• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.466-467
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• 2005

Al doped zinc oxide films (ZnO:Al) were deposited on glass substrate by RF magnetron sputtering from a ZnO target mixed with 2 wt% $Al_2O_3$. The as-deposited ZnO:Al films were rapid-thermal annealed. Electrical properties and structural evolution of the films, as annealed by rapid thermal process (RTP), were studied and compared with the films annealed by conventional annealing process. RTP, the (002) peak intensity increases and the electrical resistivity decreases by 20%, after RT annealing. The effects of RT annealing on the structural evolution and electrical properties of RF sputtered films were further discussed and compared also with the films deposited by DC magnetron sputtering.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.469-470
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• 2006

The purpose of this research was to investigate and to find out the optimal annealing condition to mold an aspheric glass to be used for mobile phone module having 2 megapixel and $2.5{\times}$ zoom. Taking annealing rate and re-press temperature after molding as molding variables under the identical molding temperature and pressure, a glass lens was molded. And, Form Accuracy, Lens Thickness, Refractive Index, and Modulation Transfer Function(MTF) were measured in order to observe characteristics of molded lens, and then optimal annealing conditions were determined based on the resulting data. Properties of lens molded under the optimal conditions revealed Form Accuracy[PV] $0.2047\;{\mu}m$ in aspheric surface, and $0.2229\;{\mu}m$ in plane, and MTF value was 30.3 % under 80 lp/mm.

• Macromolecular Research
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• v.11 no.1
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• pp.62-68
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• 2003

Thermotropic liquid crystalline polymer (TLCP)/poly(ethylene 2,6-naphthalate) (PEN)/poly(ethylene terephthalate) (PET) ternary blends were prepared by melt blending, and were melt-spun to fibers at various spinning speeds in an effort to improve fiber performance and processability. Structure and property relationship of TLCP/PEN/PET ternary blend fibers and effects of annealing on those were investigated. The mechanical properties of ternary blend fibers could be significantly improved by annealing, which were attributed to the development of more ordered crystallites and the formation of more perfect crystalline structures. TLCP/PEN/PET ternary blend fibers that annealed at 18$0^{\circ}C$ for 2 h, exhibited the highest values of tensile strength and modulus. The double melting behaviors observed in the annealed ternary blend fibers depended on annealing temperature and time, which might be caused by different lamellae thickness distribution as a result of the melting-reorganization process during the DSC scans.

• Korean Journal of Materials Research
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• v.18 no.10
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• pp.552-556
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• 2008

Modified thermal annealing was applied to the activation of the polycrystalline silicon films doped as p-type through implantation of $B_2H_6$. The statistical design of experiments was successfully employed to investigate the effect of rapid thermal annealing on activation of polycrystalline Si doped as p-type. In this design, the input variables are furnace temperature, power of halogen lamps, and alternating magnetic field. The degree of ion activation was evaluated as a function of processing variables, using Hall effect measurements and Raman spectroscopy. The main effects were estimated to be furnace temperature and RTA power in increasing conductivity, explained by recrystallization of doped ions and change of an amorphous Si into a crystalline Si lattice. The ion activation using rapid thermal annealing is proven to be a highly efficient process in low temperature polycrystalline Si technology.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.236-237
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• 2012

ZnO nanorods were grown on R-plane sapphire substrates with the seed layers annealed at different temperature. The effects of annealing temperature for the seed layers on the properties of the ZnO nanorods were investigated by scanning electron microscopy, X-ray diffraction, UV-visible spectroscopy, and photoluminescence. For the as-prepared seed layers, the ZnO nanorods and the ZnO nanosheets were observed. Only the ZnO nanorods were grown as the annealing temperature was above $700^{\circ}C$. The optical transmittance in the UV region was almost zero while that in the visible region was gradually increased as the annealing temperature increased to $700^{\circ}C$. The optical band gap of the ZnO nanorods was increased as the annealing temperature increased to $700^{\circ}C$. In the visible region, the refractive index was decreased with increasing the wavelength, and the extinction coefficient was decreased as the annealing temperature increased to $700^{\circ}C$. The non-linear exciton radiative life time of the FX emission peak was established by cubic equation. The values of Varshni's empirical equation fitting parameters were ${\alpha}=4{\times}10^{-3}eV/K$, ${\beta}=1{\times}10^4K$, and $E_g(0)=3.335eV$ and the activation energy was found to be about 94.6 meV.

