• Title/Summary/Keyword: barrier height

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Schottky barrier overlapping in short channel SB-MOSFETs (Short Channel SB-FETs의 Schottky 장벽 Overlapping)

  • Choi, Chang-Yong;Cho, Won-Ju;Chung, Hong-Bay;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.133-133
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    • 2008
  • Recently, as the down-scailing of field-effect transistor devices continues, Schottky-barrier field-effect transistors (SB-FETs) have attracted much attention as an alternative to conventional MOSFETs. SB-FETs have advantages over conventional devices, such as low parasitic source/drain resistance due to their metallic characteristics, low temperature processing for source/drain formation and physical scalability to the sub-10nm regime. The good scalability of SB-FETs is due to their metallic characteristics of source/drain, which leads to the low resistance and the atomically abrupt junctions at metal (silicide)-silicon interface. Nevertheless, some reports show that SB-FETs suffer from short channel effect (SCE) that would cause severe problems in the sub 20nm regime.[Ouyang et al. IEEE Trans. Electron Devices 53, 8, 1732 (2007)] Because source/drain barriers induce a depletion region, it is possible that the barriers are overlapped in short channel SB-FETs. In order to analyze the SCE of SB-FETs, we carried out systematic studies on the Schottky barrier overlapping in short channel SB-FETs using a SILVACO ATLAS numerical simulator. We have investigated the variation of surface channel band profiles depending on the doping, barrier height and the effective channel length using 2D simulation. Because the source/drain depletion regions start to be overlapped each other in the condition of the $L_{ch}$~80nm with $N_D{\sim}1\times10^{18}cm^{-3}$ and $\phi_{Bn}$ $\approx$ 0.6eV, the band profile varies as the decrease of effective channel length $L_{ch}$. With the $L_{ch}$~80nm as a starting point, the built-in potential of source/drain schottky contacts gradually decreases as the decrease of $L_{ch}$, then the conduction and valence band edges are consequently flattened at $L_{ch}$~5nm. These results may allow us to understand the performance related interdependent parameters in nanoscale SB-FETs such as channel length, the barrier height and channel doping.

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Dietary spray-dried plasma improves intestinal morphology of mated female mice under stress condition

  • Liu, Yanhong;Choe, Jeehwan;Kim, Sheena;Kim, Byeonghyeon;Campbell, Joy M.;Polo, Javier;Crenshaw, Joe D.;Pettigrew, James E.;Song, Minho
    • Journal of Animal Science and Technology
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    • v.60 no.6
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    • pp.10.1-10.6
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    • 2018
  • Background: Stress causes inflammation that impairs intestinal barrier function. Dietary spray-dried plasma (SDP) has recognized anti-inflammatory effects and improvement of gut barrier function. Therefore, the purpose of this study was to investigate the effects of dietary SDP on intestinal morphology of mated female mice under stress condition. Results: Villus height, width, and area of small intestines were low on gestation day (GD) 3 or 4 under stress conditions, and higher later (Time, P < 0.05). Crypt depth of colon was low on GD 4 and higher later (Time, P < 0.05). Meanwhile, the SDP treatments improved (P < 0.05) intestinal morphology, indicated by increased villus height, villus width, villus area, and ratio between villus height and crypt depth of small intestines and crypt depth of colon, and by decreased crypt depth of small intestines, compared with the control diet. The SDP treatments also increased (P < 0.05) the number of goblet cells in intestines compared with the control diet. There were no differences between different levels of SDP. Conclusion: Dietary SDP improves intestinal morphology of mated female mice under stress condition.

