• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.12
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• pp.1003-1010
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• 2000

Thin films of vanadium oxide(VOx) have been deposited by r.f. magnetron sputtering from V$_2$O$\_$5/ target in gas mixture of argon and oxygen. Crystal structure, surface morphology, chemical composition, molecular structure and optical properites of films in-situ annealed in O$_2$ambient with various heat-treatment conditions are characterized through XRD, SEM, AES, RBS, RTIR and optical absorption measurements. The films annealed below 200$\^{C}$ are amorphous, and those annealed above 300$\^{C}$ are polycrystalline. The growth of grains and the transition of vanadium oxide into the higher oxide have been observed with increasing the annealing temperature and time. The increase of O/V ratio with increasing the annealing temperature and time is attributed to the diffusion of oxygen and the partial filling of oxygen vacancies. It is observed that the oxygen atoms located on the V-O plane of V$_2$O$\_$5/ layer participate more readily in the oxidation process. Also indirect and direct optical band gaps were increased with increasing the annealing temperature and time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.1
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• pp.94-100
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• 2004

We fabricated textured Ag substrates for YBCO coated conductor and evaluated the effects of annealing temperature on microstructural evolution, texture formation, and surface morphology. Ag ingot, as an initial specimen, was prepared by plasma arc melting(PAM). Subsequently, the ingot was cold rolled to 100 ${\mu}{\textrm}{m}$ thick tape and annealed at temperatures of 600-80$0^{\circ}C$. The texture and surface morphology of the substrate were characterized by pole-figure and atomic force microscopy(AFM) profile, respectively. It was observed that a strong ｛110｝<110> texture was formed after annealing and its symmetry improved as annealing temperature increased. The full-width at half-maximum(FWHM) of ｛110｝<110> pole was as sharp as 10$^{\circ}$ for the substrate annealed at 80$0^{\circ}C$. On the other hand, it was found that the thermal grooving and faceting became remarkable as annealing temperature increased : root-mean-square(RMS) roughness of the substrate annealed at 80$0^{\circ}C$ was 39.2 nm. The substrate of strong texture and smooth surface, fabricated in our study, is considered to be suitable for use as a substrate for the epitaxial deposition of superconductor film.

• Journal of Korean Society of Steel Construction
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• v.12 no.6
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• pp.629-638
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• 2000

With the positive features of simulated annealing algorithms such as simplicity of the algorithm and the possibility of finding global optimum solution, SA algorithm has been widely applied to structural optimization problems. However, the algorithms are far from practical applications in structural design or optimization of building structures due to requirement of a large number of iterations and dependency on cooling schedule and stopping criteria. In this paper, with the modification of annealing process and stopping criteria, a MSA algorithm is presented in the form of two phase annealing process for optimal seismic design of braced structures. The performance of the proposed algorithm has been illustrated in detail.

• Korean Journal of Materials Research
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• v.13 no.7
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• pp.442-446
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• 2003

Tin dioxide ($SnO _2$) thin films were deposited at $375^{\circ}C$ on alumina substrate by metal-organic chemical vapor deposition. A few hillocks like a cauliflower were observed and the number of hillock on thin film surface increased with annealing temperature in air atmosphere. The oxygen content and the binding energy during air annealing at$ 500^{\circ}C$ came to close the stoichiometric $SnO_2$. The cauliflower hillocks seem to be the result of the continuous migration of the tiny grains to release the stress of an expanded grain. Sensitivity of CO gas depended on annealing temperature and increased with increasing annealing temperature.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.179-184
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• 1995

Phosphorous was deped in silicon thin films by Ion Mass Doping and Changes in the electrical resistance with respect tko heat treatments were investigated. SOI(Silicon On Insulator) thin films which contain few grain boundaries prepared by ZMR(Zone Melting Recrystallization) of polysilicon films, polysilicon films which have about 1500 $A^{\rarw}$ of grain size prepared by LPCVD at 625.deg. C, and amorphous silicon thin films prepared by LPCVD at low temperature were used as substrates and thermal behavior of phosphorous after RTA(Rapid Thermal Annealing) and furnace annealing was carefully studied. Amorphous thin films showed about 10$^{6}$ .OMEGA./ㅁbefore any heat treatment, while polycrystalline and SOI films about 10$^{3}$.OMEGA./¤. All these films, however, showed about 10.OMEGA./ㅁafter furnace annealing at 700.deg. C for 3hrs and RTA showed about the same trend. Films with grain boundaries showed a certain range of heat treatment which rendered increase of the electrical resistance upon annealing, which could not be observed in amorphous films and segregation of doped phosphorous by diffusion with annealing was thought to be responsible for this abnormal behavior.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.7
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• pp.63-68
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• 1994

