• Journal of the Korean Society for Precision Engineering
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• v.5 no.1
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• pp.50-62
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• 1988

An experimental investigation of the machining characteristics of compact vermicular cast iron whose matrix were formulated under two kinds of annealing conditions has been conducted. The various characteristics of the machinability of CA cast iron depending upon its matrix and cutting condition have been obtained from the experiment. The results are as follow. As depth of cut increases, the shear stress slightly decreases in order $P_1, \P_2, \P_3$ which are classified by ferrite matrix of CV cast iron. As depth of cut increases, the normal stress increases, and annealing effect in heavy cutting is smaller than that in light cutting. The cutting energy slightly decreases, as depth of cut increases and the effect of annealing on cutting energy in light cutting is higher than that in heavy cutting. The cutting equation in this study are as follow. $P_1\:\2{\phi}\ + \1.49({\beta} - {\alpha} )=84^{\circ}$ $P_2\:\2{\phi}\ + \1.36({\beta} - {\alpha} )=82^{\circ}$ $P_3\:\2{\phi}\ + \1.34({\beta} - {\alpha} )=79^{\circ}$ Machining constants in this study for $P_1, P_2, P_3$give $74^{\circ} , 66^{\circ}, 61^{\circ}$ Tool wear increases as depth of cut increases, and decreases as ferrit matrix increases.

• Journal of the Korean Society for Heat Treatment
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• v.30 no.1
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• pp.1-5
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• 2017

A 100 nm thick $SnO_2$ thin films were prepared by radio frequency magnetron sputtering on glass substrates and then annealed in nitrogen atmosphere for 30 minutes at 100, 200, and $300^{\circ}C$, respectively. While the visible light transmittance and electrical resistivity of as deposited $SnO_2$ films were 81.8% and $1.5{\times}10^{-2}{\Omega}cm$, respectively, the films annealed at $200^{\circ}C$ show the increased optical transmittance of 82.8% and the electrical resistivity also decreased as low as $4.3{\times}10^{-3}{\Omega}cm$. From the observed results, it is concluded that post-deposition annealing in nitrogen atmosphere at $200^{\circ}C$ is an attractive condition to optimize the optical and electrical properties of $SnO_2$ thin films for the various display device applications.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.75-78
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• 2017

The $CO_2$ gas responsibility of $SnO_2$ thin films was researched with various annealing temperatures. $SnO_2$ was prepared on n-type Si substrate by RF magnetron sputtering system and annealed in a vacuum condition. The bonding structure of $SnO_2$ was changed from amorphous to crystal structure with increasing the annealing temperature, and the content of oxygen vacancy was researched the highest of the annealed at $60^{\circ}C$. The $SnO_2$ annealed at $60^{\circ}C$ had the characteristics of the highest capacitance. The special properties of $CO_2$ gas responsibility was found at the $SnO_2$ thin film annealed at $60^{\circ}C$ with amorphous structure because of the combination with the oxygen vacancies and $CO_2$ gases changed the resistivity. The amorphous structure enhanced the responsibility at the $SnO_2$ surface and the conductivity of $SnO_2$ thin film.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.98-102
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• 2021

GaOOH is obtained via hydrothermal synthesis procedure. The formed GaOOH is turned into α-Ga₂O₃ at 500℃ annealing. As the annealing temperatures increase the α-Ga₂O₃ is in part turned into β-Ga₂O₃ and fully turned into β-Ga₂O₃ after 1100℃. XPS and PL results reveal that heterojunction interface between α-Ga₂O₃ and β-Ga₂O₃ become maxim at 500℃ annealing condition, which result in the highest photocatalytic activity. The presence of heterojunction interface slows down the recombination process by separating photogenerated electron-hole pairs and thereby enhance the overall photocatalytic activity.