Magnetotransport Properties of Co-Fe/Al-O/Co-Fe Tunnel Junctions Oxidized with Microwave Excited Plasma

  • Nishikawa, Kazuhiro;Orata, Satoshi;Shoyama, Toshihiro;Cho, Wan-Sick;Yoon, Tae-Sick;Tsunoda, Masakiyo;Takahashi, Migaku
    • Journal of Magnetics
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    • v.7 no.3
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    • pp.63-71
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    • 2002
  • Three fabrication techniques for forming thin barrier layer with uniform thickness and large barrier height in magnetic tunnel junction (MTJ) are discussed. First, the effect of immiscible element addition to Cu layer, a high conducting layer generally placed under the MTJ, is investigated in order to reduce the surface roughness of the bottom ferromagnetic layer, on which the barrier is formed. The Ag addition to the Cu layer successfully realizes the smooth surface of the ferromagnetic layer because of the suppression of the grain growth of Cu. Second, a new plasma source, characterized as low electron energy of 1 eV and high density of $10^{12}$ $cm^{-3}$, is introduced to the Al oxidation process in MTJ fabrication in order to reduce damages to the barrier layer by the ion-bombardment. The magnetotransport properties of the MTJs are investigated as a function of the annealing temperature. As a peculiar feature, the monotonous decrease of resistance area product (RA) is observed with increasing the annealing temperature. The decrease of the RA is due to the decrease of the effective barrier width. Third, the influence of the mixed inert gas species for plasma oxidization process of metallic Al layer on the tunnel magnetoresistance (TMR) was investigated. By the use of Kr-O$_2$ plasma for Al oxidation process, a 58.8 % of MR ratio was obtained at room temperature after annealing the junction at $300{^{\circ}C}$, while the achieved TMR ratio of the MTJ fabricated with usual Ar-$0_2$ plasma remained 48.4%. A faster oxidization rate of the Al layer by using Kr-O$_2$ plasma is a possible cause to prevent the over oxidization of Al layer and to realize a large magnetoresistance.

Drain Induced Barrier Lowering of Asymmetric Double Gate MOSFET for Channel Doping Profile (비대칭 DGMOSFET의 도핑분포함수에 따른 DIBL)

  • Jung, Hakkee
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.11
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    • pp.2643-2648
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    • 2015
  • This paper analyzes the phenomenon of drain induced barrier lowering(DIBL) for doping profiles in channel of asymmetric double gate(DG) MOSFET. The DIBL, the important short channel effect, is described as lowering of source barrier height by drain voltage. The analytical potential distribution is derived from Poisson's equation to analyze the DIBL, and the DIBL is observed according to the change of doping profile to influence on potential distribution. As a results, the DIBL is significantly influenced by projected range and standard projected deviation, the variables of channel doping profiles. The change of DIBL shows greatly in the range of high doping concentration such as $10^{18}/cm^3$. The DIBL increases with decrease of channel length and increase of channel thickness, and with increase of bottom gate voltage and top/bottom gate oxide film thickness.

Mobile sand barriers for windblown sand mitigation: Effects of plane layout and included angle

  • Gao, Li;Cheng, Jian-jun;Ding, Bo-song;Lei, Jia;An, Yuan-feng;Ma, Ben-teng
    • Wind and Structures
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    • v.34 no.3
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    • pp.275-290
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    • 2022
  • Mobile sand barriers are a new type sand-retaining structure that can be moved and arranged according to the engineering demands of sand control. When only used for sand trapping, mobile sand barriers could be arranged in single row. For the dual purposes of sand trapping and sand stabilization, four rows of mobile sand barriers can be arranged in a staggered form. To reveal the effect of plane layout, the included angle between sand barrier direction and wind direction on the characteristics of flow fields and the sand control laws of mobile sand barriers, numerical computations and wind tunnel tests were conducted. The results showed that inflows deflected after passing through staggered arrangement sand barriers due to changes in included angle, and the sand barrier combination exerted successive wind resistance and group blocking effects. An analysis of wind resistance efficiency revealed that the effective protection length of staggered arrangement sand barriers approximately ranged from the sand barrier to 10H on the leeward side (H is sand barrier height), and that the effective protection length of single row sand barriers roughly ranged from 1H on the windward side to 20H on the leeward side. The distribution of sand deposit indicated that the sand interception increased with increasing included angle in staggered arrangement. The wind-breaking and sand-trapping effects were optimal when included angle between sand barrier direction and wind direction is 60°-90°.

