• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.9-15
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• 2009

Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.67-73
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• 2009

Compared to the chip-bonding process utilizing solder bumps, flip chip process using Cu pillar bumps can accomplish fine-pitch interconnection without compromising stand-off height. Cu pillar bump technology is one of the most promising chip-mounting process for RF packages where large gap between a chip and a substrate is required in order to suppress the parasitic capacitance. In this study, Cu pillar bumps and Sn bumps were electroplated on a chip and a substrate, respectively, and were flip-chip bonded together. Contact resistance and chip shear force of the Cu pillar bump joints were measured with variation of the electroplated Sn-bump height. With increasing the Sn-bump height from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance was improved from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$ and the chip shear force increased from 3.8 N to 6.8 N. On the contrary, the aspect ratio of the Cu pillar bump joint decreased from 1.3 to 0.9. Based on the variation behaviors of the contact resistance, the chip shear force, and the aspect ratio, the optimum height of the electroplated Sn bump could be thought as 20 ${\mu}m$.

• Journal of the Korea institute for structural maintenance and inspection
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• v.27 no.4
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• pp.23-32
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• 2023

The seismic performance of buried PE pipes is reported to be favorable due to their exceptional elongation capacity at break. Although a seismic performance evaluation procedure based on the response displacement method has been summarized in Korea for fusion-bonded PE pipes, there is currently no procedure available for mechanically jointed PE pipes. This article aims to present a seismic performance evaluation procedure based on the response displacement method specifically designed for mechanically jointed PE pipes in Korea. When employing the mechanical joining method for PE pipes, it is recommended to adhere to the evaluation procedure established for segment-type pipes. This involves assessing the stress induced by the pipe, the expansion and contraction strain of the joint, and the bending angle of the pipe joint. Furthermore, the coefficient of inhomogeneity of the soil, which is necessary for estimating the axial strain of the ground, is introduced. Additionally, a computation method for determining lateral displacement and reconsolidation settlement in soil susceptible to liquefaction is proposed. As a result of the sensitivity analysis considering the typical soil condition in Korea, the mechanically jointed PE pipe with a certain quality was shown to have good structural seismic safety when soil liquefaction was not considered. This procedure serves as a valuable tool for seismic design and evaluating the seismic performance of mechanically joined buried PE pipes, which are primarily utilized for connecting small-diameter pipes.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.79-85
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• International Journal of Highway Engineering
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• v.20 no.1
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• pp.87-95
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• 2018

PURPOSES : A geo-grid pavement, e.g., a stress-absorbing membrane interlayer (SAMI), can be applied to an asphalt-overlay method on the existing surface-pavement layer for pavement maintenance related to reflection cracking. Reflection cracking can occur when a crack in the existing surface layer influences the overlay pavement. It can reduce the pavement life cycle and adversely affect traffic safety. Moreover, a failed overlay can reduce the economic value. In this regard, the objective of this study is to evaluate the bonding properties between the rigid pavement and a SAMI by using the direct shear test and the pull-off test. The predicted fractural energy functions with the shear stress were determined from a numerical analysis of the moving average method and the polynomial regression method. METHODS : In this research, the shear and pull-off tests were performed to evaluate the properties of mixtures constructed using no interlayer, a tack-coat, and SAMI with fabric and without fabric. The lower mixture parts (describing the existing pavement) were mixed using the 25-40-8 joint cement-concrete standard. The overlay layer was constructed especially using polymer-modified stone mastic asphalt (SMA) pavement. It was composed of an SMA aggregate gradation and applied as the modified agent. The sixth polynomial regression equation and the general moving average method were utilized to estimate the interlayer shear strength. These numerical analysis methods were also used to determine the predictive models for estimating the fracture energy. RESULTS : From the direct shear test and the pull-off test results, the mixture bonded using the tack-coat (applied as the interlayer between the overlay layer and the jointed cement concrete) had the strongest shear resistance and bonding strength. In contrast, the SAMI pavement without fiber has a strong need for fractural energy at failure. CONCLUSIONS : The effects of site-reflection cracking can be determined using the same tests on cored specimens. Further, an empirical-mechanical finite-element method (FEM) must be done to understand the appropriate SAMI application. In this regard, the FEM application analy pavement-design analysis using thesis and bonding property tests using cored specimens from public roads will be conducted in further research.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.72-72
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• 2009

