• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.39-44
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• 2015

We investigated the effect of CNT-Ag composite pad on the contact resistance of flip-chip joints, which were formed by flip-chip bonding of Cu/Au chip bumps to Cu substrate metallization using anisotropic conductive adhesive. Lower contact resistances were obtained for the flip-chip joints which contained the CNT-Ag composite pad than the joints without the CNT-Ag composite pad. While the flip-chip joints with the CNT-Ag composite pad exhibited average contact resistances of $164m{\Omega}$, $141m{\Omega}$, and $132m{\Omega}$ at bonding pressures of 25 MPa, 50 MPa, and 100 MPa, the flip-chip joints without the CNT-Ag composite pad had an average contact resistance of $200m{\Omega}$, $150m{\Omega}$, and $140m{\Omega}$ at each bonding pressure.

• Journal of the Korean GEO-environmental Society
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• v.2 no.3
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• pp.81-88
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• 2001

The behavior of porous medium is modeled by linear thermoporoelastic behavior, linear poroviscoelastic behavior, poroplastic behavior, and poroviscoplastic behavior, etc. The behavior has, in general, a complicated aspect which makes a mechanical description of the problem with time. Constitutive modeling for deformation behavior of porous medium with coupling effects is needed since there is interaction between the constituents in pores with a relative velocity to each other. In this work, it is explained 3-dimensional behavior depending on degree of saturation for porous medium composed of homogeneous, isotropic materials. It is obtained the governing equations based on continuum porous mechanics. In addition, it is developed constitutive model which can be understood of behavior for porous medium which can be understood, analysed behavior of porous medium. It can be accomplished exact analysis and prediction of behavior in porous medium. The behavior for porous medium is analysed exactly, and the prediction of deformation behavior is accomplished. Consequently, it will be basis to analyze 3-dimensional behavior in municipal solid waste landfill, and the practical using of porous medium ground which are composed of nonhomogeneous, anisotropic materials can be done widely.

• Korean Journal of Materials Research
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• v.4 no.4
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• pp.445-452
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• 1994

Three-axial deformation behavior of the Zircaloy cladding tube under the irradiation condition of the fuel in pressurized water reactor can be analyzed by the anisotropy in the creep and the irra- diation growth, which depends on the texture parameter. A methodology to evaluate the impact of the anisotropic creep and irradiation growth on the strain in each axial direction of the cladding tube has been proposed. Based on the measured strains after irradiation and predicted ones with the help of a fuel performance analysis code, it is found that a tangential strain of the cladding tube is caused mainly by the creep, whereas a axial strain of the cladding is caused mainly by the irradiation growth but with a considerable contribution of the creep at low irradiation.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.4
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• pp.164-168
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• 2011

Etch selectivities of mask materials to ZnO and $SnO_2$ films were studied in $BCl_3$/Ar and $CF_4$/Ar inductively coupled plasmas for fabrication of nanostructure-based gas sensing layer with high aspect ratios. In $25BCl_3$/10Ar ICP discharges, selectivities of 5.1~6.1 were obtained for ZnO over Ni while no practical selectivity was obtained for ZnO over Al. High selectivities of 7 ~ 17 for ZnO over Ni were produced in $25CF_4$/10Ar mixtures. $SnO_2$ showed much higher etch rates than Ni and a maximum selectivity of 67 was observed for $SnO_2$ over Ni.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.17-23
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• 2013

As a basic research to develop stretchable electronic packaging technology, CNT-Ag composite pads were formed on top of Cu/Sn chip bumps and flip-chip bonded using anisotropic conductive adhesive. Average contact resistances of the flip-chip joints were measured with respect to bonding pressure and presence of the CNT-Ag composite pads. When Cu/Sn chip bumps with CNT-Ag composite pads were flip-chip bonded to substrate Cu pads at 25MPa or 50 MPa, contact resistance was too high to measure. The specimen processed by flip-chip bonding the Cu/Sn chip bumps with CNT-Ag composite pads to the substrate Cu pads exhibited an average contact resistance of $213m{\Omega}$. On the other hand, the flip-chip specimens processed by bonding Cu/Sn chip bumps without CNT-Ag composite pads to substrate Cu pads at 25MPa, 50MPa, and 100MPa exhibited average contact resistances of $370m{\Omega}$, $372m{\Omega}$, and $112m{\Omega}$, respectively.

