• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
• /
• pp.27-32
• /
• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• 마이크로전자및패키징학회지
• /
• 제22권1호
• /
• pp.35-41
• /
• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• 대한금속재료학회지
• /
• 제47권4호
• /
• pp.261-266
• /
• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• 마이크로전자및패키징학회지
• /
• 제9권3호
• /
• pp.31-36
• /
• 2002

PBGA에 비해 상대적으로 큰 칩을 실장하는 고속 SRAM용 153 FC-BGA을 대상으로 2차 솔더접합부의 신뢰성을 평가하였다. 실험은 열사이클 시험에서 발생하는 단면과 양면 실장, 패키지 구조, 언더 필 재료, 기판의 종류와 두께, 솔더 볼의 크기에 따른 영향을 분석하였다. BT기판의 두께가 0.95mm에서 1.20mm로 증가하고, 낮은 영률 의 언더 필 재료에서 솔더접합부의 피로 수명이 30% 향상됨을 확인하였다. 또한 솔더 볼의 크기가 0.76 mm에서 0.89mm로 증가하면, 솔더접합부에서 균열에 대한 저항성은 2배 정도 증가하였다.

• 마이크로전자및패키징학회지
• /
• 제29권3호
• /
• pp.55-61
• /
• 2022

본 연구에서는 용융온도가 중온계 무연 솔더인 Sn-3.0Ag-0.5Cu(SAC305)와 저온계 무연 솔더인 Sn-57Bi-1Ag를 사용하여 형성된 복합 무연 솔더 접합부의 특성에 대하여 보고 하였다. SAC305 솔더볼이 형성된 ball grid array(BGA) 패키지와 Sn-57Bi-1Ag 솔더 페이스트가 도포된 flame retardant-4(FR-4) 인쇄회로기판(printed circuit board, PCB)을 리플로우 솔더링 공정을 이용하여 복합 무연 솔더 접합부를 형성 하였다. 공정 온도 프로파일을 두 가지 형태로 달리하여 리플로우 솔더링 공정을 진행하였으며 리플로우 솔더링 공정 조건에 따른 계면 반응, 금속간화합물(intermetallic compound, IMC)의 형성, Bi의 확산 거동 등 복합 무연 솔더 접합부 계면 특성을 비교 분석 하였다. 또한, 열 충격 시험을 통하여 리플로우 솔더링 공정에 따른 복합 무연 솔더 접합부의 신뢰성 특성을 비교하고 열 충격 시험 전후 전단 시험을 진행하여 접합부의 기계적 특성 변화를 분석하였다.

• Ocean Systems Engineering
• /
• 제7권3호
• /
• pp.179-193
• /
• 2017

Dynamic response analysis of offshore triceratops with stiffened buoyant legs under impact and non-impact waves is presented. Triceratops is relatively new-generation complaint platform being explored in the recent past for its suitability in ultra-deep waters. Buoyant legs support the deck through ball joints, which partially isolate the deck by not transferring rotation from legs to the deck. Buoyant legs are interconnected using equally spaced stiffeners, inducing more integral action in dispersing the encountered wave loads. Two typical nonlinear waves under very high sea state are used to simulate impact and non-impact waves. Parameters of JONSWAP spectrum are chosen to produce waves with high vertical and horizontal asymmetries. Impact waves are simulated by steep, front asymmetric waves while non-impact waves are simulated using Stokes nonlinear irregular waves. Based on the numerical analyses presented, it is seen that the platform experiences both steady state (springing) and transient response (ringing) of high amplitudes. Response of the deck shows significant reduction in rotational degrees-of-freedom due to isolation offered by ball joints. Weak-asymmetric waves, resulting in non-impact waves cause steady state response. Beat phenomenon is noticed in almost all degrees-of-freedom but values in sway, roll and yaw are considerably low as angle of incidence is zero degrees. Impact waves cause response in higher frequencies; bursting nature of pitch response is a clear manifestation of the effect of impact waves on buoyant legs. Non-impact waves cause response similar to that of a beating phenomenon in all active degrees-of-freedom, which otherwise would not be present under normal loading. Power spectral density plots show energy content of response for a wide bandwidth of frequencies, indicating an alarming behaviour apart from being highly nonlinear. Heave, being one of the stiff degrees-of-freedom is triggered under non-impact waves, which resulted in tether tension variation under non-impact waves as well. Reduced deck response aids functional requirements of triceratops even under impact and non-impact waves. Stiffened group of buoyant legs enable a monolithic behaviour, enhancing stiffness in vertical plane.

• 한국소음진동공학회논문집
• /
• 제13권10호
• /
• pp.777-784
• /
• 2003

본 논문에서는 압전소자를 이용한 코너 지지된 직사각형 박판의 음향 반응에 대한 제어에 관하여 이론과 실험적인 연구를 하였다. 3개의 각각 다른 종횡비의 알루미늄판을 사용하였고 고정은 4개의 코너에서 볼조인트를 이용하였다. 그 결과 종횡비가 가장 큰 박판에서 0∼200Hz 진동수와 80∼100dB의 음압의 가진에서 예측대로 가장 크고 선명한 응답을 보였다. 압전소자에 의한 판을 통한 음향전달 감소는 크지 않았지만, 압전소자를 이용한 음향반응 제어는 기대 이상으로 현저하였다. 본 실험은 항공기 승강문의 음장 가진에 대한 선행 연구를 확장시킨 독창적인 연구이다. 가장 중요한 차이점은 문의 조인트를 볼 조인트로 모사한 것이다.

• 대한기계학회논문집A
• /
• 제28권12호
• /
• pp.1856-1863
• /
• 2004

In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is not yet satisfactory. Several researchers reported that lead-contained solders have a good fatigue property. The others published that the lead-free solders have a longer thermal fatigue life. In this paper, the reason for the contradictory results published on the estimation of fatigue life of lead-free solder is investigated. In the present study, fatigue behavior of 63Sn37Pb, and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluating the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder ball joint in BGA packages. It was found that lead-free solder joints have a good fatigue property in the small temperature range condition. That condition induce small strain amplitude. However in the large temperature range condition, lead-contained solder joints have a longer fatigue life.

• 제어로봇시스템학회논문지
• /
• 제5권3호
• /
• pp.353-362
• /
• 1999

This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

• 한국자동차공학회논문집
• /
• 제10권5호
• /
• pp.199-205
• /
• 2002

The scale of repair parts market reached 0.1 billion won. Above all, it is remarkable that the automotive insurance business world is paying f3r 40 ~5o% of the whole repair cost. The repair parts consist of a genuine parts, non-genuine parts, recycling used parts. It is the recent trend that recycled parts are more popular than the genuine parts f3r repairing crashed cars due to the cost. Performance of recycled continuous velocity(CV) joints and power steering(PS) gear box as replacement parts was tested and analysed in this study. To examine the durability of the recycled parts, the replaced CV joints and PS gear box after repair were tested and analysed periodically. The results were showed that basic performance of the recycled parts was normal. However the ball cage of CV joints was more frequently damaged than genuine parts. We concluded that a test standard and amendment of related laws for recycled parts is required to get a safe and durable parts.