전자부품의 내부접속 및 파워반도체의 다이본딩과 같은 1차실장에는 고온환경에서의 사용과 2차실장에서의 재용융방지를 위해 높은 액상선온도 및 고상선온도를 필요로 하여, Pb-5wt%Sn, Pb-2.5wt%Ag로 대표되는 납성분 85%이상의 고온솔더가 널리 사용되고 있다. 생태계와 인체에 대한 납의 유해성이 보고된 이래, 무연솔더에 대한 연구가 활발히 진행되어 왔으나, Sn-Ag-Cu계로 대표되는 Sn계 합금으로 대체 중인 중온용 솔더와는 달리, 고온용 솔더에 대해서는 대체합금에 대한 연구가 미흡한 실정이다. 대체재의 부재로 인해 기존의 납을 다량함유한 솔더로 1차실장이 지속됨으로서, 2차실장의 무연화에도 불구하고 전자부품 및 기기의 재활용에 큰 어려움을 겪고 있다. 지금까지 고온용 무연솔더로서는 융점에 근거해 Au-(Sn, Ge, Si)계, Bi-Ag계, Zn-(Al, Sn)계의 극히 제한된 합금계만이 보고되어 왔다. Au계 솔더는 현재 플럭스를 사용하지 않는 광학, 디스플레이 분야 등 고부가가치 공정에 사용되고 있으나, 합금가격이 매우 비싸며 가공성이 나빠 대체재료로서는 적합하지 않다. Bi-Ag계 솔더 또한 취성합금으로 와이어 및 박판으로 가공하는데 어려움이 크며, 솔더로서 중요한 특성중 하나인 전기전도도 및 열전도도가 나쁜 편이다. 이에 비해, Zn계 합금은 비교적 낮은 합금가격, 적절한 가공성과 뛰어난 인장강도, 우수한 전기전도도 및 열전도도를 지녀, 고온용솔더 대체재료의 유력한 후보로 생각된다.이전 연구에서, 필자의 연구그룹은 Zn-Sn계 합금을 고온용 무연솔더로서 제안한 바 있다. Zn-Sn계 합금은 충분히 높은 융점과 함께, 금속간화합물이 없는 미세조직, 우수한 기계적 특성, 높은 전기전도도 및 열전도도 등의 장점을 나타내었다. 본 연구에서는 기초합금특성상 고온솔더로서 다양한 장점을 지닌 Zn-30wt%Sn합금을 고온용 솔더의 대표적인 적용의 하나인 다이본딩에 적용하여, 접합부의 강도 및 미세조직, 열피로 신뢰성에 대해 분석을 함으로서 실제 공정에의 적용가능성에 대해 검토하였다. Zn-30wt%Sn을 이용해 Au/TiN(Titanium nitride) 코팅한 Si다이를 AlN-DBC(aluminum nitride-direct bonded copper)기판에 접합한 결과, 양측에 완전히 젖은 기공이 없는 양호한 다이접합부를 얻었으며, 솔더내부에는 금속간화합물을 형성하지 않았다. Si다이와의 계면에는 TiN만이 존재하였으며, Cu와의 계면에는 Cu로부터 $Cu_5Zn_8,\;CuZn_5$의 반응층을 형성하였다. 온도사이클시험을 통한 열피로특성평가에서, Zn-30wt%Sn를 이용한 다이접합부는 1500사이클 지점에서 Cu와 Cu-Zn금속간화합물의 사이에서 피로균열이 형성되며, 접합강도가 크게 감소하였다. 열피로특성 향상을 위해 Cu표면에 TiN코팅을 하여 Zn-30wt%Sn 솔더로 다이접합한 결과, Si다이와 기판 양측에 TiN만으로 구성된 계면을 형성하였으며, TEM관찰을 통해 Zn-30wt%Sn과 극히 미세한 접합계면이 형성하고 있음을 확인하였다. Zn-wt%30Sn솔더와 TiN층의 병용으로 2000사이클까지 미세조직의 변화 및 강도저하가 없는 극히 안정된 고신뢰성의 다이접합부를 얻을 수가 있었다.

• The Journal of Korean Academy of Prosthodontics
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• v.41 no.6
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• pp.732-746
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• 2003

