• Journal of Ocean Engineering and Technology
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• v.26 no.5
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• pp.18-24
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• 2012

This paper concerned with the behaviour of shaping formation and the erection for SCST structure by cable-tensioning for three kinds of structure models. The joint types of experimental models are ball type joints, bolt type joints with gusset plates, and bolt type joints. The feasibility of the proposed shaping method and the reliability of the established geometric model were confirmed with a nonlinear finite element analysis and an experimental investigation for full size scaled pyramid test model and three kinds of SCST structure models. The characteristic of the behaviour of each joint type is shown in the shaping test for practical design purposes. As a results, the behaviour characteristics of joints is very significant in shaping analysis of space structures. So the joint type should be considered in the design and analysis of the shape formation for space structures. Also, in the special field condition, it could be a fast and economical method for constructing the space structure.

• Journal of the Korean Society of Costume
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• v.56 no.7 s.106
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• pp.42-53
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• 2006

The purpose of this research is to study doll's symbolism representing our social culture and the characteristics of clothing design. The ball joint doll was selected, that are pretty much resembled to human body in terms of facial expression, body proportion, joint movement, etc. Results of research are summarized as follows: the ball joint doll is indicated a doll whose joints are free to move with a round shaped joint, which originated by Yochilya simon, who adopted German Hans Bellmer's method.'rho ball joint doll, first, there appeared state of human isolation due to the material civilization and industrial revolution, and trend of adhering to one's own world made human possess dolls. Second, according to the doll play became a representing play culture among Kidult culture, dolls, that are resembled with human being, were recognized as personalized objects. Third, along of expanding digital culture that makes easy to exchange information via Internet, so, ball joint doll market is growing fast, for which various levels of mania are being formed. Take a look at the doll fashion in modern society. In accordance to form of Look, it is largely categorized Young Casual look, Office look, Ethnic look and Military look. When take a look at design specialty, young casual look was presented as a comfortable silhouette and also made of elastic materials and expressed vivid bright tones. Office look image was expressed as a suit of jacket with skirt, and cotton wool polyester materials and acro-matic colors. Ethnic look was represented by Japanese traditional dress and Chinese traditional clothing. The Military look was generally emphasized army uniforms of straight silhouette and shoulder straps.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.105.6-105
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• 2002

Contents 1We developed a new type of lower part of the human-sized BWR (biped walking robot) driven by a new actuator based on the ball screw which has high strength and high gear ratio. Each leg of the robot is composed of three pitch Joints and one roll joint. In all, a 8 degree-of-freedom robot was developed. A new type of actuator for the robot is proposed, which is composed of four bar link mechanism driven by the ball screw. The BWR was designed to walk autonomously by adapting small DC motors for the robot actuators and has an embeded controller system including host computer, batteries and motor drivers. In the performance test, we had basic stable walking data so far, but we f...

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.65-70
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• 2008

The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.6
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• pp.603-610
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• 2013

Finite element analysis is performed to evaluate stress and deformation of a wrinkle-type dust cover for the ball joints of tie rods of automotive steering system. Results of the analysis for assembly and operation condition show that sealing capability is good and the maximum stress on the body is smaller than the tensile strength. An optimal shape of the dust cover is obtained using the Taguchi method to reduce the maximum stress. The maximum stress of the optimal design under the operation condition is reduced by 22 per cent of that of the initial design. Results of the research show that performance evaluation and design of the dust covers can be effectively done using the proposed method.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.5
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• pp.354-361
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• 2016

Parallel robots are usually used for performing pick-and-place motion to increase productivity in high-speed environments. The present study proposes a high-speed parallel robot and a control approach to improve the tracking performance for the purpose of handling a solar cell. However, the target processes are not limited to the solar cell-handling field. Therefore, a delta-type parallel manipulator is designed, and a ball joint structure is specifically proposed to increase the allowed angle that would meet the required workspace. A control algorithm considering the synchronization between multiple joints in a closed-chain mechanism is also suggested to improve the tracking performance, where the tracking and synchronization errors are simultaneously considered. In addition, a prototype machine with the proposed ball joint is implemented. A satisfactory tracking performance is achieved by applying the proposed control algorithm, with a cycle time of 0.3 s for a 0.1 kg payload.

• Journal of the Korean Society of Industry Convergence
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• v.17 no.3
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• pp.84-92
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• 2014

In this paper, a novel 5-axis hybrid-kinematic machine tool is introduced and the research results on accuracy improvement of the prototype machine tool are presented. The 5-axis hybrid machine tool is made up of a 3-DOF parallel manipulator and a 2-DOF serial one connected in series. The machine tool maintains high ratio of stiffness to mass due to the parallel structure and high orientation capability due to the serial-type wrist. In order to acquire high accuracy, the methodology of measuring the output shafts by additional sensors instead of using encoder outputs at the motor shafts is proposed. In the kinematic view point, the hybrid manipulator reduces to a serial one, if the passive joints in the U-P serial chain at the center of the parallel manipulator are directly measured by additional sensors. Using the method of successive screw displacements, the kinematic error model is derived. Since a ball-bar is less expensive than a full position measurement device and sufficiently accurate for calibration, the kinematic calibration method of using a ball-bar is presented. The effectiveness of the calibration method has been verified through the simulations. Finally, the calibration experiment shows that the position accuracy of the prototype machine tool has been improved from 153 to $86{\mu}m$.