• 제목/요약/키워드: anodic bonding

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웨이퍼 레벨 공정이 가능한 2축 수직 콤 구동 방식 마이크로미러 (Wafer-Level Fabrication of a Two-Axis Micromirror Driven by the Vertical Comb Drive)

  • 김민수;유병욱;진주영;전진아;;박재형;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2007년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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    • pp.148-149
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    • 2007
  • We present the design and fabrication prcoess of a two-axis tilting micromirror device driven by the electrostatic vertical comb actuator. A high aspect-ratio comb actuator is fabricated by multiple DRIE process in order to achieve large scan angle. The proposed fabrication process enables a mirror to be fabricated on the wafer-scale. By bonding a double-side polished (DSP) wafer and a silicon-on-insulator (SOI) wafer together, all actuators on the wafer are completely hidden under the reflectors. Nickel lines are embedded on a Pyrex wafer for the electrical access to numerous electrodes of mirrors. An anodic bonding step is implemented to contact electrical lines with ail electrodes on the wafer at a time. The mechanical angle of a fabricated mirror has been measured to be 1.9 degree and 1.6 degree, respectively, in the two orthogonal axes under driving voltages of 100 V. Also, a $8{\times}8$ array of micromirrors with high fill-factor of 70 % is fabricated by the same fabrication process.

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마이크로 전자빔 시스템을 위한 전자광학렌즈의 제작에 의한 나노 패턴 형성 (Nano-scale pattern delineation by fabrication of electron-optical lens for micro E-beam system)

  • 이용재;박정영;전국진;국양
    • 전자공학회논문지D
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    • 제35D권9호
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    • pp.42-47
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    • 1998
  • 현재의 전자빔 묘화의 한계를 극복할 수 있는 마이크로 전자빔 시스템의 전자 광학 렌즈를 제작하였고 전자빔 묘화실험을 통하여 이를 검증하였다. 마이크로머시닝기술을 이용하여 실리콘 전극을 제작하고 이를 양극 접합을 통해 조립하여 다층 전극의 전자 광학 렌즈를 제작하였다. 완성된 전자 광학 소자를 초고진공 챔버에 장착하여, STM(Scanning Tunneling Microscope) 팁에서 방출된 전자빔의 focusing 특성을 관찰하였으며 전자를 집속하여 리소그라피를 수행하였다. E-beam 감광막은 PMMA(Poly-methylmethacrylate)를 사용하였고 0.13㎛의 패턴을 형성시킬 수 있었다.

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마이크로 적층형 압전밸브의 제작과 그 특성 (Fabrication of a Micro Multilayer Piezo Actuator Valve and Its Characteristics)

  • 정귀상;김재민;조상복
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2005년도 추계종합학술대회
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    • pp.913-916
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    • 2005
  • This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}pa$. $m^3/cm^2$.

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마이크로 전자렌즈의 광학적 정렬과 조립 (Optical Assembly and Fabrication of a Micro-electron Column)

  • 박종선;장원권;김호섭
    • 한국광학회지
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    • 제17권4호
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    • pp.354-358
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    • 2006
  • 적층으로 구성되는 초소형 전자렌즈의 실리콘 렌즈와 절연체인 파이렉스는 접합과 정렬을 동시에 수행하여야 한다. 이를 위한 방법으로 회절을 이용한 정렬과 레이저 접합을 이용하였으며, source 렌즈와 Einzel 렌즈의 정렬오차는 가장 큰 개구를 기준으로 최대 $\pm$4% 이내에서 이루어졌다. 정렬 조건과 레이저 접합 조건을 제시하였으며, 접합을 견고히 하기 위한 양극 접합 방식을 기술하였다. 전류영상화를 통해 선폭이 9 $\mu$m인 Cu grid를 시험한 결과 완성된 전자렌즈는 감속모드보다 가속모드에서 분해능이 좋았으며, 작은 개구를 가진 렌즈의 정밀한 정렬과 조합으로 높은 분해능을 믿을 수 있었다.

