• Title/Summary/Keyword: bipolar transistor

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Development of RF IC, Signal Processing IC and Software for Portable GPS Receiver (휴대 GPS 수신기용 RF IC, 신호처리 IC 및 소프트웨어 개발)

  • Ryum, Byung R.;Koo, Kyung Heon;Song, Ho Jun;Jee, Gyu In
    • Journal of Advanced Navigation Technology
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    • v.1 no.1
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    • pp.23-34
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    • 1997
  • A multi-channel digital GPS receiver has been developed including a RF-to-IF engine (engine 1), a digital signal processing engine (engine 2) with a microprocessor interfacing, and a navigation software. A high speed SiGe heterojunction bipolar transistor (HBT) as a active device has been mounted on chip-on-board (COB) type hybrid ICs such as LNA, mixer, and VCO in RF front-end of the engine 1 board. A 6-channel digital correlator together with a real-time clock and a microprocessor interface has been realized using an Altera Flex 10K FPGA as well as ASIC technology. Navigation software controlling the correlator for GPS signal tracking, retrieval and storing a message retrieval, and position calculation has been implemented. The GPS receiver was tested using a single channel STR2770 simulator. Successful navigation message retrieval and position determination was confirmed.

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The Study on Highly Miniaturized Active 90°C Phase Difference Power Divider and Combiner for Application to Wireless Communication (무선 통신 시스템 응용을 위한 초소형화된 능동형 90°C 위상차 전력 분배기와 결합기에 관한 연구)

  • Park, Young-Bae;Kang, Suk-Youb;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.33 no.1
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    • pp.144-152
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    • 2009
  • This paper propose highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner for application to wireless communication system. The conventional passive $90^{\circ}C$ power divider and combiner cannot be integrated on MMIC because of their very large circuit size. Therefore, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner are required for a development of highly integrated MMIC. In this paper, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner employing InGaAs/GaAs HBT were designed, fabricated on GaAs substrate. According to the results, the circuit size of fabricated active $90^{\circ}C$ phase difference power divider and combiner were $1.67{\times}0.87$ mm and $2.42{\times}1.05$ mm, respectively, which were 31.6% and 2.2% of the size of conventional passive branch-line coupler. The output gain division characteristic of proposed divider circuit showed 8.4 dB and 7.9 dB respectively, and output phase difference characteristic showed $-89.3^{\circ}C$. The output gain coupling characteristic of proposed combiner circuit showed 9.4 dB and 10.5 dB respectively, and output phase difference characteristic showed $-92.6^{\circ}C$. The highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner exhibited good RF performances compared with the conventional passive branch-line coupler.

A novel IGBT with improved electrical characteristics (향상된 전기적 특성을 갖는 IGBT에 관한 연구)

  • Koo, Yong-so
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.6 no.3
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    • pp.168-173
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    • 2013
  • In this paper, we tried different two approach to improve the performance of the IGBT. The first approach is that adding N+ region beside P-base in the conventional IGBT. It can make the conventional IGBT to get faster turn-off time and lower conduction loss. The second approach is that adding P+ region on right side under gate to improve latching current of conventional IGBT. The device simulation results show improved on-state, latch-up and switching characteristics in each structure. The first one was presented lower voltage drop(3.08V) and faster turn-off time(3.4us) than that of conventional one(3.66V/3.65us). Also, second structure has higher latching current(369A/?? ) that of conventional structure. Finally, we present a novel IGBT combined the first approach with second one for improved trade-off characteristic between conduction and turn-off losses. The proposed device has better performance than conventional IGBT.

The Sugge Voltage restraint of induction motor using low-loss snubber circuit (저손실 스너버 회로를 이용한 유도전동기의 서지전압 억제)

  • Cho, Man-Chul;Mun, Sang-Pil;Kim, Chil-Yong;Kim, Ju-Yong;Shu, Ki-Young;Kwon, Soon-Kurl
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2007.05a
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    • pp.473-477
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    • 2007
  • The development of advanced Insulated Gate Bipolar Transistor(IGBT)has enabled high-frequency switching operation and has improved the performance of PWM inverters for motor drive. However, the high rate of dv/dt of IGBT has adverse effects on motor insulation stress. In many motor drive applications, the inverter and motor are separated and it requires long motor feds. The long cable contributes high frequency ringing at the motor terminal and it results in hight surge voltage which stresses the motor insulation. The inverter output filter and RDC snubber are conventional method which can reduce the surge voltage. In this paper, we propose the new low loss snubber to reduce the motor terminal surge voltage. The snubber consists of the series connection of charging/discharging capacitor and the voltage-clamped capacitor. At IGBT turn-off, the snubber starts to operate when the IGBT voltage reaches the voltage-clamped level. Since dv/dt is decreased by snubber operating, the peak level of the surge voltage can be reduced. Also the snubber operates at the IGBT voltage above the voltage-clamped level, the snubber loss is largely reduced comparing with RDC snubber. The proposed snubber enables to reduce the motor terminal surge voltage with low loss.