• Transactions of Materials Processing
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• v.31 no.4
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.4
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• pp.230-236
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• 2023

The current study deals with the effect of cooling rate and temperature for annealing on medium-carbon Cr-Mo alloy steel, especially for cold heading quality wire rod, to derive the optimum micro-structures for plastic deformation. This is to optimize the spheroidization heat treatment conditions for softening the material. Heat treatment was performed under seven different conditions at a temperature between A_c1 and A_c3, mostly within 720℃ to 760℃, and the main variables at this time were temperature, retention time and cooling rate. Microstructure and phase changes were observed for each test condition, and it was confirmed that they were greatly affected by the cooling rate. It was also confirmed that the cooling rate was changed in the range of 0.1℃/min to 5℃/min and affected by phase deformation and spheroidization fraction. The larger the spheroidization fraction, the lower the hardness, which is associated with the increasing connection of ferrite phases.

• Journal of the Semiconductor & Display Technology
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• v.23 no.1
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• pp.88-91
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• 2024

The europium doped yttrium oxide (Y₂O₃:Eu³⁺) thin film was formed on a Si substrate by the conventional spin-coating process followed by rapid thermal annealing (RTA) treatment. The spinning profiles such as rotation speed, acceleration and holding times were controlled during the spin-coating process for the best condition of the Y₂O₃:Eu³⁺ thin film. The RTA treatment was conducted for several temperature in order to crystallize the spin coated film. The Y₂O₃:Eu³⁺ thin film presented best performance in the conditions of 4000 rpm, 30 s and 10 s of rotation speed, acceleration time and holding time, respectively, at a fixed RTA temperature of 900 ℃.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.59-59
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• 2000

Recently low resistance of bus line is required for large screen size TFT-LCD panels. As a result, lower resistance Al-alloy is currently reviewed extensively. The resistivity is required smaller than 10 $\mu$$\Omega$cm. In this paper, Al-Nd thin film were deposited on glass substrates by D.C. magnetron sputtering system under various condition. Its properties were characterized by SEM, AFM, XRD, 4-ping-probe. The optimal condition of Al-Nd was 12$0^{\circ}C$, 125W, 0.4Pa, 30sccm(Ar) and 35$0^{\circ}C$, 20min. annealing. At that condition the resistivity of Al-Nd(2wt.%) was about 4 $\mu$$\Omega$cm. The minimum contact resistance of ITO/Nd was about 110$\mu$$\Omega$cm in the condition of 30$0^{\circ}C$, Ar 30 sccm. O2.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1806-1808
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• 1999

The electrical and physical characteristics of MgO and Pt thin-films on Si substrate, deposited by r.f magnetron sputtering. It were analyzed with annealing condition($1000^{\circ}C$ for 120 min) by four point probe, a-step, SEM and XRD. Until $1000^{\circ}C$ of annealing temperature, MgO medium layer had the properties of improving Pt adhesion to $SiO_2$ and insulation without chemical reaction to Pt thin-films and the resistivity of Pt thin-films was improved. In the analysis of properties of Pt-RTD, TCR value had $3927ppm/^{\circ}C$ and liner in the temperature range of room temperature ${\sim}400^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.37 no.5
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• pp.425-431
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• 2000

Cobalt ferrite thin films on Corming glass substrate were fabricated by a sol-gel method. Cobalt ferrite thin films with the grain size of 20-35 nm and thickness of 50nm were obtained. Rapid thermal annealing (RTA) and Annealing processes were adopted for comparison of characteristics of the films. Coercivity values were changed with thermal condition and magnetization values were increased as a function of soaking time. With prolonged soaking time, however, it was decreased because of the diffusion of cations from the glass substrate. The RTA process in preparation of cobalt ferrite thin film was the effective way to prevent and to form a single spinel phase in reduced soaking time. The film heated at 600$^{\circ}C$ for 30 minutes by RTA had coercivity of 2,600 Oe, saturation magnetization 460 emu/㎤, and Mr$.$$\delta$ of 1.43 memu/$\textrm{cm}^2$.