The Curie point annealing effects on electrophysical phenomena at the magnetized strontium ferrite(SrO$\cdot$ 6$Fe_{2}O_{3}$) ceramics electrode/10$^{-3}$M KC1 aqueous electrolyte interfaces have been studied using cyclic voltammetric, normal pulse voltammetric, chronocoulometric, and electrochemical impedance techiques. After the Curie point annealing the magnetic flux densities of the speciment was decreased from 900-1100 gauss to 1-2 gauss, i.e. demagnetized. The real component of interfacial impedance was decreased from 7280-7320 ohm to 790-830 ohm. The adsorption and the charge on the electrical double layer was increased from 0 $\mu$C to -58 $\mu$C. The Curie point annealing and the related electrical double layer effect can influence not only the electrophysical properties of the strontium ferrite ceramics electrode itself but also the electrochemical phenomena at the electrode interface. This experimental results suggest that the Curie point annealing and the related electrical double layer effect can be applied to electrochemical magnetic sensors.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.23-30
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• 1993

Hydrogenation on the top gate and bottom gate Poly-Si TET's was performed by using Nh$_{3}$ plasma and annealing SiN film deposited by PECVD and then the electric characteristics on Poly-Si TET were investigated. As the time of NA$_{3}$ plasma treatment increaes, on/off current ratio gradually increases and the swing value decreases. The trap densities of graim boundaries in Poly-Si decrease very much during the inital 20min of hydrogenation time, and the decreasing scale becomes smaller after 20 min. The electric characteristics of the top gate TFT are better than those of the bottom gate TFT, it is considered due to the defects at the interface between the Poly-Si and the underlayer, SiO$_{2}$. After NH$_{3}$ plasma was treated for 2 hours for the top gate TFT, as the aging time atroon temperature increases on current was not scacely changed and off current decreases more than 1 order. Gate current density recovers to original value after the aging treatment for 8 days and then the electric characteristics are finally improved. It is suggested that the degraded characteristics of gate oxide are improved, from the variations of C-V characteristics with aging time. For the hydrogenation of isothermal and isochronal annealing SiN film deposited by PECVD, the characteristics of Poly-Si TFT are improved with increasing annealing temperature and are not largely changed with increasing annealing time. This results is good in agreement with the hydrogen reduction in Sin film as variations of annealing temperature and time.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.9
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• pp.78-88
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• 1994

The electrical properties of TiM/TiSi$_{2}$ bilayer formed by rapid thermal anneal in NH$_{3}$ ambient after the Ti film is deposited on silicon cubstrate are investigated. N$^{+}$ contact resistance slightly increases with increasing annealing temperature with P$^{+}$ contact resistance decreases. The contact resistance of N$^{+}$ contance was less than 24[.OMEGA.] but P$^{+}$ thatn that of N$^{+}$ contact but the leakage current indicates degradation of the contact at high annealing temperature for both N$^{+}$ and contacts. The leakage current of N$^{+}$ Junction was less than 0.06[fA/${\mu}m^{2}$] but P$^{+}$ contact was 0.11-0.15[fA/${\mu}m^{2}$]. The junction breakdown voltage for N$^{+}$ junction remains contant with increasing annealing temperature while P$^{+}$ junction slightly decreases. The Electrical properties of a two step annealing are better than that of one step annealing. The Tin/TiSi$_{2}$ bilayer formed by RTA in NH$_{3}$ ambient reveals good electrical properties to be applicable at ULSI contact.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.342.1-342.1
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• 2014

The electrical, optical and structural properties of Ti doped $In_2O_3$ (TIO) ohmic contacts to p-type GaN were investigated using linear facing target sputtering (LFTS) system. Sheet resistance and resistivity of TIO films are decreased with increasing rapid thermal annealing (RTA) temperature. Although the $400^{\circ}C$ and $500^{\circ}C$ annealed samples showed rectifying behavior, the $600^{\circ}C$ and $700^{\circ}C$ annealed samples showed linear I-V characteristics indicative of the formation of an ohmic contact between TIO and p-GaN. The annealing of the contact at $700^{\circ}C$ resulted in the lowest specific contact resistivity of $9.5{\times}10^{-4}{\Omega}cm^2$. Based on XPS depth profiling and synchrotron X-ray scattering analysis, we suggested a possible mechanism to explain the annealing dependence of the properties of TIO layer on rapid thermal annealing temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.212-213
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• 2005

In this study, in order to develop low temperature sintering piezoelectric actuator, $Pb_{0.985}Bi_{0.01}(Mg_{1/2}W_{1/2})_{0.03}(Ni_{1/3}Nb_{2/3})_{0.13}(Zr_{0.50},Ti_{0.50})_{0.84}$ (PMW-PNN-PZT) ceramic systems were fabricated using $CaCO_3-Li_2CO_3$, sintering aid through a post-annealing process. The sinterability of PMW-PNN-PZT ceranics was remarkably enhanced by liquid phase sintering of $CaCO_3$ and $Li_2CO_3$. But, it was confimed form the X-ray diffraction pattern that the secondary phase along grain boundaries, deteriorated the piezoelectric properties. The secondary phase along grain boundaries was significantly removed by annealing after sintering. The 0.2wt% $Li_2CO_3$-0.25wt% $CaCO_3$-added PMW-PNN-PZT ceramics post-annealed at 900$^{\circ}C$ for 90min exhibited the excellent electromechanical coupling factor($k_p$) of 63.3% and piezoelectric constant($d_{33}$) of 452pC/N, respectively, for multilayer piezoelectricactuatorapplication.