• Elastomers and Composites
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• v.56 no.1
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• pp.20-31
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• 2021

There is an increasing demand for the rolling resistance reduction in truck bus radial (TBR) tires in the tire industry. In TBR tires, natural rubber is used as a base polymer to prevent wear and satisfy required physical properties (cut and chip). A binary filler system (silica and carbon black) is used to balance the durability of the tire and rolling resistance performance. In this study, natural rubber (NR) compounds applied with a binary filler system were manufactured at different cure temperatures for vulcanizate structure analysis. The vulcanizate structures were categorized into carbon black bound rubber, silica silane rubber network, and chemical crosslink density by sulfur. Regardless of the cure temperature, the cross-link density per unit content of carbon black had a greater effect on the properties than silica due to affinity with NR. The relationship analysis between the mechanical, viscoelastic properties with vulcanizate structure could be a guideline for manufacturing practical TBR compounds.

• Elastomers and Composites
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• v.56 no.4
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• pp.234-242
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• 2021

The demand for truck bus radial (TBR) tires with enhanced fuel efficiency and wear resistance have grown in recent years. In addition, as the issue of particulate matter and air pollution increases, efforts are being made to reduce the generation of particulate matter. In this study, the properties of epoxidized natural rubber (ENR) containing a silica-friendly functional group were evaluated by considering it as a base rubber and varying the silica ratio in this binary filler system. The results showed that the wear resistance of the NR/BR blend compound decreased as the silica ratio increased. In contrast, the ENR/BR blend compound exhibited an increase in wear resistance as the silica ratio was increased. In particular, the ENR-50/BR blend compound showed the best wear resistance due to the presence of several epoxide groups. Furthermore, we observed that for tan 𝛿 at 60℃, higher epoxide content resulted in the higher T_g of the rubber, indicating a higher tan 𝛿 at 60℃. On the other hand, it was confirmed that increasing the silica ratio decreased the value of tan 𝛿 at 60℃ in all compounds. In addition, we measured the amount of wear particulate matters generated from the compound wear. These measurements confirmed that in the binary filler system, regardless of the filler type, the quantity of the generated wear particulate matters as the filler-rubber interaction increased. In conclusion, the silica filled ENR/BR blend compound exhibited the lowest generation of wear particulate matters.

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Journal of Welding and Joining
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• v.10 no.3
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• pp.1-12
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• 1992

A literature review was conducted to survey informations available on the welding metallurgy of aluminum alloys and its effect on fusion weldability, especially on solidification cracking and pore formation. Solidification cracking behavior of Al weld is a complicate matter as compared to other high alloys, where a relatively simple Fe-X(most detrimental elements S, P, B, Si, etc) binary diagram can be successfully applicable. Both additive and synergistic effects of elements should be considered together. A same element play a different role from system to system. Porosity, caused by hydrogen contamination of the weld is one of the most troublesome welding problems. The primary sources of hydrogen are believed to be an absorbed moisture on the filler metal or base metal and in the shielding gas. It is extremely important that reliable quality-control procedures be employed to eliminate all possible sources of hydrogen contamination. Selection of proper process and parameters is sometimes more important than controlling of alloying elements in order to make a defect-free weld.