The electrical properties of a Ti/SiC(4H) sehottky diode (Ti/SiC(4H) 쇼트키 장벽 다이오드의 전기적 특성)

  • 박국상;김정윤;이기암;장성주
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.7 no.3
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    • pp.487-493
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    • 1997
  • Ti/sic(4H) Schottky barrier diodes were fabricated. The donor concentration and the built-in potential obtained by capacitance-voltage(C-V) measurement was about $2.0{\times}10^{15}{\textrm}{cm}^{-3}$ and 0.65 V, respectively. The ideality factor of 1.07 was obtained from the slope of current-voltage(I-V) characteristics at low current density. The breakdown field under the reverse bias voltage was about $1.7{\times}10^3V/{\textrm}{cm}$ and was very high. The barrier height of Ti for SiC(4H) was 0.91 V, which was determined by the analysis of the saturation current-temperature and the C-V characteristics.

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Electrical characteristics of Au/3C-SiC/Si/Al Schottky, diode (Au/3C-SiC/Al 쇼터키 다이오드의 전기적 특성)

  • Shim, Jae-Cheol;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.65-65
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    • 2009
  • High temperature silicon carbide Schottky diode was fabricated with Au deposited on poly 3C-SiC thin film grown on p-type Si(100) using atmospheric pressure chemical vapor deposition. The charge transport mechanism of the diode was studied in the temperature range of 300 K to 550 K. The forward and reverse bias currents of the diode increase strongly with temperature and diode shows a non-ideal behavior due to the series resistance and the interface states associated with 3C-SiC. The charge transport mechanism is a temperature activated process, in which, the electrons passes over of the low barriers and in turn, diode has a large ideality factor. The charge transport mechanism of the diode was analyzed by a Gaussian distribution of the Schottky barrier heights due to the Schottky barrier inhomogeneities at the metal-semiconductor interface and the mean barrier height and zero-bias standard deviation values for the diode was found to be 1.82 eV and $s_0$=0.233 V, respectively. The interface state density of the diode was determined using conductance-frequency and it was of order of $9.18{\times}10^{10}eV^{-1}cm^{-2}$.

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Fabrication and Characterization of ZnO Schottky Diode Using Sol-Gel Process (Sol-Gel 공정을 이용한 ZnO 쇼트키 다이오드의 제작 및 특성평가)

  • Lee, Deuk-Hee;Kim, Kyoung-Won;Park, Ki-Ho;Kim, Sang-Sig;Lee, Sang-Yeol
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.390-390
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    • 2010
  • We fabricate Schottky diodes with the contact between a sol-gel derived ZnO layer and Au that guarantees the expected Schottky contact due to the high work function. The formed single metal Schottky barrier shows characteristics comparable to the barrier formed by alloys. Au is deposited by thermal evaporation on a ZnO thin film that is optimally formed under sol-gel process conditions of a 1-mol zinc acetate concentration and a 3000-rpm coating speed. Possible defects. which can provide deleterious current paths. are minimized by patterning the deposited Au. The I-V curve verifies the formation of a Schottky contact. Measurements showed that the Schottky barrier height and leakage current at -5 V were 0.6 eV and $1{\times}10^{-12}A$. respectively.

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Ge thin layer transfer on Si substrate for the photovoltaic applications (Si 기판에서의 광소자 응용을 위한 Ge 박막의 Transfer 기술개발)

  • 안창근;조원주;임기주;오지훈;양종헌;백인복;이성재
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.743-746
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    • 2003
  • We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

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Development of Noise Prediction Program in Construction Sites (건설 공사장 간이 소음 예측 프로그램 개발)

  • Kim, Ha-Geun;Joo, Si-Woong
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.11
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    • pp.1021-1027
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    • 2007
  • A construction noise is the main reason for people's petition among the pollution. The purpose of this study is to develop the noise prediction program to see the level of the noise on the construction site more accurately. For this purpose, the database of the power level on the various equipments was made. The noise reduction by distance and the noise reduction by diffraction of barrier were mainly considered and calculated. The simple noise prediction program will provide the information about proper height and length of the potable barrier which satisfies noise criteria of the construction sites from a construction planning stage. To investigate the reliability of this program, the predicted data was compared with the measured data. An average of difference between measured data and predicted data is $0.1{\sim}2.8\;dB(A)$ and a coefficient of correlation is about $0.85{\sim}0.95$.