• ETRI Journal
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• v.32 no.4
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• pp.614-617
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• 2010

For an antenna-in-package (AiP), via holes are used to connect the antenna ground and system ground. In this letter, a dual-frequency AiP with a U-slot embedded in the patch is proposed. By properly arranging three via holes under the non-radiating edge, an AiP with two resonant frequencies is realized. Then a U-slot is embedded in the patch to further improve the bandwidth of the AiP. To validate the proposed design, an AiP with the bandwidth of 4.49% at 2.45 GHz and 6.02% at 5.32 GHz is achieved and fabricated. The measured results agree with the simulated results.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.5 s.120
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• pp.563-568
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• 2007

In this paper, the proposed package antenna, which is meander line structure with short pin, is miniaturized to realize RF-SoP at 900 MHz RFID band. The RFID BGA(Ball Grid Array) chip is put in a cavity of LTCC Layers. The coupling and cross talk, which are happen between BGA chip and proposed package antenna, are reduced by faraday cage, which consists of ground and via fences, is realized to enhance the isolation between BGA chip and antenna. The proposed antenna structure is focused on the package level antenna realization at low frequency band. The novel proposed package antenna size is $13mm{\times}9mm{\times}3.51mm$. The measured resonance frequency is 0.893 GHz. The impedance bandwidth is 9 MHz. The maximum gain of radiation pattern is -2.36 dBi.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.15-22
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• 2013

Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 GHz antennas at Samsung Electronics [1]. The LTCC 60 GHz antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author's best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 GHz measured bandwidth ($S_{11}{\leq}-10$ dB) from 57~66 GHz is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.

• ETRI Journal
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• v.33 no.5
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• pp.802-805
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• 2011

This letter presents a K-band polarization reconfigurable antenna integrated with a silicon radio frequency MEMS switch into the form of a compact package. The proposed antenna can change its state from linear polarization (LP) to circular polarization (CP) by actuating the MEMS switch, which controls the configuration of the coupling ring slot. Low-loss quartz is used for a radiating patch substrate and at the same time for a packaging lid by stacking it onto the MEMS substrate, which can increase the system integrity. The fabricated antenna shows broadband impedance matching and exhibits high axial ratios better than 15 dB in the LP and small axial ratios in the CP, with a minimum value of 0.002 dB at 20.8 GHz in the K-band.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1511_1512
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• 2009

This paper presents a polarization switching antenna integrated with silicon RF MEMS SPDT switches in the form of a package. A low-loss quartz substrate made of SoQ (silicon-on-quartz) bonding is used as a dielectric material of the patch antenna, as well as a packaging lid substrate of RF MEMS switches. The packaging/antenna substrate is bonded with the bottom substrate including feeding lines and RF MEMS switches by BCB adhesive bonding, and RF energy is transmitted from signal lines to antenna by slot coupling. Through this approach, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects, which are all caused from the packaging methods, can be reduced. This structure is expected to be used as a platform for reconfigurable antennas with RF MEMS tunable components. A linear polarization switching antenna operating at 19 GHz is manufactured based on the proposed method, and the fabrication process is carefully described. The s-parameters of the fabricated antenna at each state are measured to evaluate the antenna performance.

• Journal of Korea Society of Industrial Information Systems
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• v.19 no.1
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• pp.19-24
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• 2014

In this work, a compact patch antenna based on a low temperature cofired ceramic (LTCC) has been presented for V-band system-on-package (SoP) applications. In order to integrate it with transceiver block, a waveguide (W/G) to embedded microstrip line (eMSL) vertical transition was designed using slot-fed double stacked patch antennas for easy assembly and wide bandwidth. The $2{\times}2$ patch antenna integrating the transition was designed and fabricated in the 5-layer LTCC dielectrics. The whole size of the fabricated antenna including the $2{\times}2$ patches, transition and W/G was $20{\times}24{\times}5.39mm^3$. The fabricated antenna has achieved a 10 dB impedance bandwidth of 2.45 GHz from 61 to 63.45 GHz.

• Journal of Electrical Engineering and Technology
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• v.13 no.5
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• pp.2004-2010
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• 2018

We propose a small active antenna to receive Global Navigation Satellite System (GNSS) signals, i.e., Global Positioning System (GPS) L1 (1,575MHz) and Russian Global Navigation Satellite System (GLONASS) L1 (1,600 MHz) signals. A two-stage low-noise amplifier (LNA) with more than 27 dB gain is implemented in the bottom layer of a three-layer antenna package. In addition, a hybrid coupler is used to combine signals from pair of proximately coupled orthogonal feeds with $90^{\circ}$ phase difference to achieve the circular polarization (CP) characteristic. Three layers of high permittivity (${\varepsilon}_r=10$) substrates are stacked and effectively integrated to have a small dimension of $64mm{\times}64mm{\times}7.42mm$ (including both circuit and antenna). The reflection coefficient of the fabricated antenna at the target frequency is below -10 dB, the measured antenna gain is above 26 dBic and the measured noise figure is less than 1.4 dB.

• Journal of KSNVE
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• v.4 no.3
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• Journal of Korea Society of Industrial Information Systems
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• v.4 no.4
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• pp.111-116
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• 1999

In this paper, the electromagnetically coupled microstrip dipole antenna by adapting one parasitic metal-strip(dipole) between the microstrip transmission line open end and the radiating microstrip dipole antenna is presented for the bandwidth improvement The microstrip dipole antenna is simulated using Ensemble 51 simulation package The effects of varying several physical parameters, such as the lengths of radiating dipole and parasitic dipole and the width of parasitic dipole are investigated The bandwidth behavior of the 3-layer optimum antenna is compared with that of 2-layer antenna without the parasitic dipole. Experimental result for the obtained broadband performance is presented and discussed.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.2
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• pp.305-311
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• 1999

In this paper, it is designed a new type single layer patch antenna which is printed on a very thin film and separated from the ground-plane by foam with a low permitivity of 1.06 and a high thickness of around quarter wavelength. It allows the use of three-dimensional transition, from one level to another, so that its bandwidth can be enhanced by wideband impedance matching. The radiation pattern, return loss, and VSWR of the antenna are calculated using "IE3D" simulation package, and compared with the experimental results. Experimental results show that the bandwidth is about 65% of center frequency 6.8 GHz, return loss and VSWR are in a fairly good agreement with the calculations.culations.