• 한국자기학회지
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• 제16권1호
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• pp.75-78
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• 2006

텅스턴-보론-카본질소 화합물 박막(W-B-C-N)을 만들기 위하여 박막내에 보론과 카본 그리고 질소의 불순물을 주입한 다음 결정구조를 조사하였으며, 이러한 박막의 식각 특성을 조사하기 위하여 고온에서 열처리한 다음 Cu박막을 W-B-C-N 박막위에 증착한 다음에 열처리하였고 여기에서 열적인 특성을 조사하였다. $1000\;{\AA}$의 박막을 RF magnetron sputtering방법을 이용하여 증착한 후에 박막의 전기적구조적인 특성을 측정하였으며, scratch test를 통해 박막의 결합력을 측정하였고, XRD측정을 통하여 결정성을 조사하였으며, 열처리한 후 etching을 하여 nomarski 현미경을 통하여 확산방지막의 안정성을 조사하였다. 이로부터 확산방지막내의 보론과 카본 질소 등의 불순물이 들어감에 따라 Cu가 Si 속으로 얼마나 들어가는가를 효과적으로 조사하였다. W-B-C-N 확산방지막의 역할은 $850^{\circ}C$까지 고온 열처리를 하는 경우에 Cu 원자가 Si 속으로 확산되어 나가는 것을 효과적으로 방지하는 것을 알 수 있었다. 텅스텐-보론-카본질소 화합물 박막의 비저항은 질소 가스의 유량비를 조절함으로써 쉽게 조절할 수 있었으며, 텅스텐-보론-카본-질소 화합물 박막은 Cu 확산방지막으로 적용했을 때 적절한 질소 농도가 들어간 확산방지막에서는 효과적으로 Cu의 확산을 방지하는 것을 알 수 있었다.

• 한국진공학회지
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• 제6권3호
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• pp.255-262
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• 1997

Ar과 $N_2$ 가스가 혼합된 분위기에서 반응성 스퍼터링 방법에 의하여 TiN 박막을 증 착하였다. $N_2$가스의 농도는 화학양론적으로 TiN이 형성되는 조건에 맞도록 조절하였으며, 기판의 온도는 실온에서부터 $700^{\circ}C$의 범위내로 유지하였다. (111)texture구조를 가지면서 화 학양론적으로 $Ti_{0.5}N){0.5}$인 박막은 기판의 온도가 $600^{\circ}C$이상에서 형성되었고, 기판의 온도가 $600^{\circ}C$에서는 형성된 박막은 N-과다형이었다. XRD, XPS 및 RBS 분석 결과 TiN 박막의 조 성비는 기판의 온도에 다소 의존하였으나 약 5% 이내에 불과하였다. TiN 박막의 면저항은 기판온도의 증가에 따라 감소하였고, 기판온도가 $600^{\circ}C$에서 증착된 TiN 박막의 면저항은 14.5$\Omega\Box$였고, Ar-가스 분위기에서 $700^{\circ}C$로 30초간 열처리한 후는 8.9$\Omega\Box$이었다. 따라서 반 응성 스퍼터링방법에 의하여 형성되는 양질의 TiN 박막은 기판온도가 $600^{\circ}C$이상이 최적조 건임을 알았다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 센서 박막재료
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• pp.38-42
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• 2001

To observe the Langmuir films, displacement current measuring system(Nippon Laser & Electronics), $\pi-A$ isotherms measuring device, and Brewster Angle Microscope(BAM) were used. As results, for 8A5H, big tilt angle changes of many molecules were detected before liquid expanded phase when the monolayer was compressed and expanded by barrier. Also many small and bright points were detected by BAM when the displacement current radically changed. In $\pi$-A isotherms, surface pressure of 8A5H was radically decreased between 35 and 40[mN/m] and monolayer was assumed to be collapsed in solid condensed phase, since large bright domain was observed without change of displacement current and this bright boundary was not classified part of domain in BAM image. If we observe behaviors of molecules on the water surface in these three measurement at the same time, we can get more precise informations on L films and it could be good data for fabricating LB films.

• E2M - 전기 전자와 첨단 소재
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• 제11권10호
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• pp.60-65
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• 1998

Deposition conditions, surface morphology, and electrical properties of polyamic acid alkylamine salts (PAAS) Langmuir-Blodgett(LB) films have been investigated through a study of surface pressure-area $\pi$-A isotherms, AFM (atomic force microscopy), and current-voltage characteristics. To obtain the optimum conditions of film deposition, the $\pi$-A isotherms were examined by varying temperature, barrier moving speed, dipping speed, spreading amount of solution etc. The Z-type LB films were made at the surface pressure of 5 mN m-1 and 25 mN m-1 for the AFM study; the former surface pressure forms the gas phase and the latter one forms the solid phase. The LB film made in the gas phase show domains with a size of about 200 A diameter and 70 A height. However, the LB films made in the solid phase show a very smooth surface with 2 A surface roughness. In the current-voltage characteristics measured along the perpendicular direction of the films, ohmic conduction has been observed below 105 V cm-1 and the calculated electrical conductivity is about 10-13 S cm-1. Nonohmic conduction has been observed above = 10-11 V cm and the conduction mechanism can be explained by the Schottky effect.