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Harmonic Reduction of Electric Propulsion Ship using New Rectification Scheme (새로운 정류방식을 이용한 전기추진선박의 고조파 저감)

  • Kim, Jong-Su;Choi, Jae-Hyuk;Yoon, Kyoung-Kuk;Seo, Dong-Hoan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.10
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    • pp.2230-2236
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    • 2012
  • Currently, the AC-to-DC power conversion system using diode rectifiers is mainly used in large vessels. Also, to reduce the total harmonic distortion(THD) of current and voltage, this system requires an additional phase-shifting transformer which can be powered multi-pulses. In this case, due to the installation of the transformer, the spatial or economic loss occurs. This paper presents a novel active rectification scheme using silicon controlled rectifier(SCR) or insulated gate bipolar transistor(IGBT) devices on behalf of the diode rectifiers which are currently operating in large vessels such as LNG Carrier(LNGC). The proposed system can use the low voltage source and reduce current and voltage harmonics generated by nonlinear loads connected to the power distribution bus and save economic costs by removing the phase-shifting transformers which are used in conventional system. Computer simulations are performed under the electric propulsion system which is operating in current large vessel. The results are shown in support of the improvement of THD included in the current and voltage wave forms of propulsion motor.

(AlGaAs/GaAs HBT IC Chipset for 10Gbit/s Optical Receiver) (10Gbit/s 광수신기용 AlGaAs/GaAs HBT IC 칩 셋)

  • 송재호;유태환;박창수;곽봉신
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.36C no.4
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    • pp.45-53
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    • 1999
  • A pre amplifier, a limiting amplifier, and a decision IC chipset for 10Gbit/s optical receiver was implemented with AIGaAs/GaAs HBT(Heterojunction Bipolar Transistor) technology. The HBT allows a cutoff frequency of 55GHz and a maximum oscillation of 45GHz. An optical receiver front-end was implemented with the fabricated pre amplifier IC and a PIN photodiode. It showed 46dB$\Omega$, gain and $f_{3db}$ of 12.3GHz. The limiting amplifier Ie showed 27dB small signal gain, $f_{3db}$ of 1O.6GHz, and the output is limited to 900mVp-p from 20mVp-p input voltage. The decision circuit IC showed 300-degree phase margin and input voltage sensitivity of 47mVp-p at 1OGbit/s.

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A Study on the Breakdown Voltage Characteristics with Process and Design Parameters in Trench Gate IGBT (트렌치 게이트 IGBT 에서의 공정 및 설계 파라미터에 따른 항복 전압 특성에 관한 연구)

  • Shin, Ho-Hyun;Lee, Han-Sin;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.5
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    • pp.403-409
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    • 2007
  • In this paper, effects of the trench angle($\theta$) on the breakdown voltage according to the process parameters of p-base region and doping concentrations of n-drift region in a Trench Gate IGBT (TIGBT) device were analyzed by computer simulation. Processes parameters used by variables are diffusion temperature, implant dose of p-base region and doping concentration of n-drift region, and aspects of breakdown voltage change with change of each parameter were examined. As diffusion temperature of the p-base region increases, depth of the p-base region increases and effect of the diffusion temperature on the breakdown voltage is very low in the case of small trench angle($45\;^{\circ}$) but that is increases 134.8 % in the case of high trench angle($90\;^{\circ}$). Moreover, as implant dose of the p-base region increases, doping concentration of the p-base region increases and effect of the implant dose on the breakdown voltage is very low in the case of small trench angle($45\;^{\circ}$) but that is increases 232.1 % in the case of high trench angle($90\;^{\circ}$). These phenomenons is why electric field concentrated in the trench is distributed to the p-base region as the diffusion temperature and implant dose of the p-base increase. However, effect of the doping concentration variation in the n-drift region on the breakdown voltage varies just 9.3 % as trench angle increases from $45\;^{\circ}$ to $90\;^{\circ}$. This is why magnitude of electric field concentrated in the trench changes, but direction of that doesn't change. In this paper, respective reasons were analyzed through the electric field concentration analysis by computer simulation.

