• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.30 no.2
• /
• pp.78-81
• /
• 2020

Quantum dot efficiency was increased to evaluate reliability and optical characteristics using incidental materials. Quantum dot was manufactured by wrapping a sandwich type quantum layer using a product with a barrier property to prevent water and oxygen because it is vulnerable to oxygen and moisture. We used the three quantum dot films consisting of quantum dot only and quantum dot products consisting of film and barrier film combined with PET in the quantum dot product to evaluate the change over 650 hours under high temperature and high humidity conditions at 60℃ and 90 % humidity. As a result, the quantum dot product with Barrier Film has lowered luminance by 8 %, CIE x by 2 % and CIE y by 8 %. Quantum dot products exposed to moisture and oxygen were oxidized and measured low before measurement.

• Korean Journal of Materials Research
• /
• v.6 no.7
• /
• pp.678-683
• /
• 1996

In the fabrication processes of thin film thermoelectrics, a subsequent annealing treatment is inevitable to reduce the defects and residual stresses introduced during the film growth, and to make the uniform carrier concentration of the film. However, the diffusion-induced atomic redistribution and the broadening of p/n junction region are expected to affect the thermoelectric properties of thin film modules. The present study intends to investigate the diffusion at the p/n junctions of thermoelectric thin films and to relate it to the property changes. The film junctions of p-type(Bi0.5Sb1.5Te3)and n-type(Bi2Te2.4Se0.6)were prepared by the flash evaporation method. Aluminum thin layer was employed as a diffusion barrier between p-and n-type films of the junction. This was found to be an effective barrier by showing a negligible diffusion into both type films. After annealing treatment, the thermoelectric properties of p/n couples with aluminum barrier layer were accordingly retained their properties without any deterioration.

• Food Science and Biotechnology
• /
• v.14 no.1
• /
• pp.68-72
• /
• 2005

Moisture sorption characteristics of edible composite films were determined and compared against moisture barrier properties. Edible composite films were Z1 (zein film with polyethylene glycol(PEG) and glycerol), Z2 (zein film with oleic acid), ZA1 (zein-coated high amylose corn starch film with PEG and glycerol), and ZA2 (zein-coated high amylose corn starch film with oleic acid). Z2 film showed the lowest equilibrium moisture content (EMC), monolayer value ($W_m$), water vapor permeability (WVP), and water solubility (WS). Surface structure of Z2 was relatively denser and finer than that of other edible films. GAB $W_m$ and C values decreased, while K values increased with increasing temperature. Correlation coefficients of WS:EMC and WVP:EMC at Aw 0.75 were higher than those of WS: $W_m$ and WVP: $W_m$, respectively. EMC values at Aw 0.75 appeared useful for evaluating or predicting moisture barrier properties of edible films.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1344-1347
• /
• 2004

Recently, Study on measuring property of a micro thin film(nm ～ hundreds of ) under Thermal Mechanical loading. In this work, We perform tensile test at high temperature(1200 ) to investigate mechanical properties of alumina TGO formed under Thermal Barrier Coating. We used Digital Image Correlation method for measuring displacement, and We presented a method of tensile test for thin film at high temperature.

• Journal of Surface Science and Engineering
• /
• v.53 no.5
• /
• pp.201-206
• /
• 2020

A SiOxCy(-H) thin film was synthesized by atmospheric pressure dielectric barrier discharge(APDBD), and a SiO₂-like layer was formed on the surface of the film by oxidation treatment using oxygen plasma. Hexamethylcyclotrisiloxane was used as a precursor for the SiOxCy(-H) synthesis, and He gas was used for stabilizing APDBD. Oxygen permeability was evaluated by forming an oxidized SiOxCy(-H) thin film on a PET film. When the single-layer oxidized SiOxCy(-H) film was coated on the PET, the oxygen gas permeability decreased by 46% compared with bare PET. In case of three-layer oxidized SiOxCy(-H) film, the oxygen gas permeability decreased by 73%. The oxygen permeability was affected by the thickness of the SiO₂-like layer formed by oxidation treatment rather than the thickness of the SiOxCy(-H) film. The excellent corrosion resistance was demonstrated by coating an oxidized SiOxCy(-H) thin film on the silver-coated aluminum PCB for light emitting diode (LED).

• Journal of the Korean Magnetics Society
• /
• v.15 no.2
• /
• pp.133-136
• /
• 2005

In the case of contacts between semiconductor and metal in semiconductor devices, they tend to be unstable because of thermal budget. To prevent these problems we deposited W-C-N diffusion barrier for preventing the interdiffusion between metal and semiconductor. The thickness of the barrier is $1,000{\AA}$ and the pressure is 3 mTorr during the deposition. In this work we coated LSMO (CMR material) on W-C-N diffusion barrier and then we studied the interface effects between LSMO layer and W-C-N diffusion barrier. We got results that the magnetic characteristics of LSMO thin film are still maintained after annealing at $800^{\circ}C$ for 3 hr because W-C-N thin diffusion barrier was prevented the diffusion of oxygen between LSMO and Si substrate.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.452-455
• /
• 2007

This paper provides an overview on the characteristics of a-SiC:H barrier film deposited for flexible display applications. Key characteristics such as high crack resistance, high thermal/hydro stability, excellent adhesion to the polymer substrate, as well as very low permeance has been demonstrated. The excellence of this barrier film has been shown from competitive analysis compared with other barrier coating materials. Finally, flexible Polymer Light Emitting Diode (PLED) test pixels have been fabricated on the barrier coated plastic substrate, demonstrating the viability of the device with lifetime data.

• Polymer(Korea)
• /
• v.32 no.1
• /
• pp.38-42
• /
• 2008

Ultrathin films were coated on low density Polyethylene (LDPE) food packaging films by plasma polymerization of methane, acetylene, hexamethyldisiloxane (HMDSO), and HMDSO+oxygen to improve the barrier property of the LDPE films. The film coated in HMDSO +oxygen (flow rate: 0.6+ 9.0 SCCM) plasma at 40 W for 10 min showed the highest improvement in the barrier property against oxygen, reducing the permeability of oxygen as much as 18.6 times. The film coated in acetylene (flow rate 0.75 SCCM) plasma at 10 W for 10 min showed the highest improvement in the barrier property against carbon dioxide and moisture, reducing the permeability of carbon dioxide and moisture as much as 12.0 and 3.0 times, respectively. In addition, cherry tomato, cucumber, and mushroom (Flammulina velutipes) wrapped with the coated films were kept fresh $1.5{\sim}3.0$ times longer than those wrapped with an LDPE film.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2004.08a
• /
• pp.985-987
• /
• 2004

A plastic substrate for flexible display is developed. The gas barrier property in the substrate is improved through depositing metal and metal oxide multi layer on plastic film by PVD process. The metal/metal-oxide multiplayer on plastic film shows excellent gas barrier property and optical property.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.109-110
• /
• 2005

We have suggested sputtered W-C-N thin film for preventing thermal budget between semiconductor and metal. These results show that the W-C-N thin film has good thermal stability and low resistivity. In this study we newly suggested sputtered W-B-C-N thin diffusion barrier. In order to improve the characteristics, we examined the impurity behaviors as a function of nitrogen gas flow ratio. This thin film is able to prevent the interdiffusion during high temperature (700 to $1000^{\circ}C$) annealing process and has low resistivity ($\sim$200$\mu{\Omega}-cm$). Through the analysis of X-Ray diffraction, resistivity and XPS, we studied structure behavior of W-B-C-N diffusion barrier.