마이크로 정량펌프의 유동해석과 작동성능 평가 (The Flow Analysis and Evaluation of the Peristaltic Micropump)

  • 박대섭;최종필;김병희;장인배;김헌영
    • 한국정밀공학회지
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    • 제21권2호
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    • pp.195-202
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    • 2004
  • This paper presents the fabrication and evaluation of mechanical behavior for a peristaltic micropump by flow simulation. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, the middle plate, the upper plate and the tube that connects inlet and outlet of the pump. The lower plate includes the channel and the chamber, and the plain middle plate are made of glass and actuated by the piezoelectric translator. Channels and a chamber on the lower plate are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The upper plate does the roll of a pump cover and has inlet/outlet/electric holes. Three plates are laminated by the aligner and bonded by the anodic bonding process. Flow simulation is performed using error-reduced finite volume method (FVM). As results of the flow simulation and experiments, the single chamber pump has severe flow problems, such as a backflow and large fluctuation of a flow rate. It is proved that the double-chamber micropump proposed in this paper can reduce the drawback of the single-chamber one.

패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선 (Effects of Package Induced Stress on MEMS Device and Its Improvements)

  • 좌성훈;조용철;이문철
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.165-172
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    • 2005
  • In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

MEMS용 적층형 압전밸브의 제작 (Fabrication of MCA Valve For MEMS)

  • 김재민;윤재영;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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    • pp.129-132
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    • 2004
  • This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

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적층형 세라믹 엑추에이터를 이용한 MEMS용 압전밸브의 제작 및 특성 (Fabrication and Characteristics of a Piezoelectric Valve for MEMS using a Multilayer Ceramic Actuator)

  • 정귀상;김재민;윤석진
    • 한국전기전자재료학회논문지
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    • 제17권5호
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    • pp.515-520
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    • 2004
  • We report on the development of a Piezoelectric valvc that is designed to have a high reliability for fluid control systems, such as mass flow control, transportation and chemical analysis. The valve was fabricated using a MCA(multilayer ceramic actuator), which has a low consumption power, high resolution and accurate control. The fabricated valve is composed of MCA, a valve actuator die and an seat die. The design of the actuator dic was done by FEM(finite element method) modeling, respectively. And, the valve seat die with 6 trenches was made. and the actuator die, which possible to optimize control to MCA, was fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the scat/actuator die structure. PDMS(poly dimethylsiloxane) sealing pad was fabricated to minimize a leak-rate. It was also bonded to scat die and stainless steel package. The flow rate was 9.13 sccm at a supplied voltage of 100 V with a 50 % duty ratio and non-linearity was 2.24 % FS. From these results, the fabricated MCA valve is suitable for a variety of flow control equipments, a medical bio-system, semiconductor fabrication process, automobile and air transportation industry with low cost, batch recess and mass production.

적층형 압전밸브의 설계, 제작 및 특성 (Design, Fabrication and Characteristics of a MCA Valve)

  • 정귀상;김재민;윤석진;정순종;송재성
    • 센서학회지
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    • 제13권3호
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    • pp.230-235
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    • 2004
  • This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 seem at a supplied voltage of 100 V with a 50% duty cycle, maximum non-linearity was 2.24% FS and leak rate was $3.03{\times}10^{-8}pa{\codt}m^{3}/cm^{2}$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

Cu-Cr합금 박막의 구리 전기도금을 위한 전처리 및 에칭 특성에 관한 연구 (Pretreatment for Cu electroplating and Etching Property of Cu-Cr Film)

  • 김남석;강탁;윤일표;박용수
    • 한국표면공학회지
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    • 제26권3호
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    • pp.149-157
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    • 1993
  • In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like form due to the surface Cr oxides on the Cu-Cr film. By means of activating the Cu-Cr film with the oxalic acid and phosphoric acid, the Cu film with the improved adhesion could be coated on the Cu-Cr sputtered film in CuSO4 solution. The etching rate was compared with increasing the Cr content of the sputtered Cu-Cr film, and anodic polarization curve in FeCl3 solution was investigated. With increasing the Cr content, the etching rate was reduced. The clean etching cross section could be obtained with increasing the concentration of FeCl3 solution. But above the 13 w/o Cr content, Cu-Cr sputtered film could not bed etched cleanly only with FeCl3 solution and additives were needed.

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