• 한국세라믹학회지
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• 제30권6호
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• pp.510-516
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• 1993

$PbTiO_3$ thin films have been formed by rapid thermal annealing(RTA) of $TiO_2$/Pb/$TiO_2$ multilayer films deposited on Si wafers by RF sputtering. Based on the optimal depositon conditions of TiO2 and Pb, $TiO_2$/Pb/$TiO_2$ three layers were deposited for 900$\AA$ each. These films were subjected to RTA process at the temperatures ranging from $400^{\circ}C$ to $900^{\circ}C$ for 30 seconds in air, and were analyzed by X-ray diffraction and transmission electron microscopy to investigate the phases and the microstructures. As a result, perovskite $PbTiO_3$ phases was obtained above $500^{\circ}C$ with the trace of unreacted $TiO_2$. RBS analysis revealed the anisotropic behavior of diffusion that the diffusivity of Pb to the bottom $TiO_2$ layer was faster than that of Pb to the top $TiO_2$ layer. The amorphous Pb-silicate was formed between film and Si substrate due to the diffusion of Pb, but Pb-silicate existed locally at the interface and the amount of that phase was very small. Therefore the effect of bottom $TiO_2$ layer as a diffusion barrier was confirmed. $PbTiO_3$ films formed by current technique showed a relative dielectric constant of 60, and the maximum breakdown field reached 170kV/cm.

• 한국표면공학회지
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• 제36권1호
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• pp.9-13
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• 2003

Plasma polymerized organic thin films were deposited on Si(100), glass and metal substrates at $25∼100 ^{\circ}C$ using thiophene and toluene precursors by PECVD method. In order to compare physical and electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 30∼100 W and deposition temperature on both corrosion protection efficiency and physical properties were studied. We found that the corrosion protection efficiency ($P_{k}$), which is one of the important factors for corrosion protection in the interlayer dielectrics of microelectronic devices application, was increased with increasing RF power. The highest $P_{k}$ value of plasma polymerized toluene film (85.27% at 70 W) was higher than that of the plasma polymerized thiophene film (65.17% at 100 W), indicating inhibition of oxygen reduction. The densely packed and tightly interconnected toluene film could act as an efficient barrier layer to the diffusion of molecular oxygen. The result of contact angle measurement showed that the plasma polymerized toluene films have more hydrophobic surface than those of the plasma polymerized thiophene films.

• 한국진공학회지
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• 제9권3호
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• pp.242-248
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• 2000

고주파 스퍼터링 방법으로 증착조건을 변화시키면서 BST 박막을 제작하였다. 증착온도가 높을수록, Ar/O$_2$비가 적을수록 우수한 전기적 특성을 보였다. 누설전류 전도기구를 분석하기 위해 Schottky모델과 modified-Schottky모델을 도입하였다. BST 박막의 누설전류 전도기구는 기존의 Schottky모델이 아니라 modified-Schottky 모델을 따른다는 것을 알았다. Modified-Schottky 모델을 사용하여 광학유전상수 $\varepsilon$=4.9, 이동도 $\mu$=0.019 $\textrm{cm}^2$/V-s, 그리고 장벽높이 $\phi_b$ =0.79 eV를 구하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.76.1-76.1
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• 2013

Atomic Layer Deposition (ALD) has remarkably developed in semiconductor and nano-structure applications since early 1990. Now, the advantages of ALD process are well-known as controlling atomic-level-thickness, manipulating atomic-level-composition control, and depositing impurity-free films uniformly. These unique properties may accelerate ALD related industries and applications in various functional thin film markets. On the other hand, one of big markets, Display industry, just starts to look at the potential to adopt ALD functional films in emerging display applications, such as transparent and flexible displays. Unlike conventional ALD process strategies (good quality films and stable precursors at high deposition processes), recently major display industries have suggested the following requirements: large area equipment, reasonable throughput, low temperature process, and cost-effective functional precursors. In this talk, it will be mentioned some demands of display industries for applying ALD processes and/or functional films, in terms of emerging display technologies. In fact, the AMOLED (active matrix organic light emitting diode) Television markets are just starting at early 2013. There are a few possibilities and needs to be developing for AMOLED, Flexible and transparent Display markets. Moreover, some basic results will be shown to specify ALD display applications, including transparent conduction oxide, oxide semiconductor, passivation and barrier films.

• 한국표면공학회지
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• 제45권3호
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• pp.117-122
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• 2012

ZTO/GZO double layered films were prepared on unheated non-alkali glass substrates. ZTO films were deposited by RF/DC hybrid magnetron co-sputtering using ZnO (RF) target and $SnO_2$ (DC) targets, and then GZO films were deposited by DC magnetron sputtering using an GZO ($Ga_2O_3$:5.57 wt%) target. These films were post-annealed at temperature of 200, $300^{\circ}C$ in air and vacuum ambient for 30 min. In the case of post-annealing in air, ZTO/GZO double layer showed relatively low resistivity change, compared to GZO single layer. Furthermore, ZTO/GZO double layer revealed low WVTR, compared to GZO single layer. Therefore, it can be confirmed that ZTO film doing a role with barrier for water or oxygen diffusion.

• 한국표면공학회지
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• 제52권2호
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• pp.103-110
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• 2019

As an anti-corrosion method in seawater, cathodic protection is widely recognized as the most effective and technically appropriate corrosion prevention methodology for marine structures against harsh corrosive environment. When applying the cathodic protection in seawater, the surface of the metal facilities the formation of compounds of $CaCO_3$ and $Mg(OH)_2$. These mixed compounds are generally called 'calcareous deposits'. This layer functions as a barrier against the corrosive environment and functions to further inhibit the corrosion process and then leading to a decrease in current demand for cathodic protection. However, calcareous deposit films are partially formed on the surface of the cathode and there are some difficulties to maintain both a corrosion resistance for a long period of time and a strong adhesion between deposits and base metal. In this study, the pulse electrodeposition process was applied to improve adhesion and corrosion resistance of the calcareous deposit films, and to solve the problem of hydrogen embrittlement at high current density. The uniform and compact calcareous deposit films were prepared by pulse electrodeposition process, and their properties were characterized using various surface analytical techniques together with electrochemical methods.