Statement of problem. Soft lining materials, also referred to as tissue conditioning materials, tissue heating materials, relining materials, soft liners or tissue conditioners, were first introduced to dentistry by a plastic manufacturer in 1959. Since the introduction of the materials to the dental field, their material properties have been continually improved through the effort of many researchers. Soft lining materials have become widely accepted, particularly by prosthodontists, because of their numerous clinical advantages and ease of manipulation. Unfortunately, few reports have been issued upon the topic of increasing the bond strength between the base metal alloy used in cast denture bases and PMMA soft liner modified with 4-META, nor upon the pattern of debonding and material change in wet environment like a intra oral situation. Purpose. The purposes of this study were comparing the bond strength between base metal alloy used for the cast denture bases and PMMA soft liner modified with 4-META, and describing the pattern of debonding and material property change in wet environment like the intraoral situation. Material and Methods. This study consisted of four experiments: 1. The in vitro measurement of shear bond strength of the adhesive soft liner. 2. The in vitro measurement of shear bond strength of the adhesive soft liner after 2 weeks of aging. 3. A comparison of debonding patterns. 4. An evaluation the Relation time of modified soft liner. The soft liner used in this study was commercially available as Coe-soft (GC America.IL.,USA), which is provided in forms of powder and liquid. This is a PMMA soft liner commonly used in dental clinics. The metal primer used in this study was 4-META containing primer packed in Meta fast denture base resin (Sun Medical Co., Osaka, Japan). The specimens were formed in a single lap joint desist which is useful for evaluating the apparent shear bond strength of adhesively bonded metal plate by tensile loading. Using the $20{\times}20mm$ transparent grid, percent area of adhesive soft liner remaining on the shear area was calculated to classify the debonding patterns. To evaluate the change of the initial flow of the modified adhesive soft liner, the gelation time was measured with an oscillating rheometer (Haake RS150W/ TC50, Haake Co., Germany). It was a stress control and parallel plate type with the diameter of 35mm. Conclusion. Within the conditions and limitations of this study, the following conclusions were drawn as follows. 1. There was significant increase of bond strength in the 5% 4-META, 10% 4-META containing groups and in the primer coated groups versus the control group(P<0.05). 2. After 2 weeks of aging, no significant increase in bond strength was found except for the group containing 10% 4-META (P<0.05). 3. The gelation times of the modified soft liner were 9.3 minutes for the 5% 4-META containing liner and 11.5 minutes for the 10% 4-META liner. 4. The debonding patterns of the 4-META containing group after 2 weeks of aging were similar to those of immediaely after preparation, but the debonding pattern of the primer group showed more adhesive failure after 2 weeks of aging.

• Nuclear Engineering and Technology
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• v.42 no.6
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• pp.662-669
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• 2010

To develop the manufacturing methods for the blanket first wall (FW) of the International Thermonuclear Experimental Reactor (ITER) and to verify the integrity of the joint, Be/Cu mockups were fabricated and tested at the KoHLT-1 (Korea Heat Load Test facility), a graphite heater facility located at the Korea Atomic Energy Research Institute (KAERI). Since Be and Cu joining is the focus of the present study, the fabricated mockups had a CuCrZr heat sink joined with three Be tiles as an armor material, unlike the original ITER blanket FW, which has a stainless steel structure and coolant tubes. Hot isostatic pressing (HIP) was carried out at $580^{\circ}C$ and 100 MPa for 2 hours as the method for Be/Cu joining. Three interlayers, namely, $1{\mu}mCr/10{\mu}mCu$, $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$, and $5{\mu}mTi/10{\mu}mCu$ were applied as a coating to the Be tiles by a physical vapor deposition (PVD) method. A shear test was performed with the specimens, which were fabricated by the same methods as those used to fabricate the mockups. The average values were 125 MPa to 180 MPa, and the samples with the $1{\mu}mCr/10{\mu}mCu$ interlayer showed the lowest value. No defect or delamination was found in the joints of the mockups by the developed ultrasonic test using a flat-type probe with a 10 MHz frequency and a 0.25 inch diameter. High heat flux (HHF) tests were performed at $1.0\;MW/m^2$ heat flux for each mockup using the given conditions, and the results were analyzed by ANSYS-CFX code. For the test criteria, an expected fatigue lifetime about 1,000 cycles was obtained by analysis with ANSYS-mechanical code. Mockups using the interlayers of $1{\mu}mTi/0.5{\mu}mCr/10{\mu}mCu$ and $5{\mu}mTi/10{\mu}mCu$ survived up to 1,100 cycles over the required number of cycles. However, one of the Be tiles in the other two mockups using the $1{\mu}mCr/10{\mu}mCu$ interlayer was detached during the screening test, and others were detached by discharge after 862 cycles. The integrity of the joints using the proposed interlayers was proven by the HHF test, but the other interlayer requires more study before it can be used for the joining of Be to Cu. Moreover, it was confirmed that the measured temperatures agreed well with the analysis temperatures, which were used to estimate the lifetime and that the developed facility showed its capability of the long time operation.

• The Journal of Engineering Geology
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• v.32 no.4
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• pp.671-684
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• 2022

This study verified the stability of a high-strength combined buried pile retaining wall and its applicability in the field. A cast-in-place (C.I.P) retaining wall and the high-strength combined embedded pile retaining wall were compared and analyzed numerically. The numerical analysis assessed the ground behavior and stability (and thus field applicability) of a high-strength combined buried pile retaining wall using data measured in the field. The experimental results showed that the cross-sectional force and displacement of the high-strength bonded pile retaining wall were reduced by 13.6~19.7%, the shear force increased by 0.7~4.7%, and the bending moment increased by 4.5~8.8% relative to the values for the C.I.P retaining wall. Examination of the amount of subsidence in the ground around the excavation showed that the maximum settlement of the C.I.P retaining wall was 46.89 mm and that at the high-strength combined buried pile retaining wall was 39.37 mm. Overall, designing a high-strength combined embedded pile retaining wall by applying the maximum bending moment and shear force calculated using the elastic beam method to the site ground was shown to achieve the safety of all members, as member forces were generated within the elastic region.