• Korean Journal of Materials Research
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• v.13 no.12
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• pp.801-805
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• 2003

To explore the annealing temperature dependence of dielectric properties $Ta_2$$O_{5}$ thin films were prepared by MOCVD(metal-organic chemical vapor deposition) and MOD(metal-organic decomposition). The $Ta_2$$O_{5}$thin films fabricated MOCVD and MOD were annealed in $O_2$at temperature between 600 and 90$0^{\circ}C$. The measured dielectric constant of both films at 100 KHz was the highest value at $650^{\circ}C$ and decreased with increasing annealing temperature above $650^{\circ}C$. Plane-view SEM image showed that the boundary seems to be crack broke out with increasing annealing temperature. It was confirmed that outbreak of boundary influenced a decrease of dielectric constant with increasing annealing temperature. The leakage current density increased with increasing annealing temperature.

• Korean Journal of Metals and Materials
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• v.48 no.1
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• pp.77-84
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• 2010

Annealing characteristics of an oxygen free copper (OFC) processed by differential speed rolling (DSR) were investigated in detail. An OFC sample with a thickness of hum was rolled to 35% reduction at ambient temperature without lubrication, varying the differential speed ratio from 1.0:1 to 2.2:1, and then annealed for 0.5h at various temperatures from 100 to $400^{\circ}C$. Different recrystallization behavior was observed depending on the differential speed ratio, especially in the case of annealing at $200^{\circ}C$ Complete recrystallization occurred in the specimens annealed at temperatures above $250^{\circ}C$ regardless of the differential ratios. The hardness distribution in the thickness direction of the rolled OFC sheets varied depending on the differential speed ratios. These annealing characteristics were explained by the magnitude of shear strain introduced during rolling.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.478-482
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• 1995

The iron-based Metglas 2605S3A amorphous alloy ribbons are annealed at $435^{\circ}C$ for various periods from 5 to 210 min, and the effect of annealing is investigated on the dc magnetic properties of the ribbon. Typical square-type hysteresis loops are observed for the ribbons annealed fo 5 min, indicative of the nearly complete removal of residual stresses which are produced during melt-quenching. As the annealing time increases, the coercivity increases and the shape of hysteresis loops transforms to round type and finally to sheared one at the longest annealing time of 210 min. These results may be explained by the formation of clusters with chemical shortorder and very fine crystallites (at the annealing time of 210 min), and the diffusion-induced stresses during the formation of the clusters. For the samples annealed for 5 min, very good dc properties of the squareness ratio, coercivity and maximum permeability are observed, but, rather unexpectedly, the initial permeability is found to be very low. These results are considered to be due to a simple domain structure consisting of very small number of $^{\circ}$ domains.

• Korean Journal of Metals and Materials
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• v.46 no.9
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• pp.563-571
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• 2008

The influence of annealing treatment on dynamic deformation behavior of ultra-fine grained aluminum alloys was investigated in this study. After equal-channel angular pressing at $200^{\circ}C$, most of the grains were considerably reduced to nearly equiaxed grains of $0.3{\mu}m$ in size. With an increment of various annealing treatments for 1 hour, resultant microstructures were found to be fairly stable at temperatures up to $200^{\circ}C$, suggesting that static recovery would be dominantly operative, whereas grain growth was pronounced above $250^{\circ}C$. The tensile test results showed that yield and ultimate tensile strengths decreased, but elongation-to-failure and strain hardening rate increased with increasing annealing temperature. The dynamic deformation behavior retrieved with a series of torsional tests was explored with respect to annealed microstructures. Such mechanical response was analyzed in relation to resultant microstructure and fracture mode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.3
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• pp.246-254
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• 2022

Localized heat can be generated using electrically conductive word-lines built into a 3D NAND flash memory string. The heat anneals the gate dielectric layer and improves the endurance and retention characteristics of memory cells. However, even though the electro-thermal annealing can improve the memory operation, studies to investigate material failures resulting from electro-thermal stress have not been reported yet. In this context, this paper investigated how applying electro-thermal annealing of 3D NAND affected mechanical stability. Hot-spots, which are expected to be mechanically damaged during the electro-thermal annealing, can be determined based on understanding material characteristics such as thermal expansion, thermal conductivity, and electrical conductivity. Finally, several guidelines for improving mechanical stability are provided in terms of bias configuration as well as alternative materials.