• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.147-154
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• 2017

This research was conducted to investigate the electrochemical properties of the thin air-formed oxide film-covered AZ31 Mg alloy. Native air-formed oxide films on AZ31 Mg alloy samples were prepared by knife-abrading method and the changes in the electrochemical properties of the air-formed oxide film were investigated in seven different electrolytes containing the following anions $Cl^-$, $F^-$, $SO{_4}^{2-}$, $NO_3{^-}$, $CH_3COO^-$, $CO{_3}^{2-}$, and $PO{_4}^{3-}$. It was observed from open circuit potential (OCP) transients that the potential initially decreased before gradually increasing again in the solutions containing only $CO{_3}^{2-}$ or $PO{_4}^{3-}$ ions, indicating the dissolution or transformation of the native air-formed oxide film into new more protective surface films. The Nyquist plots obtained from electrochemical impedance spectroscopy (EIS) showed that there was growth of new surface films with immersion time on the air-formed oxide film-covered specimens in all the electrolyte. The least resistive surface films were formed in fluoride and sulphate baths whereas the most protective film was formed in phosphate bath. The potentiodynamic polarization curves illustrated that passive behaviour of AZ31 Mg alloy under anodic polarization appears only in $CO{_3}^{2-}$, or $PO{_4}^{3-}$ ions containing solutions and at more than $-0.4V_{Ag/AgCl}$ in $F^-$ ion containing solution.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.78-78
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• 2005

• 한국신재생에너지학회:학술대회논문집
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• 2011.11a
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• pp.84.1-84.1
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• 2011

Typical solid oxide fuel cells (SOFCs) have limited applications because they operate at high temperature due to low ionic conductivity of electrolyte. Thin film solid oxide fuel cell with yttria stabilized zirconia (YSZ) electrolyte is developed to decrease operating temperature. Pt/YSZ/Pt thin film SOFC was fabricated on anodic aluminum oxide (AAO). The crystalline structure of YSZ electrolyte by sputter is heavily depends on the roughness of porous Pt layer, which results in pinholes. To deposit YSZ electrolyte without pinholes and electrical shortage, it is necessary to deposit smoother and denser layer between Pt anode layer and YSZ layer by sputter. Atomic Layer Deposition (ALD) technique is used to deposit pre-YSZ layer, and it improved electrolyte quality. 300nm thick Bi-layered YSZ electrolyte was successfully deposited without electrical shortage.

• Journal of the Korean institute of surface engineering
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• v.49 no.4
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• pp.331-338
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• 2016

In this work, anodic oxidation behavior of AZ31 Mg alloy was studied as a function of $Na_2CO_3$ concentration in electrolyte by voltage-time curves and observation of surface appearances and morphologies after the anodic treatments, using optical microscopy and confocal scanning laser microscopy (CSLM). The voltage-time curves of AZ31 Mg alloy surface and surface appearances after the anodic treatments showed three different regions with $Na_2CO_3$ concentration : region I, below 0.2 M $Na_2CO_3$ where shiny surface with a number of small size pits; region II, between 0.4 M and 0.6 M $Na_2CO_3$ where dark surface with relatively low number of large size burned or dark spots; region III, more than 0.8 M $Na_2CO_3$ where bright surface with or without large size dark spots were obtained. The anodically treated AZ31 Mg alloy surface became significantly brightened with increasing $Na_2CO_3$ concentration from 0.5 M to 0.8 M which was attribute to the formation of denser and smoother surface films. Pits and porous protruding reaction products were found at relatively large size and small size spots, respectively, on the AZ31 Mg alloy surface in low concentration of $Na_2CO_3$ less than 0.2 M. The formation of pits is attributed to the result of repetition of the formation and detachment of porous anodic reaction products. Based on the experimental results obtained in this work, it is concluded that more uniform, denser and smoother surface of AZ31 Mg alloy could be obtained at more than 0.8 M $Na_2CO_3$ concentration if there is no other oxide forming agent.

• Journal of the Korean institute of surface engineering
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• v.50 no.1
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• pp.10-16
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• 2017

This article reports for the first time on the lateral growth of PEO (plasma electrolytic oxidation) films on Al1050 alloy by the application of anodic pulse current in an alkaline electrolyte. Generation of microarcs was observed at the edges initially and then moved towards the central region with PEO treatment time. Disc type PEO film islands with about $20{\mu}m$ diameter were formed first and they grew laterally by the formation of new disc type PEO films at the edge of pre-formed PEO islands. The PEO film islands were found to be interconnected completely and form a continuous PEO film when generation of small size microarcs are terminated at the central part of the specimen, resulting in very smooth surface with low surface roughness less than $1{\mu}m$ of $R_a$. Further PEO treatment after the complete interconnection of PEO films islands showed local thickening of PEO films by vertical growth. It is concluded that very smooth PEO film surface can be obtained by lateral growth mechanism rather than vertical growth of them.

• Journal of the Korean Chemical Society
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• v.29 no.2
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• pp.172-177
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• 1985

The semiconducting property of Sb-doped tin oxide thin film electrode was investigated and the electrocatalytic effect of this electrode for $SO_2$ (or sulfite, bisulfite ions) oxidation reaction was studied under various conditions. The anodic oxidation of $SO_2$ at tin oxide thin film electrode commenced at lower potential with increasing pH, and good electrocatalytic effect was shown of $SO_3^=$ oxidation in basic solution. In the acidic solutions the electrocatalytic effect of platinum-or palladium-incorporated tin oxide electrode was found to be due to the sites of Pt or Pd exposed on the electrode surface. The electrocatalytic effect of tin oxide electrode was distinctive from that of Pt-or Pd-containing electrodes.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Journal of the Korean institute of surface engineering
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• v.53 no.1
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• pp.29-35
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• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• Journal of the Korean institute of surface engineering
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• v.43 no.5
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• pp.248-254
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• 2010

Porous $Al_2O_3$ film can be utilized as template for fabrication of nano-structured materials. Porous anodic alumina layer as template was prepared by anodization of aluminum in oxalic acid, and the pore diameter and barrier-type alumina layer can be controlled for proper anodizing parameter by widening process in $H_3PO_4$ solution. The $SiO_2$ nanodot and Ni nanowire was fabricated using anodic alumina template and their characteristics were investigated using SEM and TEM with EDS. Especially the growth mechanism of $SiO_2$ nanodot in alumina membrane compared with thinning of the alumina barrier layer during anodization was also investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.106-107
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• 2007

We fabricated anodic aluminium oxides (AAO) on Si and sapphire substrates from the electrochemical reactions of thin AI films in an aqueous solution of oxalic acid. The thin AI films have deposited on Si and Sapphire substructure by using E-beam evaporation and thermal evaporation, respectively. The formation of AAO structures has investigated from FE-SEM measurement image and showed randomly distributed phase of nanoholes instead of the periodic lattice of photonic crystals. The AAO structure on sapphire shows the double layers of nanoholes.