A Study on DC Traction Power Supply System Using PWM Converter (PWM컨버터를 적용한 경전철 전력공급시스템에 관한 연구)

  • Kim, Joorak;Park, Chang-Reung;Park, Kijun;Kim, Joo-Uk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.4
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    • pp.250-254
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    • 2016
  • Currently, power conversion system which converts AC to DC Power is applied in domestic urban railway. The diode rectifier is used in most of them. However the diode rectifier can not control the output voltage and can not regenerate power as well. On the other hand, PWM (pulse width modulation) converter using IGBT (isolated gate bipolar transistor) can control output voltage, allowing it to reduce the output voltage drop. Moreover the Bi-directional conduction regenerates power which does not require additional device for power regeneration control. This paper compared the simulation results for the DC power supply system on both the diode rectifier and the PWM converter. Under the same load condition, simulation circuit for each power supply system was constructed with the PSIM (performance simulation and modeling tool) software. The load condition was set according to the resistance value of the currently operating impedance of light rail line, and the line impedance was set according to the distance of each substations. The train was set using a passive resistor. PI (proportional integral) controller was applied to regulate the output voltage. PSIM simulation was conducted to verify that the PWM Converter was more efficient than the diode rectifier in DC Traction power supply system.

Development of 80kW Bi-directional Hybrid-SiC Boost-Buck Converter using Droop Control in DC Nano-grid (DC 나노그리드에서 Droop제어를 적용한 80kW급 양방향 하이브리드-SiC 부스트-벅 컨버터 개발)

  • Kim, Yeon-Woo;Kwon, Min-Ho;Park, Sung-Youl;Kim, Min-Kook;Yang, Dae-Ki;Choi, Se-Wan;Oh, Seong-Jin
    • The Transactions of the Korean Institute of Power Electronics
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    • v.22 no.4
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    • pp.360-368
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    • 2017
  • This paper proposes the 80-kW high-efficiency bidirectional hybrid SiC boost/buck converter using droop control for DC nano-grid. The proposed converter consists of four 20-kW modules to achieve fault tolerance, ease of thermal management, and reduced component stress. Each module is constructed as a cascaded structure of the two basic bi-directional converters, namely, interleaved boost and buck converters. A six-pack hybrid SiC intelligent power module (IPM) suitable for the proposed cascaded structure is adopted for high-efficiency and compactness. The proposed converter with hybrid switching method reduces the switching loss by minimizing switching of insulated gate bipolar transistor (IGBT). Each module control achieves smooth transfer from buck to boost operation and vice versa, since current controller switchover is not necessary. Furthermore, the proposed parallel control using DC droop with secondary control, enhances the current sharing accuracy while well regulating the DC bus voltage. A 20-kW prototype of the proposed converter has been developed and verified with experiments and indicates a 99.3% maximum efficiency and 98.8% rated efficiency.

RBS Analysis on the Si0.9Ge0.1 Epitaxial Layer for the fabrication of SiGe HBT (SiGe HBT 제작을 위한 실리콘 게르마늄 단결정 박막의 RBS 분석)

  • 한태현;안호명;서광열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.9
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    • pp.916-923
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    • 2004
  • In this paper, the strained Si$_{0.9}$Ge$_{0.1}$ epitaxial layers grown by a reduced pressure chemical vapor deposition (RPCVD) on Si (100) were characterized by Rutherford backscattering spectrometery (RBS) for the fabrication of an SiGe heterojunction bipolar transistor(HBT). RBS spectra of the ${Si}_0.9{Ge}_0.1$epitaxial layers grown on the Si substrates which were implanted with the phosphorus (P) ion and annealed at a temperature between $850^{\circ}C$ - $1000^{\circ}C$ for 30min were analyzed to investigate the post thermal annealing effect on the grown${Si}_0.9{Ge}_0.1$epitaxial layer quality. Although a damage of the substrates by P ion-implantation might be cause of the increase of RBS yield ratios, but any defects such as dislocation or stacking fault in the grown ${Si}_0.9{Ge}_0.1$ epitaxial layer were not found in transmission electron microscope (TEM) photographs. The post high temperature rapid thermal annealing (RTA) effects on the crystalline quality of the ${Si}_0.9{Ge}_0.1$ epitaxial layers were also analyzed by RBS. The changes in the RBS yield ratios were negligible for RTA a temperature between $900^{\circ}C$ - $1000^{\circ}C$for 20 sec, or $950^{\circ}C$for 20 sec - 60 sec. A SiGe HBT array shows a good Gummel characteristics with post RTA at $950^{\circ}C$ for 20 sec.sec.sec.