• Tunnel and Underground Space
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• v.8 no.3
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• pp.226-233
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• 1998

Microcracks in rock materials, whether natural or induced, provide useful information on the engineering performance of in situ rockmasses. A population of preferentially oriented microcracks has observable effects on the physical properties of a rockmass, but their effects may not be evident if the rock material is highly anisotropic due to other causes. An experimental program was undertaken to investigate the effect of rock fabrics on the physical properties of rock materials. In this study, anisotropy in the circumferential wave velocity and the direction of induced fractures under axial point loading were measured. Rock specimens (NX-size) of the leucocractic Pocheon granite were cored from rock blocks, retaining the relative directions of each specimen. Another set of specimens was prepared from the rock cores of the same meterial, obtained in the field. The master orientation line (MOL) was set to be the representative direction of the microcracks in the specimen. Variation of the circumferential wave velocity of each specimen was then measured along the core, keeping the MOL as reference. The direction of the minimum wave velocity was nearly perpendicular to the direction of the MOL. Coring of smaller-sized (EX-size), concentric specimens from the NX specimens were then followed, and axial point loading was applied. The direction of induced fractures due to axial point loading was closely related to the MOL direction, confirming the prior test result.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.65-65
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• 1999

Dry etching technique provides more easy controllability on the etch profile such as anisotropic etching than wet etching process and the results of lots of researches on the characterization of various plasmas or ion beams for semiconductor etching have been reported. Chlorine-based plasmas or chlorine ion beam have been often used to etch several semiconductor materials, in particular Si-based materials. We have studied the effect of He flow rate on the Si and SiO2 dry etching using chlorine-based plasma. Experiments were performed using reactive ion etching system. RF power was 300W. Cl2 gas flow rate was fixed at 58.6 sccm, and the He flow rate was varied from 0 to 120 sccm. Fig. 1 presents the etch depth of si layer versus the etching time at various He flow rate. In case of low He flow rate, the etch rate was measured to be negligible for both Si and SiO2. As the He flow increases over 30% of the total inlet gas flow, the plasma state becomes stable and the etch rate starts to increase. In high Ge flow rate (over 60%), the relation between the etch depth and the time was observed to be nearly linear. Fig. 2 presents the variation of the etch rate depending on the He flow rate. The etch rate increases linearly with He flow rate. The results of this preliminary study show that Cl2/He mixture plasma is good candidate for the controllable si dry etching.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Composites Research
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• v.25 no.4
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• pp.117-125
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• 2012

Warpage of the film insert molded (FIM) part is caused by an asymmetric residual stress distribution. Asymmetric residual stress and temperature distribution is generated by the retarded heat transfer in the perpendicular direction to the attached film surface. Since warpage was not prevented by controlling injection molding conditions, glass fiber (GF) filled composites were employed as substrates for film insert molding to minimize the warpage. Distribution of short GFs was evaluated by using micro-CT equipment. Proper models for micro mechanics, anisotropic thermal expansion coefficients, and closure approximation should be selected in order to calculate fiber orientation tensor and warpage of the FIM part with the composite substrate. After six kinds of micro mechanics models, three models of the thermal expansion coefficient and five models of the closure approximation had been considered, the Mori-Tanaka model, the Rosen and Hashin model, and the third orthotropic closure approximation were selected in this study. The numerically predicted results on fiber orientation tensor and warpage were in good agreement with experimental results and effects of GF reinforcement on warpage of the FIM composite specimen were identified by the numerical results.