybrid bonding, copper-polymer hybrid bonding, etc.. As copper bonding evolves, copper-oxide hybrid bonding is considered as the most promising bonding process for vertically stacked device structure. This paper reviews current research trends of copper bonding focusing on the key process of Cu-SiO₂ hybrid bonding.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.10a
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• pp.81-82
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• 2016

The present study aims to derive optimal interface treatment conditions for emulating a monolithic construction. The joints in this construction are formed through the bonding shear evaluation method during the placement of ultra-high-performance concrete (UHPC) and normal strength concrete (NSC). The evaluation items include push-off tests for homogeneous UHPC + UHPC and heterogeneous NSC + UHPC. The experimental samples comprised a monolithic placement as the baseline, two levels for the separated placement according to the compression strength of concrete, and five levels for the interface treatment. The increase in the number of grooves and their cross-sectional areas only slightly influenced the bonding shear performance. The optimal interface treatment method for the homogeneous UHPC + UHPC construction grooves was at least 30mm. The heterogeneous NSC + UHPC construction should utilize waterjet roughening to expose the aggregate for the increased roughness.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2015.05a
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• pp.86-87
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• 2015

An active study on UHPC, which has been recently used in high-rise building and bridges, is in progress. However, research on bonding shear strength of UHPC is required to be studied due to the lack of information. In this study, experimental research progress for bonding shear strength (shear strength of adhesive surface) evaluation of UHPC (Ultra High Performance Concrete) is proceeded. First, specimens that surface treatment methods of concrete bonded section and retardation time of placement are considered are produced. Second, Direct Shear test is applied on concrete bonded section of UHPC. As a result of this study, the highest bonding shear strength specimen in which compared to the non-retardation time specimen is compaction turbulence treatment. From later study, it is judged that strength of UHPC in accordance with direction of steel fiber when steel fiber of UHPC is mixed.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2016.05a
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• pp.22-23
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• 2016

This study aims to derive the optimal condition that ensures the monolithicity of ultra-high performance concrete (UHPC), through the evaluation of bonding shear performance with respect to the time of cold joint occurrence during the placement. From the direct shear test, while the normalized bonding shear strength reduction of UHPC with the delay time of 15 minutes was the lowest at around 8%, a dramatic degradation of bonding shear performance was observed after 15 minutes. XRD analysis of the middle and surface sections was performed in order to analyze the composition of the thin film formed at the surface of UHPC, and as a result, the main ingredient appeared to be SiO₂ from the XRD pattern of middle and surface sections, which is believed to be the result of the rising of SiO₂-based filler, used as anadmixture in this study, toward the surface, due to its low specific gravity.